Patents Examined by David Ostrewski
  • Heat sink fin assembly for cooling an LSI package
    Patent number: 5625229
    Abstract: A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and a heat dissipating member made of a thin metal sheet having convex and concave portions which are comprised of a repeated series of side wall portions, top portions, and bottom portions. The base plate and the heat dissipating member are integrated with each other by bonding.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: April 29, 1997
    Assignees: Sumitomo Metal Industries, Ltd., Sumitomo Precision Products, Co., Ltd.
    Inventors: Masayasu Kojima, Chihiro Hayashi, Tetsuo Abiko, Keiji Miki