Patents Examined by Eddie Leg
  • Packaging substrate for electronic elements and electronic device having packaged structure
    Patent number: 6781221
    Abstract: A packaging substrate for electronic elements comprises a first area for receiving an electronic element through flip chip bonding and a second area for receiving an electronic element through wire bonding. The first area has a bonding pad having applied on a surface thereof a coating of a solder material. The packaging substrate is used in the production of an electronic device having mounted thereon electronic elements such as semiconductor chips.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: August 24, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yoshihiro Yoneda