Abstract: A method for obtaining real-time emissivity and temperature values of a semiconductor wafer in a processing system having at least one lamp (preferably a plurality of lamps arranged in a plurality of zones so as to provide multizone temperature and emissivity values for the semiconductor wafer) arranged in at least one zone, the method using a reference wafer having a known reflectivity and the method comprising the steps of: measuring pyrometry signals for the reference wafer (step 202) and generating calibration curves from the measurements; measuring pyrometry signals for the semiconductor wafer; and obtaining the temperature and emissivity values (step 222) from the calibration curves and the measured pyrometry signals (step 220) for the semiconductor wafer.

Abstract: The temperature of a heat reservoir is varied according to a linear function which is AC modulated. At this time, the temperature difference between two points located in a heat flow path going from the heat reservoir to an unknown sample is measured. Also, the temperature difference between two points located in a heat flow path going from the heat reservoir to a reference sample is measured. These two pairs of points are arranged symmetrically. Then, the resulting signals are demodulated, and each signal is divided into an AC component and a low-frequency component. Using these signals, the DSC signal is separated into a heat capacity component and a latent heat component.

Abstract: Apparatus adapted for use in measuring emissivity of a semiconductor wafer having a radiant energy reflecting surface includes a hollow integrating sphere having first and second spaced apart openings and having an inner surface upon which radiant energy can be distributed. The wafer is disposed with its reflecting surface adjacent the second opening. A first radiant energy detector is disposed on the inner surface of the sphere to detect the distributed energy. First means directs a beam of radiant energy through the first opening in the sphere in such manner that the beam passes through the sphere and the second opening to strike the wafer reflecting surface and is thereupon reflected into the sphere, the reflected energy being distributed upon the inner surface of the sphere and being detected by said first detector.

Abstract: The invention provides methods of detecting poor meat quality in live animals using infrared thermography. Animals from a group of live domestic animals such as cattle or swine are scanned to produce thermographic images. The images are then statistically analyzed to determine a measure of central tendency such as the mean temperature for each animal's image and for all of the images in the group. A measure of dispersion from the measure of central tendency, such as standard deviation is determined. Then, animals are rejected as having a high probability of producing poor meat quality if the measure of central tendency for that animal's temperature differs from the measure of central tendency for the group by more than 0.9 standard deviations. Alternatively a set percent of animals are rejected, preferably up to 20%, these being animals whose measures of central tendency differ the most from the measure of central tendency for the group.

Abstract: A yarn unevenness information analyzing apparatus which can perform an analysis of periodic yarn unevennesses without being restricted by another analysis of non-periodic yarn unevennesses. Signals from a large number of yarn evenness detectors are inputted to a CPU for yarn unevenness analysis by way of a first switch for changing over the signals in a short period to successively output the signals and a second switch for changing over the signals in a long period to successively output the signals.

Abstract: Method and arrangement for detecting the level of a liquid cryogen having a predetermined boiling point and which is being held in a container relative to the bottom of the container. The arrangement includes a container which receives the liquid cryogen and a longitudinal extending sensing member having a length extending from the bottom of the container to a level that is greater than any depth experienced for the liquid cryogen. The sensing member is vertically disposed in the container with one end in contact with the bottom of the container and the other end extending out of the liquid cryogen. The sensing member is composed of a high temperature superconductor material having a critical temperature that is higher than the predetermined boiling point of a selected cryogen. An electrical current is passed through the sensing member and the voltage drop across the sensing member is measured.

Abstract: A wire temperature measuring method for a wire electric discharge machine by which temperature and temperature distribution of a wire can be accurately measured during electric discharge machining. After a machining voltage is cut off, a loop current flows. Based on the loop current and a voltage between electrodes measured by a differential amplifier, a resistance between the electrodes is obtained, and the temperature of a wire is obtained based on the resistance. Accordingly, the wire temperature during actual machining operation can be measured with accuracy.

Abstract: In order to carry out thermal analysis under various kinds of atmospheres, there is provided an apparatus for thermal analysis containing a sample chamber having a portion for a sample and a signal detection chamber provided with a signal detection member, the signal detection chamber having an inlet port for a purging gas, the sample chamber and the signal detection chamber being connected through a purging gas passage, and the sample chamber being provided with an inlet port for an atmosphere gas and also with an outlet port for the atmosphere gas and the purging gas.

Abstract: A probe cover for covering the probe of a tympanic thermometer. The cover includes a film member for covering a probe and a flexible retaining member having an opening for allowing passage of the probe therethrough.

Abstract: A measuring cup with a thermometer mounted on an exterior surface thereof for measuring the temperature of a liquid prior to placing it in the cup. The cup can be used in many operations involving a liquid which have a critical temperature requirement. One such operation is breadmaking in which water, once it has been warmed to a desired temperature, is added to yeast or, alternately, to a flour mixture containing yeast. To use the cup in breadmaking, the cup is placed under a stream of warm water and, when the thermometer indicates the water has reached the desired temperature, the water in a measured amount is added to the cup.

Abstract: A thermal detector in which an element unit has a heat sensor element such as a, thermistor, sealed into the terminal end portion thereof, for electrically detecting temperature change. A detector body integrates by plastic-forming a pair of fitting members for electrically and mechanically coupling to a detector base. A circuit board is mounted on a circuit accommodation portion inside the detector body. A back side cove is provided for closing and sealing the circuit accommodation portion from the reverse side thereof. Airtightness of the circuit accommodation portion is thereby secured and it is simplified to make possible automatization. Positioning projections and respective positioning grooves are provided. By respectively fitting these, positioning is achieved of the circuit board to a molded body, the back side cover to the reverse side of the molded body and the outer cover to the lower side of the molded body.

Abstract: A seal is provided for a connector which must be reliably sealed in applications where the connection is made and undone as part of the normal use of the connector. The seal is particularly well suited to on-off tools used in downhole applications. The seal comprises of a nonmetallic insert holding bonded seals, preferably made of rubber. The nonmetallic insert provides support against seal extrusion. It also does not damage the sealing surface if movement or flexing result in contact between the insert and the opposed sealing surface.

Abstract: An instrument employs a projector which projects a moving pattern of heat onto a test object. An exemplary pattern is formed of bars or lines of infrared radiation separated by unheated areas, or areas of shadow. An infrared camera which is not sensitive to the wavelength of the projected light is used to detect the heat emitted by the test object. The projected bands of thermal radiation heat the surface of the test object. Some of the energy in the form of heat sinks into the structure, while some of the heat energy flows laterally from the heated band to the unheated bands between the projected bands. The lateral flow of heat between bands is resisted by cracks in the surface. This resistance causes heat energy to build up on one side of each crack. The downward flow of heat energy is resisted by less conductive material such as a debonding between layers which traps the heat, causing it to build up laterally.

Abstract: A method and apparatus are provided for producing a temperature profile of a part operating within a machine is provided. The machine is operated with the part for a predetermined period of time. The part is placed in a light box in which a camera produces an image of the part. The image is compared with a standard set of colors and the standard color most closely corresponding to each pixel of the image is selected.

Abstract: A method and apparatus for testing a spring pack of a valve operator, the apparatus including a hollow housing with a coupling for attaching to the valve operator. A slider is received within the housing and moves therein when driven by a bolt that extends through a threaded aperture in the housing. A load sensor is attached to the slider and extends through the coupling and engages a valve operator component that is connected to the spring pack. As a technician turns the bolt, the apparatus compresses the spring pack within the valve operator and the load sensor produces an electrical signal that indicates how much force is exerted by the spring pack. At the same time, a transducer produces another electrical signal indicating the displacement of the spring pack.

Abstract: A method of measuring temperature by the use of an infrared sensor is capable of measuring temperature with high accuracy without being influenced by thermal drifts due to conditions of the atmosphere and environment before the start of measurement. An infrared sensor is associated with a normally closed shutter. The shutter includes a plurality of openings, such that one starting signal provided to the shutter produces a plurality of output signals from the infrared sensor 6 by a single reciprocating motion of the shutter. The first signal is excluded or averaged with the subsequent signals in calculating temperature.

Abstract: A multiusage thermometer comprises a body portion capable of selectively detachably engaging thereto at least a first sensing portion, a second sensing portion, a third sensing portion and a fourth sensing portion each of said sensing portions having a first engaging member at a first end thereof, said body portion integrally forming a second engaging member at one end thereof for electrically and complementarily connecting thereto said first engaging member of each of said sensing portions. This invention offers a thermometer being multiusable and having a body portion capable of being selectively detachably engaged with other sensing portions of various usages based on the situation one faces.

Abstract: Radiometer with a probe beam superimposed on its field-of-view for furnace temperature measurements. The radiometer includes a heterodyne millimeter/submillimeter-wave receiver including a millimeter/submillimeter-wave source for probing. The receiver is adapted to receive radiation from a surface whose temperature is to be measured. The radiation includes a surface emission portion and a surface reflection portion which includes the probe beam energy reflected from the surface. The surface emission portion is related to the surface temperature and the surface reflection portion is related to the emissivity of the surface. The simultaneous measurement of surface emissivity serves as a real time calibration of the temperature measurement.

Abstract: A direct temperature sensing tool directly senses and provides feedback of the temperature of its cutting environment. The tool comprises a base body defining at least one cutting edge of the tool. A protective coating surrounds the base body and the cutting edge, the protective coating providing a friction-reducing surface for the tool. A thin film temperature sensing device, such as a thermocouple device, is disposed on the base body at a distance from the cutting edge. The temperature sensing device is encapsulated within the protective coating. An electrical connection is defined through the protective coating in electrical communication with the temperature sensing device. The tool is configurable with a machine tool so that the temperature sensing device is in communication with a conversion device of the machine tool for providing an indication of the temperature sensed by the temperature sensing device.

Abstract: An optical method for measuring the temperature of a substrate material with a temperature dependent bandgap. The substrate is illuminated with a broad spectrum lamp and the bandgap is determined from the spectrum of the diffusely scattered light. The spectrum of the light from the lamp is sufficiently broad that it covers the spectral range above and below the bandgap of the substrate. Wavelengths corresponding to photon energies less than the bandgap of the substrate are transmitted through the substrate and are reflected from the back surface of the substrate as well as from the front surface while the wavelengths corresponding to photon energies larger than the bandgap are reflected only from the front surface. If the front surface is polished the front surface reflection will be specular while if the back surface is rough the reflection from the back surface will be non-specular. The back surface reflection is detected with a detector in a non-specular location.