Abstract: Connection of the leads for a thermoelectric module is readily accomplished, and after connection, the tensile strength of the connection is enhanced. One ends of the front and back side lead patterns for the thermoelectric module, formed on a support plate, are connected by solder to a Cu rod provided at an end of a group of thermoelectric semiconductor elements affixed to the support plate. After the front end of the lead for the thermoelectric module is bent and passed from the side of the front lead pattern through a through hole formed between the front and back side lead patterns, the front end is connected to the back side lead pattern by solder.