Abstract: Disclosed herein is an electrolytic copper foil in which an average diameter of a pore which is a region between surface elements protruding from a matte side is 1 mm to 100 nm. The electrolytic copper foil has high elongation while maintaining low roughness and high strength and thus may be used in a current collector of a medium-large size lithium ion secondary battery and a semiconductor packaging substrate, and the like, for tape automated bonding (TAB) which is used in a tape carrier package (TCP).
Type:
Grant
Filed:
March 6, 2015
Date of Patent:
February 20, 2018
Assignee:
Iljin Materials Co., Ltd.
Inventors:
Sun Hyoung Lee, Tae Jin Jo, Seul Ki Park, Ki Deok Song