Patents Examined by E. To
  • Patent number: 11974493
    Abstract: A flexible substrate has at least one bendable region. The flexible substrate includes a flexible base, a first electrode layer disposed on the base, a first insulating layer disposed on a side of the first electrode layer away from the base, and a second electrode layer disposed on a side of the first insulating layer away from the base. The first electrode layer includes at least one first detection electrode, and the second electrode layer includes at least one second detection electrode. An orthogonal projection of a first detection electrode on the base overlaps at least partially with an orthogonal projection of a second detection electrode on the base. A region where orthogonal projections of the first detection electrode and the second detection electrode on the base are located overlaps with a bendable region.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: April 30, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hongwei Tian, Yanan Niu, Dong Li, Ming Liu, Zheng Liu
  • Patent number: 11974448
    Abstract: The present disclosure provides a quantum dot light emitting diode, including: a first electrode, a second electrode, a quantum dot light emitting layer between the first electrode and the second electrode, at least one electron transport layer between the quantum dot light emitting layer and the first electrode, and an electron contribution layer between the electron transport layer of the at least one electron transport layer closest to the first electrode and the quantum dot light emitting layer; a material of the electron contribution layer includes a metal material. The embodiment of the present disclosure also provides a method for manufacturing the quantum dot light emitting diode and a display panel.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: April 30, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jingwen Feng, Yichi Zhang
  • Patent number: 11974441
    Abstract: A 3D memory array in which epitaxial source/drain regions which are horizontally merged and vertically unmerged are used as source lines and bit lines and methods of forming the same are disclosed. In an embodiment, a memory array includes a first channel region over a semiconductor substrate; a first epitaxial region electrically coupled to the first channel region; a second epitaxial region directly over the first epitaxial region in a direction perpendicular to a major surface of the semiconductor substrate; a dielectric material between the first epitaxial region and the second epitaxial region, the second epitaxial region being isolated from the first epitaxial region by the dielectric material; a gate dielectric surrounding the first channel region; and a gate electrode surrounding the gate dielectric.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Feng Young, Sai-Hooi Yeong, Chih-Yu Chang, Chi On Chui, Yu-Ming Lin
  • Patent number: 11974384
    Abstract: Consumables for cutting torches include consumables that define a parallel plasma channel and/or a steep, elongated plasma chamber. Additionally, the consumables may define smooth, rounded edges between different geometries of the plasma channel (e.g., at transitions between straight and angles sections) and/or between the plasma channel and the plasma chamber. That is, the consumables may provide a plasma channel that does not converge, diverge, or define any corners and/or a plasma channel that transitions to the plasma chamber without defining any corners.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 30, 2024
    Assignee: THE ESAB GROUP INC.
    Inventor: Jacob Farnham
  • Patent number: 11974431
    Abstract: The present disclosure provides a method for forming a three-dimensional memory device. The method can comprise forming a film stack with a plurality of dielectric layer pairs on a substrate, forming a channel structure region in the film stack including a plurality of channel structures, and forming a first staircase structure in a first staircase region and a second staircase structure in a second staircase region. Each of the first staircase structure and the second staircase structure can include a plurality of division block structures arranged along a first direction. A first vertical offset defines a boundary between adjacent division block structures. Each division block structure includes a plurality of staircases arranged along a second direction that is different from the first direction. Each staircase includes a plurality of steps arranged along the first direction.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: April 30, 2024
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Zhong Zhang, Wenyu Hua, Zhiliang Xia
  • Patent number: 11974355
    Abstract: Provided are an indication information sending method, apparatus and system, a storage medium, and an electronic device, where the indication information sending method includes: sending, by a first access and mobility management function (AMF), first indication information to a first target network element, where the first indication information is used for indicating whether a packet data unit (PDU) session is capable of interworking with a target network system.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: April 30, 2024
    Assignee: ZTE Corporation
    Inventors: Zhendong Li, Shuang Liang
  • Patent number: D1024584
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: April 30, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Byeongwook Kim, Dongsoon Kim, Jonghak Lee, Sungkyung Kim
  • Patent number: D1024890
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 30, 2024
    Inventor: Xiangyun Qian
  • Patent number: D1024894
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: April 30, 2024
    Assignee: QINGDAO YUMETAL NEW INDUSTRY CO., LTD
    Inventor: Shouhua Yu
  • Patent number: D1024902
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 30, 2024
    Assignee: Polaris Industries Inc.
    Inventor: Michael Hritz
  • Patent number: D1024906
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Casey Sennott, Michel H. J. Laverne, Ryan Thomas Davis
  • Patent number: D1024911
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: April 30, 2024
    Assignee: INALFA ROOF SYSTEMS GROUP B.V.
    Inventors: Jos Sanders, Thomas Albers
  • Patent number: D1024920
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: April 30, 2024
    Assignee: K-MARINE CO., LTD.
    Inventors: Chan Woo Lee, Hye Sook Jung
  • Patent number: D1024921
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: April 30, 2024
    Inventor: Shengye Yang
  • Patent number: D1024922
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: April 30, 2024
    Inventor: Xinhou Long
  • Patent number: D1024923
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: April 30, 2024
    Inventor: Abhinav S. Verma
  • Patent number: D1024924
    Type: Grant
    Filed: December 27, 2023
    Date of Patent: April 30, 2024
    Assignee: Shenzhen Kuake Zhichuang Technology Co., Ltd.
    Inventor: Yali Shi
  • Patent number: D1024959
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 30, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh
  • Patent number: D1024961
    Type: Grant
    Filed: February 2, 2022
    Date of Patent: April 30, 2024
    Assignee: Hitachi, Ltd.
    Inventors: Tetsuya Suto, Akihiro Namba, Akeshi Takahashi, Makoto Ito
  • Patent number: D1024967
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck