Abstract: A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
Abstract: The temperature of hot-rolled wire is controlled by passing the wire through a primary coil and a secondary coil continuously while energizing the primary coil with a high frequency alternating current (preferably 100 kHz) so that a temperature-control voltage is induced in the secondary coil. The secondary coil is connected to a comparator receiving a setpoint signal representing the desired temperature and the error signal from the comparator is fed via a temperature controller to the coolant control valve of the cooling stretch.
Type:
Grant
Filed:
June 18, 1982
Date of Patent:
January 24, 1984
Assignee:
Fried. Krupp Gesellschaft mit beschrankter Haftung