Abstract: A method for assembling a bundle cable connector assembly that eliminates bird caging, wire threads extruding through a connector pin, loose wire threads, dielectric shield shrinking, etc. The method includes stripping the wire to create a birdcage preventative zone and an exposed tip with a crimping zone therebetween, and tinning the exposed wire at the birdcage preventative zone and the tip. The method then includes inserting the wire into a connector pin, and crimping the pin to the wire at the crimping zone using heat so that the tinning solder melts. The method then includes mounting the pin to a connector body and mounting a wire-locking device to the connector body to lock the pin to the connector body.

Abstract: A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the temporary substrate, by disposing the metal foil on a prepreg through a underlying layer interposed between them, in a way that the underlying layer is disposed in a wiring formation region on the prepreg, and the metal foil having a size larger than that of the underlying layer is caused to contact with an outer peripheral portion of the wiring formation region, and then by hardening the prepreg with heating and pressurization, forming a build-up wiring layer on the metal foil, and obtaining a wiring member in which the build-up wiring layer is formed on the metal foil, by cutting out a portion of structure in which the underlying layer, the metal foil and the build-up wiring layer are formed on the temporary substrate, the portion corresponding to a peripheral portion of the underlying layer, and thus by separating the m

Abstract: Apparatuses, systems, and methods are provided for automatically crimping terminals or connectors to wires wherein the terminals or connectors are provided in strip form and may be of varying sizes, shapes, and pitches. An apparatus according to the present invention includes an applicator body and a ram movably mounted in relation to the body and drivable in a first path through a working stroke towards, and a return stroke away from, a crimping anvil. The apparatus further includes a crimping die on the ram for cooperation with the anvil and adapted to crimp a terminal connector located therebetween onto a wire during each working stroke of the ram. The apparatus additionally includes a drive mechanism adapted to contact the strip through pressure engagement and to feed the strip along a second path to locate the leading connector on the strip between the anvil and the die.