Patents Examined by Dung Van Ngyuen
  • Reclamation method of semiconductor wafer
    Patent number: 8092278
    Abstract: Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: January 10, 2012
    Assignee: Sumco Corporation
    Inventor: Yasunori Yamada