Patents Examined by Delmar R Forde
  • Patent number: 9754892
    Abstract: Disclosed herein is a stacked semiconductor package in which semiconductor chips having various sizes are stacked. In accordance with one aspect of the present disclosure, a stacked semiconductor package includes a first semiconductor chip structure provided with a first semiconductor chip, a first mold layer surrounding the first semiconductor chip, and a first penetration electrode passing through the first mold layer and electrically connected to the first semiconductor chip, and a second semiconductor chip structure vertically stacked on the first semiconductor chip structure and provided with a second semiconductor chip and a second penetration electrode electrically connected to the first penetration electrode, wherein the first semiconductor chip structure may have the same size as the second semiconductor chip structure.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: September 5, 2017
    Assignee: NEPES CO., LTD.
    Inventors: Yong-Tae Kwon, Jun-Kyu Lee
  • Patent number: 9742149
    Abstract: In the method for controlling a tunable wavelength laser, information designating an oscillation wavelength is inputted. A driving condition for causing laser oscillation at a first wavelength is acquired from a memory. A control value of wavelength characteristics of the etalon and a difference between the first wavelength and a second wavelength are referred to, and a control value of wavelength characteristics of the etalon for causing laser oscillation at the second wavelength is calculated. The control value of wavelength characteristics of the etalon are assigned to the tunable wavelength laser, and a wavelength is controlled so that a wavelength sensing result becomes a first target value. Information indicating a wavelength shift amount from the designated oscillation wavelength is inputted. The wavelength sensing result is calculated as a second target value. The wavelength is controlled so that the wavelength sensing result becomes the second target value.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: August 22, 2017
    Assignee: Sumitomo Electric Device Innovations, Inc.
    Inventors: Mitsuyoshi Miyata, Masao Shibata, Hirokazu Tanaka
  • Patent number: 9052449
    Abstract: The light emitting device includes an active layer formed on a semiconductor substrate for emitting light, a semiconductor layer of a first conductivity type electrically connected to one end of the active layer, a semiconductor layer of a second conductivity type electrically connected to the other end of the active layer, first and second electrodes, a feedback mechanism for laser oscillation, and a waveguide for guiding the light emitted from the active layer, in which the active layer is made of a semiconductor having an affinity with a silicon CMOS process, and the semiconductor layer of the first conductivity type and the semiconductor layer of the second conductivity type, and the waveguide are each made of silicon as a part of the semiconductor substrate.
    Type: Grant
    Filed: November 24, 2013
    Date of Patent: June 9, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Misuzu Sagawa, Katsuya Oda, Kazuki Tani
  • Patent number: 8774243
    Abstract: Provided are a dual mode semiconductor laser and a terahertz wave apparatus using the same. The dual mode semiconductor laser includes a distributed feedback laser structure section including a first diffraction grating on a substrate and a distributed Bragg reflector laser structure section including a second diffraction grating on the substrate. A first wavelength oscillated by the distributed feedback laser structure section and a second wavelength oscillated by the distributed Bragg reflector laser structure section are different from each other, and the distributed feedback laser structure section and the distributed Bragg reflector laser structure section share the same gain medium with each other.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: July 8, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Namje Kim, Kyung Hyun Park, Young Ahn Leem, Chul-Wook Lee, Sang-Pil Han, Dong-Hun Lee, Min Yong Jeon