Patents Examined by Eizabeth Collister
  • Patent number: 9899683
    Abstract: Disclosed herein is an electrolytic copper foil in which an average diameter of a pore which is a region between surface elements protruding from a matte side is 1 mm to 100 nm. The electrolytic copper foil has high elongation while maintaining low roughness and high strength and thus may be used in a current collector of a medium-large size lithium ion secondary battery and a semiconductor packaging substrate, and the like, for tape automated bonding (TAB) which is used in a tape carrier package (TCP).
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: February 20, 2018
    Assignee: Iljin Materials Co., Ltd.
    Inventors: Sun Hyoung Lee, Tae Jin Jo, Seul Ki Park, Ki Deok Song