Abstract: A differential magnetic field sensor that enables operation that is independent of sensor-to-target orientation is presented. The differential magnetic field sensor is provided with at least two differential channels. Each differential channel includes a pair of magnetic field sensing elements and has a respective sensing axis defined by those magnetic field sensing elements. The sensing axes are not aligned with respect to each other. One sensing axis is positioned relative to a reference axis of a target profile to define an orientation angle between the sensing axis and the reference axis. The differential magnetic field sensor includes circuitry to produce differential signals associated with the differential channels and use those differential signals to produce a single differential signal having an amplitude that is independent of the orientation angle.

Abstract: A semiconductor die includes a substrate having a topside including active circuitry having an array of bond pads thereon separated by gaps including a minimum gap. At least a portion of the array of bond pads are connected to nodes in the active circuitry. At least one wire bond alignment sensing structure includes a first bond pad selected from the array of bond pads, and a guard element positioned along at least a portion of the first bond pad. The guard element is spaced apart by a distance shorter than the minimum gap from the first bond pad.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: An apparatus for measuring electrical parameters for an electrical system measures a first and second parameters of the electrical system between connections to the electrical system. A processor determines a third electrical parameter of the electrical system as a function of the first parameter and the second parameter.

Abstract: Embodiments relate to omnipolar magnetic field switches. In one embodiment, omnipolar behavior is generated in a Hall effect switch by extracting the modulus of the electric signal generated by the Hall transducer and feeding it to a single high-precision comparator, without any sampling or additional processing steps. The modulus extraction and threshold evaluation can be done in parallel.

Abstract: An apparatus includes a plurality of die areas having integrated circuit (IC) die each having circuit elements for performing a circuit function, and scribe line areas between the die areas. At least one test module is formed in the scribe line areas. The test module includes a reference layout that includes at least one active reference MOS transistor that has a reference spacing value for each of a plurality of context dependent effect parameters, and a plurality of variant layouts. Each variant layout provides at least one active variant MOS transistor that provides a variation with respect to the reference spacing values for at least one of the plurality of context dependent effect parameters.

Abstract: Methods and apparatus for detecting an electromagnetic wave are provided. A device for use in an electromagnetic wave detector includes a first device layer having a first contact, a second device layer having a second contact, and a tunnel barrier layer and a resonating magnetic layer formed between the first and second device layers. The resonating magnetic layer produces a spin current responsive to an electromagnetic wave that extends into the first and second device layers. A charge differential present between the first and second contacts is dependent on the spin current.

Abstract: An integrated circuit (IC) die has an on-die parametric test module. A semiconductor substrate has die area, and a functional IC formed on an IC portion of the die area including a plurality of circuit elements configured for performing a circuit function. The on-die parametric test module is formed on the semiconductor substrate in a portion of the die area different from the IC portion. The on-die parametric test module includes a reference layout that provides at least one active reference MOS transistor, wherein the active reference MOS transistor has a reference spacing value for each of a plurality of context dependent effect parameters. A plurality of different variant layouts are included on the on-die parametric test module. Each variant layout provides at least one active variant MOS transistor that provides a variation with respect to the reference spacing value for at least one of the context dependent effect parameters.

Abstract: A magnetic sensor array including a plurality of magnetic sensors detects a phase regarding a magnetic pole of a magnetic pole array including magnetic poles of N and S arranged alternately. A pitch identification unit detects a pitch number of the magnetic pole currently being detected by the magnetic sensor array, in the magnetic pole array.

Abstract: A sensor for monitoring external loads acting on a pin assembly includes a pin having an axial interior bore defined therein and having a length defined from a first end to an opposed second end thereof. A core pin is mounted axially within the interior bore of the pin spaced radially inwardly from the interior bore for relative displacement with respect to the pin. A capacitor is provided having an inner capacitor plate mounted to the core pin, and an outer capacitor plate mounted to the pin, such that relative displacement of the core and the pin due to external loading on the pin results in relative displacement of the inner and outer capacitor plates. The capacitor is configured and adapted to be connected to an electrical circuit to produce signals indicative of external loading on the pin based on relative displacement of the inner and outer capacitor plates.

Abstract: A test bracket for testing a circuit board includes a base, two connection pieces, and a supporting member for supporting the circuit board. The base includes a board and two posts extending up from the board. The supporting member includes two poles and a number of ribs slidably connected between the poles. First ends of the connection pieces are respectively detachably connected to the posts of the base, and second ends of the connection pieces opposite to the first ends are respectively pivotably connected to the poles.

Abstract: A test fixture for testing loaded printed circuit boards having a plurality of test points having a probe plate including an array of widely spaced high force spring test probes in compliant contact with solid translator pins located in a translator fixture removably positioned over the probe plate. The test fixture includes optimization software wherein translation of the test signals are optimized by providing the shortest interconnect distance in the x-y plane between the test points on the printed circuit board and the test probes in the probe plate. The fixture further includes an unpowered opens device for testing components on the loaded printed circuit board.

Abstract: The helium sensor comprises a housing that encloses a detection chamber. A side of the housing is closed by a permeable wall that is selective for helium. In the detection chamber, there is located an ion getter pump comprising an anode, a cathode and a magnetic field. The cathode, or a cathode leg is made of beryllium. Beryllium has a low atomic mass, whereby the likewise light-weight helium ions can be better incorporated into the cathode material.

Abstract: A system for determining an amount of power supplied from a power amplifier may include a power amplification circuit having a characteristic thermal resistance, a first temperature sensor for sensing a first temperature associated with the power amplification circuit when the power amplification circuit is receiving power from the power source, a second temperature sensor for sensing a second temperature associated with an environment occupied by the power amplification circuit, and a processor coupled with the first temperature sensor and the second temperature sensor for determining an amount of power dissipation utilizing (A) a temperature difference determined utilizing the first temperature and the second temperature and (B) the characteristic thermal resistance of the power amplification circuit.

Abstract: Power transmission monitoring systems includes rotation speed sensors mounted to hubs of a power transmission pulley. A sensor comprises a rotation sensing device, and a controller receiving rotation data therefrom and determining rotation speed of the pulley. A transmitter transmits rotational speed of the pulley to a receiver, which may include or be connected to a device that compares the rotational speed to rotational speed in transmissions from other sensors to determine slip in the power transmission system. The rotation speed sensing device may be an accelerometer, or a gravitational torque harvester. A harvester might include a rotor body rotating with the pulley and mounting induction coils, and a gravitational torque stator mounting an induction magnet and including an air vane damper maintaining the stator stationary with respect to the rotor, through air resistance. The transmissions may be employed to monitor, maintain and repair the power transmissions system.

Abstract: A system and method of testing High Brightness LED (HBLED) is provided, and more particularly, a system and method of Controlled Energy Testing of HBLED with improved accuracy and repeatability is provided.

Abstract: An embodiment of the present invention relates to a method for detection of short circuit conditions in an LED array having one or more LED strings, each of which includes one or more LED devices. The method includes determining a minimum voltage that is the lowest of voltages associated with cathode terminals of the one or more LED strings. The method also includes determining if said minimum voltage is between a lower limit voltage and an upper voltage limit. If said minimum voltage is between the lower limit voltage and the upper voltage limit, then a result of a short circuit testing can be considered valid. Here, the short circuit testing includes comparing a sampled voltage associated with a cathode voltage of one of the LED strings with a short-circuit reference voltage.

Abstract: A signal generation circuit includes: a first signal source that generates a first signal; and a variable rate frequency divider section that generates a variable rate frequency-divided signal in which a first frequency-divided signal obtained by frequency-dividing the first signal by a first frequency dividing ratio and a second frequency-divided signal obtained by frequency-dividing the first signal by a second frequency dividing ratio temporally alternately appear in a specified mixing ratio.

Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.