Abstract: A shielded ultra-miniature cable suitable for example to provide low voltage connections, the cable including one or more low voltage conductors surrounded by an insulation coating, the insulation coated conductors being surrounded by a semiconductive coating providing a ground shield. The insulation and semiconductive coating are formed from thermoplastic materials of limited thickness to permit soldering of said shielded cable without requiring prior removal of said semiconductive and insulation coatings and to maintain minimum dimensions for the cable.