Abstract: An adhesive composition for metal-clad laminates which comprises:(a) 100 parts by weight of a polyvinylbutyral having an average polymerization degree of from 500 to 3,000 and a degree of butyralization of at least 60 mol %,(b) from 10 to 200 parts by weight of an epoxidized polybutadiene per 100 parts by weight of the polyvinylbutyral, the epoxidized polybutadiene having a number average molecular weight of from 1,000 to 10,000 and an epoxy equivalent weight of from 200 to 2,000, and(c) from 1 to 10 parts by weight of a hardener for the epoxidized polybutadiene per 100 parts by weight of the epoxidized polybutadiene.
Type:
Grant
Filed:
November 29, 1989
Date of Patent:
November 19, 1991
Assignee:
Hitachi Chemical Co., Ltd.
Inventors:
Toshihisa Kumakura, Ken Nanaumi, Ryoichi Ikezawa, Hideki Eriguchi
Abstract: A novel thermoplastic resin composition is here disclosed which contains (I) 99 to 1% by weight of a polysulfone or polyether sulfone; (II) 1 to 99% by weight of an acrylonitrile-butadiene-styrene resin; (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resin (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of the polymer or copolymer being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m; and (IV) 0 to 150 parts of an inorganic filler.Furthermore, a method for preparing the aforesaid composition is also disclosed.