Patents Examined by Ellen E. Kim
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Patent number: 11036019Abstract: A modular multi-positionable tray assembly (420) for mounting within a chassis (10) of a telecommunications panel (100) is disclosed. The multi-positionable tray assembly (420) may include support arm structure (423) having a first support arm (424) and a second support arm (480) that pivotally supports a tray (422) and that allows the tray assembly (420) to be installed and removed from the chassis (10). The tray (422) and the support arm structure (423) cooperatively define a cable routing pathway (208) that extends through a pivot axis (A1) defined by the tray and the support arm. To protect the cables (300) and to increase accessibility of cables (300) within the portion of the cable routing pathway (208) defined by the tray (422), a bend radius limiter (460) can be provided that is rotatably mounted to the tray (422). The tray (422) can also be provided with attachment features for allowing the tray (422) to accept various telecommunications components, such as splice trays and splitter trays.Type: GrantFiled: December 9, 2019Date of Patent: June 15, 2021Assignee: CommScope Connectivity Belgium BVBAInventors: Johan Geens, Pieter Vermeulen, Eric Marcel M. Keustermans
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Patent number: 11036001Abstract: One embodiment is directed to a compact system for scanning electromagnetic imaging radiation, comprising a first waveguide and a second waveguide, each of which is operatively coupled to at least one electromagnetic radiation source and configured such that output from the first and second waveguides is luminance modulated and scanned along one or more axes to form at least a portion of an image.Type: GrantFiled: December 26, 2019Date of Patent: June 15, 2021Assignee: Magic Leap, Inc.Inventors: Brian T. Schowengerdt, Matthew D. Watson
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Patent number: 11022467Abstract: An improved optical fiber distributed acoustic sensor system uses an optical fiber having reflector portions distributed along its length in at least a first portion. The reflector portions are positioned along the fiber separated by a distance that is equivalent to twice the distance an optical pulse travels along the fiber in a single sampling period of the data acquisition opto-electronics within the sensor system. No oversampling of the reflections of the optical pulses from the reflector portions is undertaken. The sampling points for data acquisition in the sensor system are aligned with the reflections that arrive at the sensor system from along the sensing fiber. Adaptive delay componentry adaptively aligns the reflected optical signals (or their electrical analogues) with the sampling points. Control over the sampling points can re-synchronise the sampling points with the returning reflections. Reflection equalisation componentry may reduce the dynamic range of the returning reflections.Type: GrantFiled: January 5, 2018Date of Patent: June 1, 2021Assignees: Silixa Ltd., Chevron U.S.A. Inc.Inventors: Sergey Shatalin, Julian Dajczgewand, Mahmoud Farhadiroushan, Tom Parker
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Patent number: 11022790Abstract: An eyepiece includes a substrate and an in-coupling grating patterned on a single side of the substrate. A first grating coupler is patterned on the single side of the substrate and has a first grating pattern. The first grating coupler is optically coupled to the in-coupling grating. A second grating coupler is patterned on the single side of the substrate adjacent to the first grating coupler. The second grating coupler has a second grating pattern different from the first grating pattern. The second grating coupler is optically coupled to the in-coupling grating.Type: GrantFiled: June 11, 2020Date of Patent: June 1, 2021Assignee: Magic Leap, Inc.Inventors: Kang Luo, Vikramjit Singh, Nai-Wen Pi, Shuqiang Yang, Frank Y. Xu
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Patent number: 11002923Abstract: Connector assemblies are described herein. For example, a connector assembly including: a housing configured to accept a first ferrule and a second ferrule. The connector assembly may also have a push/pull clip that is configure to depress a protrusion that rotates down a connector device to remove the connector assembly from an adapter. The push/pull clip is integrated with a cable boot assembly that allows a user to apply a distal force to remove or insert the connector assembly into the adapter housing. The push/pull clip is configured for use to release a MPO and LC connector type from an adapter.Type: GrantFiled: September 12, 2019Date of Patent: May 11, 2021Assignee: Senko Advanced Components, Inc.Inventors: Man Ming Ho, Kazuyoshi Takano
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Patent number: 10996414Abstract: A butt closure base includes a base housing defining a plurality of cavities. A first gel is disposed in each of the plurality of cavities. The butt closure base further includes a plurality of wedge assemblies, each of the plurality of wedge assemblies removably insertable into one of the plurality of cavities. Each of the plurality of wedge assemblies includes an outer cover, a second gel, and a main pressure plate in contact with the second gel. The main pressure plate is movable along a longitudinal axis to apply pressure to the second gel. Each of the plurality of wedge assemblies further includes a latch assembly. The latch assembly includes an adjustable tab and a stop member movable between a first position which limits movement of the adjustable tab and a second position in which movement of the adjustable tab is not limited by the stop member.Type: GrantFiled: March 23, 2020Date of Patent: May 4, 2021Assignee: AFL Telecommunications LLCInventors: Eddie Kimbrell, David Wittmeier
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Patent number: 10996406Abstract: The multichannel fiber optic connector, adapter, and contact retention method is disclosed. The connector includes a load carousel which enables handling, locating, retention, and, where needed, spring-loading of the plurality of single-fiber fiber optic ferrules supported within the connector, and the connector itself provides for independent axial and radial alignment of the fiber optic contacts. The adapter includes a plurality of optical alignment sleeves, and mating interfaces for two different connector types on differing sides of the adapter, wherein the fiber count of one connector type is an integral multiple of the fiber count of the other connector type, and wherein the contact pattern of the first connector type is repeated the same integral number of times within the contact pattern of the second connector type.Type: GrantFiled: February 24, 2020Date of Patent: May 4, 2021Assignee: Nest Technical Services, Inc.Inventors: Daniel Matthew Smith, William Medearis Smith
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Patent number: 10996537Abstract: An optical transmitter comprises a directly coupled MZ interferometer and driver circuit. The MZ interferometer comprises a pair of differentially driven MZ electrodes configured to impart RF signals to light travelling through respective arms of the interferometer, and to receive DC bias as a positive voltage via lower n-type cladding of the MZ interferometer. The lower n-type cladding is at a different positive DC potential to an upper plane RF ground of the MZ interferometer, but the lower n-type cladding and the upper plane RF ground have similar AC potential. The MZ interferometer also comprises a pair of resistors in series configured to provide differential RF termination of the MZ electrodes; and a capacitive coupling between a virtual ground formed at a centre point between the pair of resistors and an RF ground configured to provide common-mode RF termination. The DC supply for the driver circuit is applied to the centre point of the RF termination.Type: GrantFiled: December 13, 2019Date of Patent: May 4, 2021Assignee: Lumentum Technology UK LimitedInventors: Samuel Davies, Andrew John Ward
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Patent number: 10996541Abstract: A display includes a plurality of elongated waveguides positioned adjacent to each other and extending along a first direction, a plurality of elongated upper electrodes positioned adjacent to each other on a first side of the waveguides and extending along the first direction, and a plurality of elongated lower electrodes positioned adjacent to each other on a second side of the waveguides opposite the first side and extending along a second direction transverse to the first direction. At least one of the waveguides comprises nonlinear materials having a third order susceptibility.Type: GrantFiled: October 11, 2019Date of Patent: May 4, 2021Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Sean P. Rodrigues, Ercan M. Dede
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Patent number: 10989887Abstract: Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.Type: GrantFiled: September 3, 2018Date of Patent: April 27, 2021Assignee: Agency for Science, Technology and ResearchInventors: Teck Guan Lim, Surya Bhattacharya
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Patent number: 10989886Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.Type: GrantFiled: December 6, 2019Date of Patent: April 27, 2021Assignee: Waymo LLCInventors: Pierre-Yves Droz, David Schleuning
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Patent number: 10989867Abstract: A fiber-based sensor and a method of forming a fiber-based sensor using microsphere lithography techniques in which a microsphere array is applied to a surface of a tip of an optical fiber to provide for microsphere lithography fabrication of a desired pattern on the tip of the optical fiber. The characteristics of the pattern define sensing capabilities of the sensor to provide for chemical and/or biological sensing.Type: GrantFiled: April 15, 2020Date of Patent: April 27, 2021Assignee: The Curators of the University of MissouriInventors: Edward C. Kinzel, Mahmoud Almasri, Chuang Qu, Ibrahem Jasim, Jiayu Liu
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Patent number: 10976506Abstract: An optical transceiver according to an embodiment includes an optical receptacle, two optical sub-assemblies, and a circuit board having a upper surface, on which the optical sub-assembly on the rear side is installed on the opposite side of an external connector to the optical receptacle on the upper surface and the optical sub-assembly on the front side is installed between the optical receptacle and the optical sub-assembly on the rear side on the upper surface. Each of the optical sub-assemblies includes an optical sub-assembly substrate on which an optical device is mounted, a lens part that covers the optical device and that is optically coupled to the optical receptacle, and a frame. A part of the frame of the optical sub-assembly on the front side is pressed by the optical sub-assembly substrate of the optical sub-assembly on the rear side toward the circuit board.Type: GrantFiled: April 16, 2020Date of Patent: April 13, 2021Assignee: Sumitomo Electric Industries, Ltd.Inventor: Takashi Matsui
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Patent number: 10969545Abstract: An apparatus and method for temperature compensation, belonging to the technical field of optical communications, and particularly an apparatus and method for implementing bilinear temperature compensation of an arrayed waveguide grating is disclosed. The apparatus consists of two drivers. A first driver performs linear compensation in a range lower than normal temperature 25° C. to ?40° C. (low-temperature area) or a range higher than ambient temperature 25° C. to 85° C. (high-temperature area). A second driver is used to realize nonlinear compensation of superimposed effect of AWG chip wavelength/temperature in another temperature area. Two parts of the chip after being divided have different relative displacement/effective compensation amounts in different temperature ranges, having over-compensation in the high-temperature area and under-compensation in the low-temperature area, so that a center wavelength of the AWG chip appears as two gentle curves with temperature change.Type: GrantFiled: December 25, 2017Date of Patent: April 6, 2021Inventors: Jiuhong Ling, Fan Wu, Xiangjian Kong, Changan Li, Jiayan Hu
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Patent number: 10962709Abstract: An optical fiber according to an embodiment includes a core having a single-peaked and graded refractive index profile, an inner cladding surrounding the core, and an outer cladding surrounding the inner cladding. The inner and outer claddings have refractive indices lower than the maximum refractive index of the core. A photosensitive region constituted by the core and the inner cladding contains a photosensitive material. The inner cladding has an outer diameter one time or more and two times or less the MFD of an LP01 mode in a 1310-nm wavelength band.Type: GrantFiled: September 10, 2020Date of Patent: March 30, 2021Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC OPTIFRONTIER CO., LTD.Inventors: Shigehiro Nagano, Masakazu Shigehara, Masayuki Yamazaki
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Patent number: 10962717Abstract: A grating coupler having first and second ends for coupling a light beam to a waveguide of a chip includes a substrate configured to receive the light beam from the first end and transmit the light beam through the second end, the substrate having a first refractive index n1, a grating structure having curved grating lines arranged on the substrate, the grating structure having a second refractive index n1, wherein the curved grating lines have line width w and height d and are arranged by a pitch ?, wherein the second refractive index n2 is less than first refractive index n1, and a cladding layer configured to cover the grating structure, wherein the cladding layer has a third refractive index n3.Type: GrantFiled: February 28, 2020Date of Patent: March 30, 2021Assignees: Mitsubishi Electric Research Laboratories, Inc., Mitsubishi Electric CorporationInventors: Keisuke Kojima, Mitsunobu Gotoda, Toshiaki Koike-Akino, Muhammad Tahersima
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Patent number: 10955630Abstract: An optical fiber cable including an optical fiber ribbon in is pipe, wherein the ribbon includes at least two optical fibers arranged side by side, and wherein at least two of the optical fibers are bonded intermittently along a length of the fibers.Type: GrantFiled: November 18, 2019Date of Patent: March 23, 2021Inventors: Joseph Cignarale, Doug Baker, Yoshio Hashimoto, Ken Osato
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Patent number: 10955628Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.Type: GrantFiled: June 26, 2019Date of Patent: March 23, 2021Assignee: Lumentum Operations LLCInventors: Georges Turcotte, Adonios Bitzanis
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Patent number: 10948666Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).Type: GrantFiled: May 2, 2018Date of Patent: March 16, 2021Assignee: SICOYA GMBHInventors: Stefan Meister, Moritz Grehn, Sven Otte, Sebastian Höll
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Patent number: 10950107Abstract: A detection system for measuring one or more conditions within a predetermined area includes a fiber harness having at least one fiber optic cable for transmitting light, a plurality of nodes operably connected to the at least one fiber optic cable arranged to measure one or more conditions within the predetermined area, a coupling to connect each node of the plurality of nodes to the at least one fiber optic cable, and a control system operably coupled to the fiber harness such that scattered light associated with the node is transmitted to the control system, wherein the control system analyzes the scattered light to determine at least one of a presence and magnitude of the one or more conditions at the node.Type: GrantFiled: November 8, 2017Date of Patent: March 16, 2021Assignee: CARRIER CORPORATIONInventors: Michael J. Birnkrant, Jennifer M. Alexander, Peter R. Harris