Patents Examined by David W. Schumaker
  • Patent number: 4900355
    Abstract: A dry method for making high-purity metal powder through quenching, by melting metal in a melting vessel with high-frequency induction in vacuo or in an inert gas atmosphere, lowering the melting vessel to a jetting position where a rotary cooling board is disposed along outer periphery of the melting vessel, centrifugally jetting the molten metal from the melting vessel by rotating the melting vessel in a direction while rotating the rotary cooling board in the opposite direction, and simultaneously quenching and splitting centrifugally jetted molten particles of the metal by causing the molten particles to collide with the rotary cooling board.
    Type: Grant
    Filed: January 19, 1989
    Date of Patent: February 13, 1990
    Assignee: Miyagi National College of Technology
    Inventors: Koichi Tanno, Masaaki Yagi
  • Patent number: 4897316
    Abstract: The invention relates to a plated steel sheet for cans which must have a good outer appearance for printing and high image clarity, and is a method of forming dry-plated layer 2 on the surface of steel sheet 1 having a central surface roughness of 0.10 .mu.m or less, and a plated steel sheet for cans formed by the method.
    Type: Grant
    Filed: December 7, 1988
    Date of Patent: January 30, 1990
    Assignee: NKK Corporation
    Inventors: Hiroshi Kagechika, Tadahiko Mishima, Yoshinori Yomura, Hiroshi Ishikawa, Naoyuki Oniwa, Yoshihiko Yasue
  • Patent number: 4895771
    Abstract: A surface for providing an electrically conductive surface coating on an electrical contact body. The process resulting in such a coating comprises the steps of depositing upon the body surface in sequence, (a) a nickel layer, (b) a first gold layer, (c) a palladium/nickel alloy layer which may be an alloy containing nickel up to a proportion of 50% by weight, and (d) a second gold layer. All the layers may be deposited by an electrodeposition process.The resulting surface coating has excellent corrosion and wear resistance properties.
    Type: Grant
    Filed: June 14, 1988
    Date of Patent: January 23, 1990
    Assignee: AB Electronic Components Limited
    Inventors: John W. Souter, Michael C. Nottingham
  • Patent number: 4894293
    Abstract: A circuit system has a semiconductor device mounted on a substrate which includes a composite metal material comprising a plurality of discrete elements of ferrous metal material such as an alloy of 36 percent nickel and the balance iron having a relatively low coefficient of thermal expansion, the discrete elements being copper-coated by electroless copper plating or the like and being pressed together and heated for sintering or diffusion-bonding the copper coatings together to form a continuous copper matrix having the discrete elements secured in dispersed relation therein for providing the composite metal material with a coefficient of thermal expansion relatively much lower than that of the copper material, the heating of the coated particles for diffusion bonding thereof being regulated for forming the continuous copper matrix while leaving the copper material of the matrix substantially free of nickel, ferrous or other constituents diffused therein from the discrete elements for providing the composit
    Type: Grant
    Filed: March 10, 1988
    Date of Patent: January 16, 1990
    Assignee: Texas Instruments Incorporated
    Inventors: Henry F. Breit, Karen A. Auguston, Joseph M. Gondusky
  • Patent number: 4892582
    Abstract: A dental-filling material with hardnesses exceeding 100 HV for gold-condensation is prepared from a gold-alloy powder of which the alloying components are metals resulting in hardening gold alloys and which are simultaneously soluble in nitric acid. A rough, pure gold layer on the surface of the powder particles is obtained by treatment with nitric acid.
    Type: Grant
    Filed: January 24, 1989
    Date of Patent: January 9, 1990
    Assignee: Degussa Aktiengesellschaft
    Inventors: Walter Diehl, Hans-Martin Ringelstein
  • Patent number: 4887492
    Abstract: Lead with a low alpha particle emission is produced by selecting an orebody wherein lead mineral is present in a coarsely disseminated form and substantially free of impurities. The ore is selected from a host rock that is relatively low in alpha emitters, such as a carbonate rock. The ore is mined and is milled such that the lead mineral can be separated from the host rock and any other minerals. The ground ore may be screened into one or more fractions having a narrow range of particle sizes. Each fraction is formed into a fluid suspension, and each suspension is subjected to gravity separation to remove the host rock and any other minerals which substantially contain the alpha particle-emitting substances, and to recover the lead mineral as a concentrate with a low alpha count. The lead concentrate is subjected to a suitable reduction operation that may include a conversion of the concentrate into a reducible form, without the introduction of alpha emitters, for the recovery of a low alpha lead.
    Type: Grant
    Filed: August 29, 1988
    Date of Patent: December 19, 1989
    Assignee: Cominco Electronic Materials Inc.
    Inventors: John A. Dunlop, Edward F. G. Milner, Robert W. Smyth, Gerald W. Toop
  • Patent number: 4885214
    Abstract: A composite material has portions of a first material such as a metal or ceramic having coatings of a metal material thereon disposed in a metal matrix material and having a diffusion-bonds between the coating and matrix materials securing the portions of the first material at selected locations in the composite material.
    Type: Grant
    Filed: March 10, 1988
    Date of Patent: December 5, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: George Trenkler, Richard G. Delagi
  • Patent number: 4885043
    Abstract: A method for the selective decarburization of an iron based substrate, such as a silicon iron substrate, wherein the carbon present in the substrate is extracted by the selective deposition of a titanium nitride layer or film on the substrate.
    Type: Grant
    Filed: March 1, 1988
    Date of Patent: December 5, 1989
    Assignee: International Business Machines Corporation
    Inventor: Mohammed Y. Al-Jaroudi
  • Patent number: 4879094
    Abstract: An alloy for the manufacture of cast components, for example taps, water meters, pipe couplings and parts thereof, intended for use in potable water supply installations comprises 1.5 to 7 wt % bismuth, from 5 to 15 wt % zinc, from 1 to 12 wt % tin, the balance apart from any impurities and any minor amounts of elemental additives being copper.
    Type: Grant
    Filed: October 17, 1988
    Date of Patent: November 7, 1989
    Assignee: IMI Yorkshire Fittings Limited
    Inventor: William Rushton
  • Patent number: 4876065
    Abstract: Disclosed in an improvement in a known Ni-Cr-Fe alloy.The alloy of the invention contains 30 to 32% nickel; 26 to 28% chromium; 0.5 to 1.5% copper; 6 to 7% molybdenum; up to 2% manganese; up to 1.0% silicon; up to 0.2% aluminum; up to 0.03% carbon; 0.10 to 0.25% nitrogen; balance iron and usual impurities.The alloy of the invention has increased pitting corrosion potential and critical crevice corrosion and pitting corrosion temperatures whereas the resistance of the alloy to commercially pure phosphoric acid has not been decreased.
    Type: Grant
    Filed: May 19, 1988
    Date of Patent: October 24, 1989
    Assignee: VDM Nickel-Technologie Aktiengesellschaft
    Inventors: Manfred Rockel, Ernst Wallis, Michael Kohler, Ulrich Heubner, Rolf Kirchheiner
  • Patent number: 4874438
    Abstract: An intermetallic compound semiconductor thin film comprises a single crystalline deposition thin film made of a III-V group intermetallic compound having a stoichiometry composition ratio of 1:1. When forming the III-V group semiconductor thin film by an evaporation method, a substrate temperature is initially maintained at a high level while the evaporation source temperature is gradually raised, and when the intermetallic composition of the III-V group begins to deposit on the substrate, the substrate temperature is lowered while the evaporation source temperature is maintained at the same level as existed at the time when the intermetallic compound is deposited, and the deposition time is controlled.
    Type: Grant
    Filed: November 30, 1987
    Date of Patent: October 17, 1989
    Assignee: Toyo Communication Equipment Co., Ltd.
    Inventors: Masahide Oshita, Masaaki Isai, Toshiaki Fukunaka
  • Patent number: 4872927
    Abstract: A method for improving the microstructure of wrought titanium alloy material which comprises the steps of hydrogenating the material at a temperature near or above the titanium-hydrogen eutectoid of 815.degree. C. (about 780.degree. to 1020.degree. C.) to a hydrogen level of about 0.50 to 1.50 weight percent, cooling the thus-hydrogenated material to room temperature, heating the thus-cooled, hydrogenated material to a temperature of about 650.degree. to 750.degree. C., applying a vacuum to dehydrogenate the material and cooling the dehydrogenated material to room temperature at a controlled rate.
    Type: Grant
    Filed: December 4, 1987
    Date of Patent: October 10, 1989
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Daniel Eylon, Francis H. Froes, Charles F. Yolton
  • Patent number: 4873054
    Abstract: An improved aluminum-titanium master alloy is provided. Such alloy contains a small be effective amount of, in weight percent, any two or more elements selected from the group consisting of carbon about 0.003 up to 0.1, sulfur about 0.03 up to 2, phosphorus about 0.03 up to 2, nitrogen about 0.03 up to 2, and boron about 0.01 up to 0.4, titanium 2 to 15, and the balance aluminum. After melting, the master alloy is superheated to about 1200.degree. C.-1300.degree. C. to put the element into solution, then the alloy is cast in a workable form. The master alloy in final form is substantially free of carbides, sulfides, phosphides, nitrides, or borides greater than about 5 microns in diameter. The alloy of this invention is used to refine aluminum products that may be rolled into thin sheet, foil, or fine wire and the like. Such grain refined products are also substantially free of carbides, sulfides, phosphides, nitrides, or borides.
    Type: Grant
    Filed: March 7, 1988
    Date of Patent: October 10, 1989
    Assignee: KB Alloys, Inc.
    Inventor: Geoffrey K. Sigworth
  • Patent number: 4873055
    Abstract: This invention relates to alloys resistant to corrosion, and especially resistant to corrosion caused by contact with hot sulfuric acid of over 98% concentration.The alloys of the invention consist essentially by weight percentages of from about 19% to about 30% by weight Ni, from about 19% to about 27% by weight Cr, from about 0.3% to about 1.0% by weight Mo, from about 2.7% to 4.5% by weight Cu, from about 2.7% to about 4.7% by weight Mn, from about 2.45% to about 5.5% by weight Si, from about up to about 0.08% C by weight, and the balance essentially iron. The alloys may optionally contain up to 0.7% Cb partially replaced by up to 1% Ta, up to 0.6% W, up to 0.12% N and up to 0.8% Co, all by weight.
    Type: Grant
    Filed: December 20, 1988
    Date of Patent: October 10, 1989
    Assignee: Carondelet Foundry Company
    Inventor: John H. Culling
  • Patent number: 4863508
    Abstract: Disclosed is a process for the preparation of chalcogenide alloys, particularly selenium tellurium alloys, of high purify wherein there is provided a solution mixture of the aforementioned compounds; and thereafter this mixture is subjected to a simultaneous oxidation reaction.
    Type: Grant
    Filed: October 1, 1987
    Date of Patent: September 5, 1989
    Assignee: Xerox Corporation
    Inventors: Santokh S. Badesha, Martin A. Abkowitz
  • Patent number: 4857233
    Abstract: A nickel particle plating system in which a multiplicity of minute nickel spheres are provided with a heavy copper coating and then a comparatively thin silver coating. The copper coating is at least about 20 percent by weight of the shpere, and the silver coating has a maximum thickness of about 15 percent of the sphere diameter. The coated spheres are deposited in a nonconductive matrix to form an electroconductive body in which the spheres may be placed along conductive paths.
    Type: Grant
    Filed: May 26, 1988
    Date of Patent: August 15, 1989
    Assignee: Potters Industries, Inc.
    Inventors: Robert J. Teichmann, James F. Walther, Mulhall Robert C.
  • Patent number: 4851297
    Abstract: Particles of silicon and a p or n carrier substance which are in spherical or spheroidal form, and suitable for use in the preparation of doped semiconductor devices, can be prepared by a fluidized bed technique for chemical vapor deposition of a carrier substance (B, P, As or Sb). The prepared products have a kernel of high purity polysilicon and a layer of silicon/dopant alloy upon the kernel. Optionally, the particles have a thin outer layer of silicon.
    Type: Grant
    Filed: June 27, 1988
    Date of Patent: July 25, 1989
    Assignee: Ethyl Corporation
    Inventors: Robert H. Allen, Jameel Ibrahim
  • Patent number: 4848514
    Abstract: The present invention relates to a novel sound attenuating system. More particularly, the invention relates to a simpler, lighter, and more effective noise attenuating laminate which is made up of five specific layers of material. The laminate includes a duct liner, a moisture barrier, a fire barrier, acoustic attenuating material, and a solid backing sheet. The laminate is readily inserted into various sections of a jet engine compartment in order to attenuate the sound produced by the jet engine. Hollow rivets are used to conduct acoustical energy to the noise attenuating laminate. This novel means for conducting the acoustical energy to the laminate of the jet engine compartment allows for an improved anti-icing system, for more efficient jet engine operation, and for more efficient dissipation of acoustic energy.
    Type: Grant
    Filed: October 6, 1987
    Date of Patent: July 18, 1989
    Assignee: UAS Support, Inc.
    Inventor: Stephen Snyder
  • Patent number: 4847167
    Abstract: Improved fiber-reinforced metallic composite material comprises as a matrix a metal alloy having a lower melting point than magnesium and being chemically inactive (e.g. zinc, cadmium, indium, tin, thallium, lead, bismuth and polonium) or and as a reinforcement inorganic fibers of 15 to 70% by volume, in which the metal alloy composing the matrix contains 0.01 to 10% by weight of one or more metals of group IA or group IIA (except beryllium) in the periodic table (e.g. lithium, sodium, potassium, rubidium, cesium, francium, magnesium, calcium, strontium, barium and radium). The composite material has improved mechanical strength, and is useful as a material for various parts and apparatuses in various industrial fields such as aerospace, atomic power and automobile industries.
    Type: Grant
    Filed: July 14, 1988
    Date of Patent: July 11, 1989
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hideo Maeda, Ken-ichi Nishio
  • Patent number: 4842954
    Abstract: A blank for the production of a catalyst carrier body includes spirally-wound alternating layers of smooth and corrugated metal sheets. At least one of said corrugated sheets forms an innermost layer defining a coil-free central zone surrounded by said innermost layer. A jacket is added around the blank to form a catalyst carrier body. The sheets are wound on a toothed roller.
    Type: Grant
    Filed: November 20, 1987
    Date of Patent: June 27, 1989
    Assignee: Emitec Gesellschaft fur Emissionstechnologie mbH
    Inventors: Theodor Cyron, Manfred Vierkotter, Rolf Hetzelberger