Patents Examined by Dion Ferguson
  • Patent number: 10502958
    Abstract: Techniques for fabricating a slanted structure are disclosed. In one embodiment, a method of fabricating a slanted structure in a material layer includes injecting a first reactive gas into an reactive ion source generator, generating a plasma that includes reactive ions in the reactive ion source generator, extracting at least some of the reactive ions from the plasma to form a collimated reactive ion beam towards the material layer, and injecting a second reactive gas onto the material layer. The collimated reactive ion beam and the second reactive gas etch the material layer both physically and chemically to form the slanted surface-relief structure. In some embodiments, the first reactive gas includes a low-molecular-weight gas (e.g., H2 or He). In some embodiments, a surface layer of the internal cavity of the reactive ion source generator includes a layer of an oxide material (e.g., aluminum oxide or Y2O3).
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: December 10, 2019
    Assignee: Facebook Technologies, LLC
    Inventor: Nihar Ranjan Mohanty
  • Patent number: 10504657
    Abstract: A solid electrolytic capacitor that comprises a capacitor element, a lead wire, an anode termination, and a cathode termination is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. Further, the lead wire is in electrical contact with the anode body and contains a first region that is located in proximity to a surface of the capacitor element. The lead wire contains a core that extends outwardly from the surface, and an oxide layer coats at least a portion of the core within the first region.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: December 10, 2019
    Assignee: AVX Corporation
    Inventors: Ladislav Vilc, Ivan Horacek
  • Patent number: 10498250
    Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element constituting a power converter circuit. A smoothing capacitor is configured to smooth a direct-current voltage applied to the semiconductor module. A pair of positive and negative busbars is configured to electrically connect the semiconductor module and the smoothing capacitor. The positive and negative busbars are arranged to face each other with a predetermined space therebetween. A discharge resistor is connected in parallel with the smoothing capacitor via the positive and negative busbars, and is configured such that an electrical charge stored in the smoothing capacitor flows through the discharge resistor as a discharge current. The positive and negative busbars are interposed between the discharge resistor and the smoothing capacitor.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: December 3, 2019
    Assignee: DENSO CORPORATION
    Inventors: Nobuaki Takahashi, Yuya Kiuchi, Kenshiro Hida
  • Patent number: 10499486
    Abstract: Devices and methods for generating a plasma in a liquid are provided. A low-dielectric material can be placed in contact with the liquid to form an interface a distance from an anode. A voltage can be applied across the anode and a cathode submerged in the liquid to produce the plasma. A variety of devices are provided, including for continuous operation. The devices and methods can be used to generate a plasma in a variety of liquids, for example for water treatment, hydrocarbon reformation, or synthesis of nanomaterial.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: December 3, 2019
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Min Suk Cha, Ahmad Bassam Hamdan
  • Patent number: 10492344
    Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: November 26, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Kai Liu, Yu-Lin Chao
  • Patent number: 10490381
    Abstract: A microwave energy tool including a sheet beam klystron that includes a tube body for carrying an electron sheet beam that has a plurality of cavities and a magnetic solenoid wound directly on the tube body.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: November 26, 2019
    Assignee: Qmast LLC
    Inventors: George Caryotakis, Peter M. Kearl
  • Patent number: 10490382
    Abstract: A slow-wave circuit is provided with a folded waveguide and a beam hole. The beam hole is arranged between an edge and a center in the direction of width of the folded waveguide. The beam hole is preferably arranged at an edge in the direction of width of the folded waveguide, at a position that does not protrude beyond the folded waveguide. The beam hole is preferably arranged at a position separated by a prescribed distance from the edge in the direction of width of the folded waveguide.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: November 26, 2019
    Assignee: NEC NETWORK AND SENSOR SYSTEMS, LTD.
    Inventor: Takashi Nakano
  • Patent number: 10490352
    Abstract: A multi-layer ceramic capacitor includes a multi-layer unit, side margins, and bonding units. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margins cover the multi-layer unit from a second direction orthogonal to the first direction. The bonding units are each disposed between the multi-layer unit and each of the side margins and have higher silicon content than the ceramic layers and the side margins.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: November 26, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yoichi Kato, Kotaro Mizuno, Yukihiro Konishi
  • Patent number: 10485991
    Abstract: Methods and system for facilitating rapid radiation treatments are provided herein and relate in particular to radiation generation and delivery, power production and distribution, and electron source design. The methods and systems described herein are particularly advantageous when used with a compact high-gradient, very high energy electron (VHEE) accelerator and delivery system (and related processes) capable of treating patients from multiple beam directions with great speed, using all-electromagnetic or radiofrequency deflection steering is provided, that can deliver an entire dose or fraction of high-dose radiation therapy sufficiently fast to freeze physiologic motion, yet with a better degree of dose conformity or sculpting than conventional photon therapy.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: November 26, 2019
    Assignee: THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY
    Inventors: Sami Tantawi, Valery A. Dolgashev
  • Patent number: 10492335
    Abstract: A heat dissipation device for a device or module which can be plugged into the heat dissipation device includes a mounting bracket, an upper radiator, and at least one side radiator. The mounting bracket includes an upper bracket and two side brackets connected to two sides of the upper bracket. The upper bracket and the two side brackets define a receiving chamber for receiving the device or module. The upper radiator is positioned above the upper bracket. The at least one side radiator is positioned at one side of the side bracket away from the receiving chamber. The upper radiator includes a heat conducting layer, and the heat conducting layer includes a thermally conductive foam and a graphite layer arranged around the thermally conductive foam.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: November 26, 2019
    Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
    Inventor: Wei-Chih Hung
  • Patent number: 10490361
    Abstract: A method for manufacturing an ultra-capacity battery includes providing cathodes and anodes. Providing the cathodes includes providing a first substrate having a first surface and a second surface opposite the first surface, forming a plurality of first combs perpendicular to the first surface of the first substrate and arranged at a first interval along a first direction, forming a graphene layer on the first combs and on the first surface of the first substrate. Providing the anodes includes providing a second substrate having a first surface and a second surface, forming a patterned insulating film on the first surface of the second substrate exposing a portion of the first surface of the second substrate, etching the exposed portion of the first surface of the second substrate to form a body portion and a plurality of second combs perpendicular to the body portion.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: November 26, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Ming Zhou
  • Patent number: 10480833
    Abstract: A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: November 19, 2019
    Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics SA
    Inventors: Rafael Augusto Prieto Herrera, Jean-Philippe Colonna, Perceval Coudrain
  • Patent number: 10483089
    Abstract: Some embodiments include a high voltage, high frequency switching circuit. The switching circuit may include a high voltage switching power supply that produces pulses having a voltage greater than 1 kV and with frequencies greater than 10 kHz and an output. The switching circuit may also include a resistive output stage electrically coupled in parallel with the output and between the output stage and the high voltage switching power supply, the resistive output stage comprising at least one resistor that discharges a load coupled with the output. In some embodiments, the resistive output stage may be configured to discharge over about 1 kilowatt of average power during each pulse cycle. In some embodiments, the output can produce a high voltage pulse having a voltage greater than 1 kV and with frequencies greater than 10 kHz with a pulse fall time less than about 400 ns.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: November 19, 2019
    Assignee: Eagle Harbor Technologies, Inc.
    Inventors: Timothy M. Ziemba, Kenneth E. Miller, James R. Prager, John G. Carscadden, Ilia Slobodov
  • Patent number: 10485088
    Abstract: Methods and systems for non-invasively tuning dressed multicell cavities. A multicell cavity can be plastically deformed as result of introducing a customized balloon to a cavity and then pressurizing the balloon to a targeted cell while applying a global force on the cavity flanges. The pressurized balloons localize the plastic deformation to the targeted cells using prescribed values of both global force and balloon pressure. Such an approach allows for the tuning of dressed cavities without removal of the helium vessel.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 19, 2019
    Assignee: Fermi Research Alliance, LLC
    Inventors: Mohamed Awida Hassan, Donato Passarelli
  • Patent number: 10485091
    Abstract: High thermal performance microelectronic modules containing sinter-bonded heat dissipation structures are provided, as are methods for the fabrication thereof. In various embodiments, the method includes the steps or processes of providing a module substrate, such as a circuit board, including a cavity having metallized sidewalls. A sinter-bonded heat dissipation structure is formed within the cavity. The sintered-bonded heat dissipation structure is formed, at least in part, by inserting a prefabricated thermally-conductive body, such as a metallic (e.g., copper) coin into the cavity. A sinter precursor material (e.g., a metal particle-containing paste) is dispensed or otherwise applied into the cavity and onto surfaces of the prefabricated thermally-conductive body before, after, or concurrent with insertion of the prefabricated thermally-conductive body.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: November 19, 2019
    Assignee: NXP USA, Inc.
    Inventors: Jaynal A. Molla, Lakshminarayan Viswanathan, Elie A. Maalouf, Geoffrey Tucker
  • Patent number: 10475636
    Abstract: An embodiment of a system includes an RF signal source, a first electrode, a second electrode, and a cavity configured to receive an electrodeless bulb. The RF signal source is configured to generate an RF signal. The first electrode is configured to receive the RF signal and to convert the RF signal into electromagnetic energy that is radiated by the first electrode. The cavity is defined by first and second boundaries that are separated by a distance that is less than the wavelength of the RF signal so that the cavity is sub-resonant. The first electrode is physically positioned at the first boundary, and the second electrode is physically positioned at the second boundary. The first electrode, the second electrode, and the cavity form a structure that is configured to capacitively couple the electromagnetic energy into the electrodeless bulb when the electrodeless bulb is positioned within the cavity.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: November 12, 2019
    Assignee: NXP USA, Inc.
    Inventors: Steven Do, Lionel Mongin, Pierre Marie Jean Piel
  • Patent number: 10475591
    Abstract: A capacitor that is capable of exhibiting good properties under humid conditions is provided. The ability to perform under such conditions is due in part to selective control over the particular nature of the solid electrolyte and cathode coating that overlies the solid electrolyte. For example, the solid electrolyte contains pre-polymerized conductive polymer particles, which can help act as a blocking layer for any silver ions migrating through the capacitor. Likewise, the cathode coating also contains conductive metal particles (e.g., silver particles) that are dispersed within a resinous matrix. The resinous matrix includes a polymer that absorbs only a small amount of water, if any, when placed in a humid atmosphere.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: November 12, 2019
    Assignee: AVX Corporation
    Inventors: Ladislav Vilc, Silvie Vilcova, Ivan Horacek
  • Patent number: 10470272
    Abstract: Circuitry 31 for a solid-state lighting arrangement 20 designed for as a replacement for a gas discharge lamp used in a lighting fixture having a ballast. The circuitry 31 unsafe flow of current through the solid-state lighting arrangement 20, under non-operational conditions and during installation of the lighting arrangement, so as to provide compatibility with safety standards for use with discharge lamps.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: November 5, 2019
    Assignee: ELB Electronics, Inc.
    Inventor: Xiaoxiang Cheng
  • Patent number: 10470338
    Abstract: A cooling system for cooling circuit boards. The cooling system includes a casing, which includes at least two board slots and at least one cooling plate between the two board slots; at least one cover, which is placed on a circuit board to be secured to one of the board slots; and at least one wedge placed on the cover. The wedge provides thermal conductivity between the circuit board and the cooling plate when the circuit board is placed into the board slot; and at least one wedgelock that secures the circuit board to the board slot.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: November 5, 2019
    Assignee: ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
    Inventor: Ali Murtaza Dalgic
  • Patent number: 10470271
    Abstract: A lamp driving circuit has an AC/DC converter receives a dimmer voltage from a TRIAC dimmer with an on/off switch to turn on or off a lamp module having a number of LED lamp groups. The driving circuit also has an energy storage circuit and an MCU to control the switching of each of the lamp groups. The energy storage circuit provides a prolonged supply voltage to the MCU for a period of time after the dimmer is turned off so that the MCU can sense the off-time of the dimmer and count the number of consecutive times the dimmer is turned off and on during a preset time in order to control the color temperature of the lamp module. The MCU is programmed to store information regarding the color temperature the user has selected between a number of color temperatures such as 3000K, 4000K and 5000K.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: November 5, 2019
    Assignee: Shanghai Huxing Technology Co., Ltd.
    Inventors: Xiaofang Yan, Zheng Zhu, Wufeng Tang