Abstract: An integrated bus bar structure plate in which a plurality of bus bars are arranged on substantially the one plain face to form an electric power circuit, wherein after the bus bar structure plate having a whole shape in which a plurality of types of electric power circuits are formed by selecting any of the connection parts of the bus bars is separated is adhered to the control circuit board whereby, for example, a desired electric power circuit is formed among the connection parts of bus bars.

Abstract: A circuit board assembly has an attached support assembly. The support assembly includes a support, such as a handle, and a lip substantially perpendicular to the support. The lip strengthens the support such that, as a cable exerts a load on the support assembly, the lip limits deflection of the support relative to the circuit board assembly. In the case where a cable having a cable connector attaches to a port of the circuit board assembly, the support assembly minimizes displacement of the cable connector relative to the port, thereby minimizing the potential for a break in electrical connections formed between the connector and the port. The support assembly also, in such a case, minimizes strain on a wire bundle and over-molded case forming the cable, thereby limiting damage to the over-molded case and disconnection of the wire bundle to the connector that leads to losses in electrical connections formed between the circuit board assembly and computer devices connected to the circuit board assembly.

Abstract: Disclosed is a shielding connector 20 having inner conductor terminals 30 to which terminal parts of core wires 11 of a shielded cable 10, a dielectric body 50 for receiving the inner conductor terminals 30, and a shielding shell 60 installed around the dielectric body 50. In the shielding connector, an insulating plate 56 for suppressing an impedance variation caused by a variation of a cross sectional configuration of a signal transmission line, which results from the exposure of the terminal parts of the core wires 11, is interposed between the terminal parts of the core wires 11 connected to the inner conductor terminals 30 and a inner bottom surface of the shielding shell 60 put around the dielectric body 50.

Abstract: The invention relates to a thermal compensation device having a thermal compensation cell for a hydraulic support cell that has a working chamber and a compensation chamber. According to the invention, each of the chambers of the support cell is connected to a chamber in the thermal compensation cell. Two tightly interconnected pistons with identical working surfaces press on both chambers in the thermal compensation cell. For this purpose, a lateral support system with a reversing lever having at least one hydraulic cell, which has a work cell and a compensation cell, is used. According to the invention, the rotating axis of the reversing lever is arranged at least in one axis running through a hydraulic cell. Each work chamber and the compensation chamber of the hydraulic cell lie opposite each other.

Abstract: An electrical housing assembly is shown which is adapted to be affixed behind a finished surface such as a wall or ceiling and is designed to receive an electrical device which will be exposed outwardly from the finished surface wherein the housing assembly is comprised of an electrical box which has an open side to permit an electrician to easily inspect or conduct work on the wiring contained within the housing. The electrical box includes punch-outs which permit external wiring to be inserted within the box opening. A frame-shaped flat adaptor which is designed to affix an electrical device thereto is attached to the electrical box by a hinge assembly which permits the adaptor to remain coupled to the electrical box in both a closed position and an open position. A fastener, such as a snap-on clip, secures the adaptor to the electrical box in the closed position when desired by the electrician, but is also easily detachable.

Abstract: The present invention proposes a method for fabricating a high speed and high density nonvolatile memory cell. First, a semiconductor substrate with defined field oxide and active region is prepared. A stacked silicon oxide/silicon nitride layer is deposited on the substrate and then the tunnel oxide region is defined by a standard photolithography process followed by an anisotropic etching. A high temperature steam oxidation process is used to grow a thick thermal oxide on the non-tunnel region. After removing the masking silicon nitride layer, the n+ impurity ions is implanted to form the source and drain, and a thermal annealing is performed to recover the implantation damage and to drive in the doped ions. Next, the pad oxide film is etched back and an ultra-thin undoped .alpha.-Si, or HSG-Si, film is deposited. A thermal oxidation process is carried out to convert the undoped .alpha.-Si or HSG-Si into textured tunnel oxide.

Abstract: A label dispenser for stripping adhesive-backed labels from a dispensing strip which has a stripping edge extending at an acute angle with respect to a feed path. The dispensing strip passes from the stripping edge crosswise beneath the feed path after label removal has been performed.