Abstract: A compound of Formula I or Formula II wherein Y is selected from the group consisting of O, S, and NRN; and (a) L1 and L2 are the same or different and are each a mono-anionic bidentate ligand; and R is selected from the group consisting of hydrogen, deuterium, halogen, alkyl, cycloalkyl, heteroalkyl, heterocycloalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carboxylic acid, ether, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; or (b) R joins with L1 of the Formulae I or II to form a ring B1 of formula B and formula C, respectively, and L2 is L3 and L3 is a tridentate ligand of formula D wherein ring C, ring D, and ring E are each independently selected from the group consisting a 5-membered aryl, a 5-membered heteroaryl, a 6-membered aryl, and a 6-membered heteroaryl; X1 to X4 are independently selected from C or N, and no more than two of the X1 to X4 is N; Z1 to Z7 are

Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode; a second electrode disposed to be opposed to the first electrode; and an organic photoelectric conversion layer provided between the first electrode and the second electrode. The organic photoelectric conversion layer has a domain of one organic semiconductor material therein. The domain of the one organic semiconductor material has a percolation structure in which the domain vertically extends in the organic photoelectric conversion layer in a film-thickness direction, and has a smaller domain length in a plane direction of the organic photoelectric conversion layer than a domain length in the film-thickness direction of the organic photoelectric conversion layer.

Abstract: Disclosed are an N-type semiconductor composition including fullerene or a fullerene derivative; and fullerene subunit derivative represented by Chemical Formula 1, and a thin film, an organic photoelectric device, an image sensor and an electronic device including the same. In Chemical Formula 1, X, Cy and R1 to R8 are the same as defined in the detailed description.

Abstract: A method for transferring light emitting elements during manufacture of a display panel includes providing light emitting elements; providing a first electromagnetic plate defining adsorption positions; providing a receiving substrate defining receiving areas; energizing the first electromagnetic plate to magnetically adsorb one of the light emitting elements at each adsorption position; facing the first electromagnetic plate to the receiving substrate; and transferring the light emitting elements to one corresponding receiving area of the receiving substrate.

Abstract: An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

Abstract: A substrate processing device is provided. A chamber has a side wall part and a top wall part and contains a substrate holding part. A first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned. A second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber. A control unit controls the first and second gas supply part. The second gas is a gas different from oxygen and an allotrope of oxygen. The second gas supply part has an air feeding port part which is positioned on an upward side of a holding position of a substrate by the substrate holding part in a vertical direction and is positioned on an outward side of the substrate holding part in a horizontal direction.

Abstract: There is provided a substrate processing apparatus including: a processing container having a vacuum atmosphere formed therein; a stage provided within the processing container and configured to place a substrate on the stage; a film-forming gas supply part configured to supply a film-forming gas for forming an organic film on the substrate placed on the stage; and a heating part configured to heat the substrate placed on the stage in a non-contact manner so as to remove a surface portion of the organic film.

Abstract: A manufacturing method of a tandem OLED device is provided, including the following steps: providing an anode; using an ink printing technology to form an organic electroluminescence component on the anode; furthermore, the organic electroluminescence component includes a plurality of organic electroluminescence units disposed in stacks, and each of the organic electroluminescence units includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer which are disposed sequentially; and forming the cathode on a side of the organic electroluminescence component away from the anode.

Abstract: A thermally activated delayed fluorescent material, a method of fabricating the same, and an electroluminescent device are provided. An electron donor and an electron acceptor of the thermally activated delayed fluorescent material are connected with each other by a hexatomic ring. Thus, luminous efficiency of the thermally activated delayed fluorescent material can be improved.

Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

Abstract: An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.

Abstract: There is provided a metal encapsulation structure and a production method thereof, an encapsulation method for a display panel, and a display device. This production method comprises steps of: providing a metal film having a first surface and a second surface opposite to the first surface; forming a silane film on the first surface of the metal film, wherein a surface of the silane film away from the metal film has an active group; and attaching the first surface formed with the silane film to an adhesive layer, so as to react and bond the active group and the adhesive layer.

Abstract: The invention discloses a display panel including a first section of a first power trace and a second power trace, an active region and a non-display region, a bending region, and a fanout routing region and a component disposing region; the first section of the first power trace connected to a second section of the first power trace disposing within the component disposing region; and the first section of the second power trace connected to a second section of the second power trace disposing within the component placement region by at least one set of second connection sub-traces disposed within the bending region. The invention changes power line structure of the display panel, and utilizes the second connecting sub-lines for, bridging so that part of the traces can be bent to backside of the display panel, thereby achieving the bottom border of the display to have narrow borders.

Abstract: An organic light-emitting material and the manufacturing method thereof, and an organic light-emitting device are disclosed. The organic light-emitting material includes a benzophenanthrene derivative, which has good planarity and strong visible ?-?* absorption ability and has a high quantum yield of blue light-emitting capability as well. Therefore, a benzophenanthrene derivative having a large ?-conjugated system has high-efficiency electron transporting properties, and its high electron-withdrawing group increases electron mobility rate and effectively improve the light-emitting efficiency of the organic light emitting device.

Abstract: The present application provides display substrate having a display area and a peripheral area. The display substrate includes a base substrate; a plurality of light emitting elements on the base substrate and in the display area; an encapsulating layer on a side of the plurality of light emitting elements distal to the base substrate to encapsulate the plurality of light emitting elements; and a first barrier layer on the base substrate and in the peripheral area and forming a first enclosure substantially surrounding a first area. The first barrier layer includes an up-conversion material configured to convert an incident light into an ultraviolet light. The encapsulating layer includes a first organic encapsulating sub-layer on the base substrate.

Abstract: A workpiece-separating device includes a holding member configured to detachably hold one of a workpiece or a supporting body of a laminated body and a light irradiation part configured to perform light irradiation on a separating layer, the holding member including: a stage facing one of the workpiece or the supporting body, a fixed supporting part projecting from the stage toward the laminated body and including a still suction pad immovable in a projection direction, and a movable supporting part projecting from the stage toward the laminated body and including a response suction pad that is movable in a projection direction and elastically deformable, a plurality of the fixed supporting parts and a plurality of the movable supporting parts disposed in a dispersed manner, and the plurality of response suction pads project toward the laminated body further than the plurality of still suction pads.

Abstract: A polycyclic aromatic compound in which a plurality of aromatic rings are connected by a boron atom and an oxygen atom, a sulfur atom or a selenium atom and substituted by a specific aryl such as anthracene, is useful as a material for an organic device. By the polycyclic aromatic compound, an organic EL device having at least one of efficiency and device life can be provided.

Abstract: An organic compound containing boron and uses thereof, an organic mixture, and an organic electronic device, the structure of said organic compound containing boron being as shown in formula (1). The substituents in formula (I) have the same definitions as in the description.

Abstract: An array substrate, a manufacturing method of an array substrate, and a display panel are provided. The array substrate includes: a deformable substrate, the deformable substrate including a first region and a second region, the first region being provided with a plurality of voids, the second region being a region of the deformable substrate not provided with the plurality of voids; an electronic element on the second region of the deformable substrate.

Abstract: The present application discloses an array substrate, a display apparatus and a method of fabricating an array substrate. The array substrate has a plurality of first bottom-gate type thin film transistors each of which including a metal oxide active layer and a plurality of second bottom-gate type thin film transistors each of which including a silicon active layer.