Patents Examined by David E. Graybiu
  • Process for encapsulating a semiconductor chip, leadframe and heatsink
    Patent number: 5384286
    Abstract: A method mold for producing a semiconductor device having a heat-sinking plate and a leadframe. The heat-sinking frame and leadframe are precisely positioned on a lower mold with cooperating positioning holes and pins with a space between the heat-sinking frame and the leadframe. After an upper mold is clamped to the lower mold, resin is injected into a cavity in the mold to encapsulate the leadframe to which a semiconductor chip is attached and the heat-sinking plate into one body.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: January 24, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Tatsuya Hirai