Patents Examined by David Ostrowsi
  • Electrically conductive thermal interface
    Patent number: 5783862
    Abstract: A thermal interface 26 between a heat source (e.g., an IC die) 24 and a heat sink 28 comprises a metallic mesh (26a) filled with a thermally conductive semi-liquid substance (26b). The thermally conductive semi-liquid substance may comprise, e.g., silicone grease or paraffin. The wire mesh may comprise silver, copper and/or gold cloth.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: July 21, 1998
    Assignee: Hewlett-Packard Co.
    Inventor: Jeffrey L. Deeney