Abstract: A grinding product and a method of making same. The grinding product comprises a woven or knitted cloth of multifilament threads (1) whose fibers (2) form projecting loops (3), and separate agglomerates (4) of grinding material applied to the loops. During the grinding, different sides of the agglomerates (4) come into contact with the surface to be ground, which prolongs the service life of the grinding product. The agglomerates also form a gap between the cloth and the surface to be ground, through which gap the grinding dust can be removed.

Abstract: A cleaning and polishing assembly having a compressible main body with a releasable attachment material on one face and a fibrous working surface on its other face. The fibrous working surface is composed of fibers having a trilobal cross-section. The cleaning and polishing pad can be mounted on a power drive tool, or in a hand-actuated embodiment, can be mounted to a gripping pad specially adapted for hand use.

Abstract: A semiconductor wafer dicing saw is controlled by monitoring blade exposure from a flange holding the blade during the wafer dicing process. As the wafer is cut and separated into discrete electronic chips, the dicing blade wears. As the blade is brought closer and closer toward the wafer during cutting, the blade exposure is continuously being reduced. The small dimensions, coolant flow, and close tolerances typical in the wafer dicing process, do not permit visual inspection. Excess blade wear and thus reduced exposure or flange clearance between the blade cutting edge and flange edge will cause damage to the wafer and blade by restricting coolant flow or by contact of the flange with the wafer.

Abstract: A process of conditioning a polishing pad used in chemical mechanical polishing of an integrated circuit and having a glazed layer is described. The process includes introducing a conditioning reagent including at least one of hydrofluoric acid, buffered oxide etch composition and potassium hydroxide on the polishing pad to dissolve at least a portion of the glazed layer; and abrading the glazed layer and disloding at least some particles from the glazed layer.