Patents Examined by David A. Zarneka
  • Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations
    Patent number: 6791191
    Abstract: A device adapted to protect integrated circuits from reverse engineering comprising a part looking like a via connecting two metal layers, but in fact attached only to one metal layer and spaced from the other. Having such “trick” via would force a reverse engineer to think there is a connection where there is none. A method for fabricating such device.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: September 14, 2004
    Assignee: HRL Laboratories, LLC
    Inventors: Lap-Wai Chow, James P. Baukus, William M. Clark, Jr.
  • Semiconductor device and manufacturing the same
    Patent number: 6703261
    Abstract: A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: March 9, 2004
    Assignee: Hitachi, Ltd.
    Inventor: Mamoru Ito