Abstract: An apparatus plates metal bumps of uniform height on one surface of a semiconductor wafer (32). A plating tank (12) contains the plating solution. The plating solution is filtered (16) and pumped (14) through an inlet (22) to an anode plate (24) within plating cell (20). The anode plate has a solid center area to block direct in-line passage of the plating solution, and concentric rings of openings closer to its perimeter to pass the plating solution. The distance between the inlet and the anode plate is adjustable with supports to create a uniform flow of the plating solution to the surface of the semiconductor wafer for uniform plating of the array of metal bumps (30). The plating cell contains an adjustable sidewall extension (26) to set the proper distance between the anode plate and the semiconductor wafer.

Abstract: A compact, hand portable, mobile electroplating unit provided with wheels, a seat for the user, and all of the chemical solutions and applicator equipment, including a D.C. power source, required to electroplate a metallic film on a metallic surface.

Abstract: The apparatus for a continuous selective electrodeposition on a strip comprises a carrier (2), which guides the strip (1) in its longitudinal direction, which are faced by electrolyte discharge orifices (3), through which the electrolyte, which has been discharged by a pump (4) is sprayed onto the strip (1), which is covered by a mask tape (5), The mask tape (5) is provided with at least one row of holes (6) and urges the strip (1) against the carrier (2). The strip (1) is provided with drive means (7) for moving the strip (1) relative to the mask tape (5). The carrier (2) is straight and one or more pressure-applying elements (8), which are parallel to the carrier (2), are associated with the carrier (2) and urge the mask tape (5) against the carrier (2). The carrier and the pressure-applying elements, individually or jointly, define openings (3), which face the electrolyte discharge orifices (3) and overlap the holes (6) of the mask tape (5).

Abstract: Attaching apparatus which has a cell of electrodes (30) with an aperture (32) in the center, housed in an enclosure (34) containing a matching bore (36). A nipple (46) with a flange (50) on one end and a series of adjacent notches (48) is screwed into a pool adapter (58) retaining the enclosure tightly against the wall of the pool. Edge spacers (44) fill the gap where pools are contoured.

Abstract: A wafer cutting device has a plurality of individually highly tensioned diamond impregnated wires that are mounted in a translatable head. Each wire has a tension monitor connected thereto for the purpose of insuring uniform tension and also alerting to breakage. Further, a differential DC voltage is applied to the wires and the crystal with the assistance of electrolytes to improve the removal of material for minimizing damage to the surfaces. The crystal is mounted on a two dimensional stage. During normal cutting the crystal is moved vertically into the cutting wire. The vertical cutting rate is adjusted due to the configuration of the crystal. At the end of cutting, the crystal is moved laterally so as to place a notch in the wafers for the purpose of removing the wafer in a clean break.

Abstract: A method for the direct metallization of non-conductors and printed circuit boards is disclosed wherein the non-conductive substrate or printed circuit board is treated with an aqueous cleaner/conditioner composition comprising a cationic surfactant, said surfactant is a quaternary ammonium ion having a molecular weight of below 1,000, thereby rendering the substrate of a printed circuit board receptive to the uniform adherence and adsorption of the noble metal catalyst deposited thereafter, which catalysts are used, directly or indirectly, as the sites of direct electroplating without the need of using electroless plating. The cleaner/conditioner is particularly useful because it does not require the use of chelating agent(s) which are commonly used in the art and thereby eliminates waste treatment problems prevalent in the industry.

Abstract: An apparatus and method for generating hydrogen gas by reacting water and an electrode at high temperature, wherein water is delivered under pressure by a pump in communication with a storage facility or tank in a manner forcing the water, at a controlled rate, into a gas tight vessel in which a heated electrode is positioned. An exothermic reaction takes place, whereby the liquid reactant, water, is reduced to hydrogen gas.A conduit in communication with the produced gas outlet of the vessel conducts the hydrogen gas to the predetermined connection for use, whether for combustion in an engine, or for industrial use.

Abstract: A solid composition provides high oxygen ion conductivity, and includes a metal oxide combined with multiple dopants. The oxide may, for example, include zirconia, bismuth trioxide, thoria or hafnia. The dopants are chosen such that they are of similar ionic radius to the oxide, but such that they generally have different valences. For example, zirconium has a +4 valence, while dopants are usually chosen which have +2 or +3 valences. Possible dopants include materials such as magnesia, yttria, and oxides of calcium, barium, strontium, lanthanum, ytterbium, and scandium. It has been found that choosing the dopants such that they exist in the composition at specified ratios results in surprising ability to transport oxygen ions. In the case of a composition which includes magnesia and yttria dopants placed within a zirconia matrix, it has been found desirable to maintain the ratio of the mole percentages of the magnesia to the yttria in the range of from about 5.75:10 to about 11:10.

Abstract: A compact, hand portable, mobile electroplating unit provided with wheels, a seat for the user, and all of the chemical solutions and applicator equipment, including a D.C. power source, required to electroplate a metallic film on a metallic surface.

Abstract: Process for the electrolytic pickling of continuously advancing electrically conductive material, wherein the treatment periods as compared with purely chemical treatments are to be shortened respectively the length of the treatment plant is to be shortened and wherein the attack of aggressive ions onto the electrode material is to be counteracted for the attainment of longer life expectancies, in particular of the anode. The material to be treated is subjected to at least one cathodic treatment in a first vessel and merely an anodic treatment in an immediately following vessel, and the electrical circuit between the electrodes of different polarities in successive vessels is completed by way of the material being treated. In the apparatus according to the invention at least one anode dips into one of the successive vessels, whereas all electrodes in the immediately following vessel are of cathodic polarity.

Abstract: A plating head includes a prismatic body containing a series of ducts connected via a supply duct to a source of pressurized electrolyte, and a series of ducts connected via a discharge channel to a suction source provided by a venturi in which a partial vacuum is generated by the flow of pressurized electrolyte through a branch duct.

Abstract: The present invention relates to an etching process for the purpose of removing binder phase from the surface of a hard metal consisting of hard material in a binder phase based on cobalt and/or nickel. By carrying out the etching process electrolytically in a mixture containing concentrated sulfuric acid and concentrated phosphoric acid at a volume ratio of 0.5-2 with a water content of <50% at a temperature of 25.degree.-60.degree. C. an even binder phase removal without deep penetration is achieved.

Abstract: Metallic iron particles are added to an aqueous solution containing hexavalent chromium and mechanically agitated. Enough of the surface of the iron particles remains precipitate-free to reduce substantially all the hexavalent chromium to trivalent chromium. Adjustment of pH allows the formation of insoluble precipitates which may be separated from solution using conventional techniques. The properties of the aqueous electrolyte solution are retained, and the solution may be reused.

Abstract: Methods of and apparatus for generating high purity oxygen. Employed for this purpose is a "membrane cell" comprised of a praseodymia-modified, yttria-stabilized zirconia film that is fabricated onto a porous support, typically a tube of calcia-stabilized zirconia. This cell has the capability of "pumping" oxygen. As a consequence, oxygen in a pressurized fluid stream on the outer face of the membrane can be extracted from that stream and pumped as oxygen ions through the membrane without parasitic electric power and then released on the opposite side of the porous support tube as pure (electrolytic grade) oxygen. Extraction of pure oxygen continues as long as an oxygen partial pressure differential is maintained across the mixed conduction, "shorted" membrane. Oxygen thus produced can be used in industrial processes--for example, in coal gasification--or for other purposes.

Abstract: A device for electrically nucleating a supercooled melt of heat storage medium to artificially induce crystallization. The device includes a metallic electrode to which a rigid cover member is secured in tight mechanical contact therewith. A trace of a hydrate of salt forming the heat storage medium is retained in the form of molecular clusters between the electrode and the rigid member. Upon application of an electric voltage, the molecular clusters grow into crystal nuclei to trigger crystallization. A method of making the electrode assembly is also disclosed.

Abstract: Silver is recovered from solutions containing the same, e.g. photographic processing solutions, in an electrolytic cell including an anode, a removable cathode and electrical connectors therefore on the exterior of the cell. The removable cathode is circular in configuration and encircles the anode. On the interior of the cell, electrical contact is made around the upper end of the cathode by means of an annular contact surface providing a large area of contact and minimizing the risk of occurrence of a corrosive connection. The upper end of the cathode is shaped for deformation, preferably in the form of castellations, and is clampingly pressed against the contact surface by a frusto-conical extension of the lid of the cell. The lid fits in threadwise engagement within the opening to the cell through which the cathode can be removed.

Abstract: An apparatus and method especially adapted for electropolishing reactive metal workpieces which require aggressive electrolytes. It incorporates a single, closed, pressure-tight polishing chamber into which metal workpieces are placed for a multi-step operation. All electrolyte cleaning and rinse fluids are pumped in and out of the chamber as required for sequential operations, and vacuum assisted purging and dying removes the electrolyte or polishing residue from the chamber after each step.

Abstract: An object of the present invention is to provide a water electrolyzer, which has higher electrolyzing efficiency and smaller size than conventional ones. In an electrolyzing tank, at least three cylindrical electrodes, each of which has different polarity with respect to adjacent one, are arranged concentrically with cylindrical partitions. Surface area of the one cylindrical electrode, which is provided between other two, is equal to the sum of surface area of an outer face of the inner cylindrical electrode and that of an inner face of the outer cylindrical electrodes, so that maximum electrolyzing efficiency can be gained.

Abstract: Superstructure for a very high power electrolysis cell for the production of aluminum using the Hall-Heroult process. The cell being formed of a heat-insulated metal casing of elongated parallelepipedic shape. The said superstructure comprising at least one rigid beam disposed along the long length of the casing, resting on supports, and supporting in particular the anodic frame structure to which are connected on the one hand the current risers coming from the preceding cell in the series and on the other hand the anode rods, characterized in that each rigid beam rests only upon supports placed between its ends, termed intermediate gantries. In that each anodic frame structure associated with each rigid beam includes electrical and mechanical connection or connectors to the anode completely fixed to the anodic frame structure and ensuring the contact and the clamping of each anode rod against it following lateral engagement and positioning of each rod in the corresponding connector.

Abstract: A method for polishing a substrate having at least one micro-sized structure. The method includes identifying a first region of the substrate on which a micro-sized structure is to be located. The first region is the region in which polishing is desired. A second region of the substrate, in which polishing is not desired, is also identified. An adhesion promoter is optionally applied to the substrate. The second region of the substrate is coated with a selected coating material that does not degrade substantially when exposed to a selected electrolyte. Material is removed from the first region, exposing a micro-sized structure. The coating material may be removed by the same machining process that forms the micro-sized structure. The substrate is submerged in the selected electrolyte so that the first region is exposed to the electrolyte. The first region of the substrate is electropolished. The coating is then optionally removed.