Abstract: A multi-level piezoelectric actuator is manufactured using wafer level processing. Two PZT wafers are formed and separately metallized for electrodes. The metallization on the second wafer is patterned, and holes that will become electrical vias are formed in the second wafer. The wafers are then stacked and sintered, then the devices are poled as a group and then singulated to form nearly complete individual PZT actuators. Conductive epoxy is added into the holes at the product placement step in order to both adhere the actuator within its environment and to complete the electrical via thus completing the device. Alternatively: the first wafer is metallized; then the second wafer having holes therethrough but no metallization is stacked and sintered to the first wafer; and patterned metallization is applied to the second wafer to both form electrodes and to complete the vias. The devices are then poled as a group, and singulated.

Abstract: A bifilar winding system for the manufacture of poloidal field superconducting magnets for nuclear fusion includes two superconducting coil winding production lines which are symmetrically arranged, a dropping fixture, a rotary platform and a winding mold, and an automatic control system. Each of the two winding production lines includes a conductor unwinding device, a straightener, an ultrasonic cleaning machine, a sandblasting and cleaning machine, a bending machine, an inter-turn insulation taping machine. During the winding of a coil, a superconducting conductor is unwound by the conductor unwinding device under the control of the automatic control system, then straightened, ultrasonically cleaned, sandblasted and cleaned, and bent into a desired radius, then wrapped with multiple layers of insulating tape by the inter-turn insulation taping machine, and finally fixed, by the dropping fixture, precisely on the rotary platform at a correct position within a profile of the winding mold.

Abstract: A method for producing a liquid transport apparatus is disclosed. The liquid transport apparatus includes a pressure chamber plate, a ceramics layer formed on a surface of the pressure chamber plate, a piezoelectric layer formed on the ceramics layer, and an electrode formed on the piezoelectric layer. The ceramics layer is formed by heating an insulating ceramic material at a temperature lower than an annealing temperature of the piezoelectric layer. Accordingly, the atoms of the pressure chamber plate are suppressed from being diffused into the piezoelectric layer.

Abstract: A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

Abstract: In wire processing systems and methods, a wire channel receives a wire. One or more fluid guides flow the fluid into the wire channel to move, along the wire, a component (e.g. a solder sleeve) positioned at least partially in the wire channel and coupled to the wire. Other features are also provided.

Abstract: A method of manufacturing a lead. The method includes providing a supporting tube, and disposing a conductive strip on an outer surface of the supporting tube such that the conductive strip extends in an axial direction along a length of the supporting tube. The method also includes mounting a chip having a first conductive contact pad and a second conductive contact pad to the supporting tube such that the first conductive contact pad is in contact with the conductive strip. The method further includes fitting an electrode to the supporting tube such that the electrode is in contact with the second conductive contact pad, and coupling a conductor to each end of the supporting tube such that each conductor is in contact with the conductive strip. The method also includes covering at least one of the chip and the conductors with a sheath to provide the lead.

Abstract: A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: Embodiments of the currently claimed disclosure are directed to methods for inserting an undulated coil assembly in the slots of a hollow core of a dynamoelectric machine. In some embodiments, the method can include positioning at least a first coil portion of the coil assembly around a support member, aligning a guide device with respect to end faces and the slots of the core, feeding the first coil portion from the drum support member along the guide device to insert adjacent superimposed linear portions (LI) of the coil assembly in the slots, engaging the superimposed linear portions (LI) along at least one guide surface during the feeding, and relatively moving the core with respect to the guide assembly device to position the slots for receiving the superimposed linear portions (LI).

Abstract: A cable-laying device for producing wiring or cable harnesses of different types includes a laying plane for positioning lines of a wiring or cable harness, a plurality of transport units which can be moved relative to the laying plane in an at least partially automated manner, and a control device which is configured to control the transport units. A method for producing cable harnesses of different types by using a cable laying device is also provided.

Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

Abstract: Various embodiments to mitigate the contamination of electroplated cobalt-platinum films on substrates are described. In one embodiment, a method of manufacture of a device includes depositing a diffusion barrier over a substrate, depositing a seed layer upon the diffusion barrier, and depositing a cobalt-platinum magnetic layer upon the seed layer. In a second embodiment, a method of manufacture of a device may include depositing a diffusion barrier over a substrate and depositing a cobalt-platinum magnetic layer upon the diffusion barrier. In a third embodiment, a method of manufacture of a device may include depositing an adhesion layer over a substrate, depositing a seed layer upon the adhesion layer, and depositing a cobalt-platinum magnetic layer over the seed layer. Based in part on these methods of manufacture, improvements in the interfaces between the layers can be achieved after annealing with substantial improvements in the magnetic properties of the cobalt-platinum magnetic layer.

Abstract: A method for manufacturing a polymeric electrical machine includes manufacturing a stator including a laminated stator core and a plurality of windings including winding overhangs; applying a surface treatment to the stator core constructed to reduce defects at an interface between a polymeric material and the stator core and enhance adherence between the polymeric material and the stator core; mounting the stator onto a mandrel; inserting the stator into an electrical machine housing mold; molding an electrical machine housing including a stator band with an integral non-drive end endplate, including overmolding the stator and winding overhangs within the stator band; molding a drive end endplate, including forming polymeric ribs in the drive end endplate and overmolding a metallic structure into the endplate, the metallic structure enhancing mechanical stiffness of the endplate; installing a rotor assembly into the electrical machine housing; and installing the endplate onto the electrical machine housing.

Abstract: A method of fabricating a configurable single crystal acoustic resonator (SCAR) device integrated circuit. The method includes providing a bulk substrate structure having first and second recessed regions with a support member disposed in between. A thickness of single crystal piezo material is formed overlying the bulk substrate with an exposed backside region configured with the first recessed region and a contact region configured with the second recessed region. A first electrode with a first terminal is formed overlying an upper portion of the piezo material, while a second electrode with a second terminal is formed overlying a lower portion of the piezo material. An acoustic reflector structure and a dielectric layer are formed overlying the resulting bulk structure. The resulting device includes a plurality of single crystal acoustic resonator devices, numbered from (R1) to (RN), where N is an integer greater than 1.

Abstract: A method of manufacturing an integrated circuit. This method includes forming an epitaxial material comprising single crystal piezo material overlying a surface region of a substrate to a desired thickness and forming a trench region to form an exposed portion of the surface region through a pattern provided in the epitaxial material. Also, the method includes forming a topside landing pad metal and a first electrode member overlying a portion of the epitaxial material and a second electrode member overlying the topside landing pad metal. Furthermore, the method can include processing the backside of the substrate to form a backside trench region exposing a backside of the epitaxial material and the landing pad metal and forming a backside resonator metal material overlying the backside of the epitaxial material to couple to the second electrode member overlying the topside landing pad metal.

Abstract: Provided is a liquid metal-based flexible electronic device and a method for preparing a liquid metal-based flexible electronic device, that includes: preparing an Acrylonitrile Butadiene Styrene (ABS) plastic model; performing an ion sputtering on a surface of the ABS plastic model to form a gold film, to obtain a gold-plated ABS circuit; introducing a first silica gel into a mold to suspend the gold-plated ABS circuit inside the mold, and curing the first silica gel to obtain a cured model; immersing the cured model in acetone to dissolve the ABS model, to obtain a microchannel with a gold plating on an inner wall of the microchannel in a first silica gel substrate; and injecting a gallium-indium eutectic, inserting a copper wire, and applying a second silica gel and curing the second silica gel, to obtain the liquid metal-based flexible electronic device.

Abstract: Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.

Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Abstract: A method for forming a side-pumped optical fiber combiner includes ablating a cladding of a signal fiber to form an angled notch in the cladding. The signal fiber includes a core and the cladding surrounding the core. The method further includes inserting a cladding-free end of a pump fiber into the angled notch. The pump fiber includes a core and a cladding, the cladding-free end including the core of the pump fiber and free from the cladding of the pump fiber. The method further includes fusing the cladding-free end to the signal fiber.