Patents Examined by Don Morin
  • Patent number: 4999695
    Abstract: An MSM type semiconductor light responsive element includes a semiconductor substrate, a first semiconductor layer, a pair of electrodes disposed on the first semiconductor layer forming Schottky barriers, and a second semiconductor layer comprising a semiconductor having a larger energy band gap than that of the first semiconductor layer disposed between and contacting the electrodes.
    Type: Grant
    Filed: July 24, 1989
    Date of Patent: March 12, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Tetsuo Shiba
  • Patent number: 4984057
    Abstract: A semiconductor element string having a number of semiconductor elements, each of which has the first and second leads mounted on a transverse plate. The first leads are cut off from the transverse plate, when the semiconductor element string is to be mounted on the printed circuit board. The second leads connected to the transverse plate serve as the ground lines for the respective semiconductor elements by bending two distal ends of the transverse plate to be mounted on the printed circuit board. A linking piece is provided crossing over the middle portions of the first and second leads so as to make the whole construction more stable. The second leads are bent into a S-shaped structure. Each second lead and its corresponding first lead are located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of the semiconductor element string by an angle.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: January 8, 1991
    Inventor: Adam Mii