Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

Abstract: An automation field device having a housing and a modular field device electronics unit located inside the housing. The electronics unit has a first circuit board having at least one first and one second plug-in connector element, wherein the first plug-in connector element is used to electrically connect a peripheral unit, wherein both the first and the second plug-in connector elements can be contacted essentially from the same preferred plug-in direction, and a second circuit board having at least one third plug-in connector element, wherein the circuit boards are arranged such that the second plug-in connector element is connected to the third plug-in connector element in a detachable manner to electrically connect the peripheral unit to the second circuit board, and the second circuit board has at least one opening, via which the first plug-in connector element of the first circuit board is accessible for connecting the peripheral unit.

Abstract: An electronic device is provided in accordance with an aspect of the present disclosure. The electronic device includes a cover and a flexible display. The cover includes a first section, a second section connected to the first section by a first connection mechanism, and a third section connected to the second section by a second connection mechanism. The flexible display is attached to at least a portion of the first section and a portion of the third section. The flexible display is positioned in a first orientation when the first and the third sections are in a plane and in a second orientation when the sections are in different planes.

Abstract: An integrated lockable shelf rail configured to operate in pairs to support an electronic component is provided. The rail includes a front bracket to attach to a first vertical support and having a forward facing first plate, and a track assembly to be coupled to the front bracket. The track assembly includes a forward facing second plate to overlap with and couple to the first plate, a longitudinally extending C-shaped track member, and moveable arm arms slideably nested in the track member. The track assembly also includes a shelf bracket including a support surface to support the electronic component, a first side plate configured to couple to the second arm, and a forward facing third plate to overlap with the second plate. A hole in each of the first, second and third plates which, when the first, second and third plates overlap, collectively define a common hole to receive a fastener.

Abstract: An electronic device shell can be configured to compactly receive at least one expansion card. The electronic device shell comprises a bottom plate, a front plate connected with a front end of the bottom plate, and a rear plate connected with a rear end of the bottom plate. The front plate is recessed away from the rear plate to form a first lead portion. The expansion card is located on the bottom plate and between the front plate and the rear plate. One end of the expansion card is secured on the rear plate, and the other end of the expansion card is received in the first lead portion.

Abstract: A mobile computer suitable for use in an MRI environment is disclosed. The mobile computer includes at least one shielded cavity in which the electronics for the mobile computer are inserted. The shielded cavity inhibits undesirable emissions from the mobile computer from affecting the quality of the image obtained by the MRI scanner and inhibits electrical interference generated by the dynamic magnetic fields in the MRI scanner from affecting the performance of the mobile computer. In addition, the components used in the mobile computer are selected from non-ferrous materials and are arranged in a manner to minimize interaction between the mobile computer and the MRI scanner.

Abstract: A wire protection member includes: a flexible cylindrical wire protection tube; a cylindrical covering member that is formed on an outer circumferential surface of the wire protection tube by molding; and a locking tool that is formed integrally with the cylindrical covering member to allow the locking tool to be locked to a mounting hole of a vehicle body panel. The cylindrical covering member includes: a thick portion that is formed to be thicker in radial thickness than another outer circumferential portion in a circumferential direction on which at least the locking tool is provided to protrude; and a flat surface or a gentle curved surface that is formed in an outer surface of the thick portion and that is substantially parallel to a plane passing through an axis of the wire protection tube.

Abstract: A display apparatus includes a first base plate, a second base plate coupled to the first base plate to allow the second base plate to be rotated on the basis of a rotation axis between the first base plate and the second base plate, a moving plate coupled to the second base plate and configured to slide along a first direction with respect to the second base plate, a pop-up plate configured to move along a second direction corresponding to a thickness direction of the second base plate on the second base plate in accordance with a movement of the moving plate, and a display panel including a first portion coupled to the first base plate and a second portion coupled to the moving plate.

Abstract: Provided is an electronic control device, in which positioning of a case including a connector housing portion and a pin header portion of a connector mounted on an electronic circuit board may be carried out easily with high accuracy so that ease of assembly and a water-proof property of the connector are improved. The electronic control device includes: an electronic circuit board (1) on which a pin header (30) used for electric connection to an external device is mounted together with an electronic component (11); and a case (2) for receiving the electronic circuit board therein, the case including a connector housing portion (31) provided as an opening portion (310) at a position corresponding to the pin header. A cover (20) of the case including the connector housing portion and the pin header mounted on the electronic circuit board have a first positioning structure using press-fit.

Abstract: An adaptive heat dissipation apparatus is provided, including two or more chamber walls forming a chamber volume having a first open side and a second open side, a heat source positioned at the first open side of the chamber volume, a heat conducting surface positioned at the second open side of the chamber volume, and a thermally-expansive material occupying a predetermined portion of the chamber volume. The thermally-expansive material expands to substantially fill the chamber volume at an ambient temperature above a predetermined temperature threshold and conducts heat from the heat source to the heat conducting surface. The thermally-expansive material contracts to leave an air gap when the ambient temperature is below the predetermined temperature threshold.

Abstract: A cover plate for a portable electronic device is disclosed. The cover plate can be used as a cosmetic feature disposed on a display or cover glass of the portable computing device. For instance, the cover plate may include one or may layers disposed on a surface of the cover plate. In some cases, the layers are formed on a rear surface of the cover plate. In addition to enhancing the appearance of the portable electronic device, the cover plate provides additional a protective layer to internal components positioned behind the cover plate. Moreover, the cover plate may formed from an electromagnetically transparent material such as glass to allow receipt and/or transmission of electromagnetic waves in the form of radio frequencies. Also, the cover plate offers protection to the display and cover glass when the portable electronic device is in a closed configuration.

Abstract: A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

Abstract: A packaging substrate includes a first dielectric layer, a first wiring layer, a first conductive pillar layer, a second dielectric layer, a second wiring layer, an electrical pad layer, and a third dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface, plural openings, and a wall surface that faces at least one of the openings. The first wiring layer is located on the first surface and the wall surface. A portion of the first wiring layer on an edge of the wall surface adjacent to the second surface extends in a direction away from the wall surface. The first conductive pillar layer is located on a portion of the first wiring layer. The second dielectric layer is located on the first surface, the first wiring layer, and in the openings.

Abstract: A drive array is provided, including: a structure having a top panel, a base; and first and second side panels; the first and second side panels positioned on opposite sides of the array and defining a length of the array; and a plurality of fins arranged transversely to the length of the array, the fins further arranged in a plurality of rows, each of the rows transverse to the array; a plurality of projections extending upwardly from the base aligned with a plurality of projections extending downwardly from the top penal, positioned to fit and hold a hard drive; and a circuit board secured to the back of the structure to communicate with the hard drives positioned on the array.

Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.

Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

Abstract: In some implementations, a cover may be attached to or detached from a computing device. For example, individual cam locks of a plurality of cam locks embedded into a computing device may be placed in an open position. Individual pins of a plurality of pins fastened to the cover may be aligned with a corresponding cam lock of the plurality of cam locks. The individual pins may be inserted into the corresponding cam locks. The individual cam locks may be moved from the open position to a closed position, causing the cover to be attached to the external surface of the computing device. The cover may include a curved portion that causes the cover to apply pressure to the outer surface of the computing device when the plurality of cam locks are in the closed position.

Abstract: One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

Abstract: An electrical junction box includes an electrical junction box main body having a mount portion and a separate attachment body removably attached to the mount portion, a pair of connectors are respectively provided on opposing surfaces of the mount portion and the attachment body are connected to each other, and a vibration suppressing member is between the opposing surfaces, the vibration suppressing member suppressing vibration of the attachment body by exerting a frictional force on the opposing surfaces.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.