Patents Examined by Dewayne L. Rutledge
  • Patent number: 4746583
    Abstract: A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
    Type: Grant
    Filed: November 21, 1986
    Date of Patent: May 24, 1988
    Assignee: Indium Corporation
    Inventor: Richard J. Falanga
  • Patent number: 4427463
    Abstract: The temperature of hot-rolled wire is controlled by passing the wire through a primary coil and a secondary coil continuously while energizing the primary coil with a high frequency alternating current (preferably 100 kHz) so that a temperature-control voltage is induced in the secondary coil. The secondary coil is connected to a comparator receiving a setpoint signal representing the desired temperature and the error signal from the comparator is fed via a temperature controller to the coolant control valve of the cooling stretch.
    Type: Grant
    Filed: June 18, 1982
    Date of Patent: January 24, 1984
    Assignee: Fried. Krupp Gesellschaft mit beschrankter Haftung
    Inventor: Klaus Spies