Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

Abstract: A micro-abrasion device includes a base station, a handpiece configured to spray a powder onto skin, a flexible supply pipe configured to supply powder from the base station to the handpiece, a flexible return pipe configured to return powder from the handpiece to the base station, a first reservoir containing a powder to be supplied to the handpiece via the flexible supply pipe and a first reservoir endpiece initially closed by a puncturable seal, and a second reservoir configured to collect powder returning via the flexible return pipe. The first reservoir and the second reservoir are assembled together and mounted onto the base station during use. Once mounted, the seal is punctured. Preferably the first and second reservoirs are configured so that they cannot be interchangeably mounted on the base station. This prevents reuse of the collected used powder in the second reservoir.

Abstract: The grinding machine (10) according to the invention serves in particular for the machining or production of tools. It comprises a machine bed 11 and a workpiece spindle (14) arranged thereon, which receives the workpiece (13) to be machined, as well as a grinding station (19) arranged next to the workpiece, the station having a grinding spindle for the reception of a grinding tool (20), and is provided with a workpiece guide system (23) arranged at the machine bed for the support of the workpiece at the grinding location (21).

Abstract: The present invention provides a holder (20) for wafers (14) which makes it possible to more easily manipulate the wafer (14) and makes it more suitable than prior art devices for to liquid handling, wafer handling and on-wafer manipulation of substances, while it also makes it possible to align the wafer (14) accurately and furthermore allows to create a well controlled ambient in the neighbourhood of the wafer (14).

Abstract: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table.