Abstract: A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.

Abstract: In a method for coupling a PCB sheet, if a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet is removed from continuously arranged circuit patterns of a first PCB sheet. After removal of the defective circuit pattern sheet, the first PCB sheet is position-located by a position locator. Then, the space which is formed by removing, the defective circuit pattern sheet is filled with a second PCB sheet on which a good quality circuit pattern is printed. Then, the first PCB sheet and the second PCB sheet are coupled together by using an adhesive.