Abstract: This invention is directed to an electrical interconnection system composed of a plurality of interconnected circuit panel subassemblies, where each subassembly is preferably formed by a reaction injection molding (RIM) process. Each subassembly includes a plurality of spaced apart sites for establishing electrical contact to an electrical component, and an encapsulated conductive grid network joining certain of the respective spaced apart sites. A feature of this invention is that the conductive grid network includes flexible, insulative conductors which are unencapsulated and extend between adjacent pairs of subassemblies. By this arrangement, it is possible to fabricate and terminate the subassemblies, planarly arranged, by robotics, whereupon the subassemblies may then be moved relative to each other to form a nonplanar or three-dimensional assembly, such as an electromechanical structure to which further electrical components may be secured.