Abstract: A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

Abstract: A baby bottle holder having an enclosure into which the bottle is inserted. A curved surface of the holder permits rocking of the holder upon the bottle being emptied. A weight in the holder imparts rocking movement to the holder upon termination of nursing effort by the infant. An internal wall of the holder insulates the bottle as well as defines air passageways to ease bottle insertion and removal.