Patents Examined by David Rowley
  • Epoxy resin compositions for sealing semiconductor devices
    Patent number: 5041474
    Abstract: Disclosed are epoxy resin compositions comprising essentially (A) multi-functional epoxy resins, (B) imide-modified silicone compounds, (C) phenolic novolaks having more than 2 OH groups, and (D) inorganic fillers. When cured, these compositions have excellent processability and lower internal stress as compared to a similar composition without the imide-modified silicone compounds. These compositions are useful for sealing semiconductor devices or other molding applications.
    Type: Grant
    Filed: October 10, 1989
    Date of Patent: August 20, 1991
    Assignee: Lucky Ltd.
    Inventors: Myung J. Kim, Ju O. Song, Jung O. Park
  • Hot-melt adhesive composition
    Patent number: 5021257
    Abstract: The present invention is directed to a hot-melt adhesive containing at least one propylene/1-hexane copolymer. The adhesive contains an amount of a low viscosity, substantially crystalline wax, having a melting point of about 90.degree. C. to about 125.degree. C., sufficient to improve the elastic delamination resistance of the adhesive. The adhesive are particularly useful in disposable diaper construction.
    Type: Grant
    Filed: October 2, 1989
    Date of Patent: June 4, 1991
    Assignee: Eastman Kodak Company
    Inventors: Bruce W. Foster, Clyde N. Clubb, Richard K. Stuart, Jr.