Abstract: A ball grid array socket with rows of electrical contacts that extend through holes in a plate. The arrangement of the holes and the electrical contacts provides an entry hole. The contacts are arranged with ends that are cupped to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted without any interfering structure. The plate is spring loaded is such a way that the plate is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening. This reduced entry opening is arranged and constructed such that with a ball contact insert therein electrical conductivity is provided between the ball contact and the electrical contact, and further where the cupped ends of the electrical contact retain the ball within the hole. The edges of the hole and the top of the cupped electrical contact are chamfered to mate with the curved sides of the ball contact.