Abstract: In a method and an appliance for manufacturing a blister pack having a carboard inlay (blister cardboard pack) a blister pack is provided as an endless tape having the products sealed in blisters. At a unification station a cardboard inlay having recesses for the blisters of the blister pack and having in the direction of conveyance of the blister pack substantially the length of a blister cardboard pack, is placed true-to-size on the blister pack tape, the recesses of the cardboard inlay surrounding the blisters of the blister pack. By a feed pawl, a holding collet and outfeed rollers the blister pack tape is fed to the unification station incrementally and further conveyed incrementally after placement of the cardboard inlay. In a sealing station the cardboard inlay is sealed to the blister pack tape. Subsequently the individual blister cardboard packs are separated from the blister cardboard pack tape in a cutting station.