Patents Examined by David Yu
  • Patent number: 10283515
    Abstract: A semiconductor memory device includes a plurality of electrode layers stacked in a first direction; a semiconductor layer of a columnar shape extending through the electrode layers in the first direction; and a plurality of floating gates provided between the electrode layers and the semiconductor layer respectively. The floating gates surround the semiconductor layer. A gate length in a first direction of a floating gate positioned between one of the electrode layers and the semiconductor layer is longer than a layer thickness in the first direction of the one of the electrode layers. A ratio of the layer thickness of the one of the electrode layers to the gate length has a positive correlation with an outer diameter of a first portion of the semiconductor layer surrounded by the floating gate in a second direction from the semiconductor layer toward the one of the electrode layers.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: May 7, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Naoki Yasuda
  • Patent number: 6762070
    Abstract: A cap layer of GaN about 140 Å thick and a p-type clad layer of Mg-doped p-type AlxGa1-xN (x=0.12) about 200 Å thick are formed successively on an MQW active layer about 230 Å thick. A p-type contact layer of Mg-doped p-type AlyGa1-yN (y=0.05) about 600 Å thick is further formed thereon. These composition ratios x and y are selected to satisfy the expression “0.03≦0.3x≦y≦0.5x≦0.08”, so that the composition of the p-type contact layer becomes close to the composition of the p-type clad layer.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: July 13, 2004
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Naoki Kaneyama, Makoto Asai, Katsuhisa Sawazaki
  • Patent number: 6249049
    Abstract: A ceramic package type electronic part for accommodating an electronic device includes a ceramic package body, an electrode, and a conductive adhesive. The electrode is disposed for the ceramic package body and is to be bonded to the electronic device. The conductive adhesive bonds the electronic device and the electrode to each other. The conductive adhesive is provided to be extended to a specific surface portion of a surface portion of the ceramic package body, from a bonding portion of the electronic device and the electrode.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: June 19, 2001
    Assignee: NEC Corporation
    Inventors: Hiroshi Kamada, Naoharu Fukuhara, Katuya Terai, Hiroshi Katoh