Patents Examined by Elvin G. Enad
  • Patent number: 11527342
    Abstract: In an exemplary embodiment, a coil component includes: a base part 10 containing a magnetic material; a flat coil 30 embedded in the base part 10, formed by a wound coil conductor 32 where an end part 34 and an end part 36 are located on the inner side and on the outer side of the windings, respectively; a lead conductor 50 and a lead conductor 52 connected to the end part 34 and the end part 36, respectively; an external electrode 60 and an external electrode 62 provided on the surface of the base part 10 and connected to the lead conductor 50 and the lead conductor 52, respectively. The lead conductor 50 is connected to the external electrode 60 in an area 42 on the inner side of the flat coil 30 as viewed from above in the axial direction of the flat coil 30.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: December 13, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Naoya Terauchi, Shuichi Machida
  • Patent number: 11527351
    Abstract: A surface-mount inductor includes an element assembly having a core, a coil, and a magnetic material; and a pair of external terminals on a mounting surface of the element assembly. The core has a base portion and a columnar portion on an upper surface of the base portion. The coil is disposed on the base portion, and has a wound portion on the columnar portion, and a pair of extended portions extended from the wound portion. The base portion has at least one ridge portion at which the upper surface and a side surface are in linear contact with each other. The pair of extended portions are each disposed such that a flat surface portion connected to a flat surface portion disposed at an inner side portion of a conductive wire located at an outer peripheral portion of the wound portion is close to the ridge portion.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: December 13, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kozo Sato, Mikiya Aoki, Hiroyuki Aoki, Kazuhisa Kitamura
  • Patent number: 11527349
    Abstract: Inductor device comprising a rectangular prismatic electro-insulating support (10) with three pairs of parallel outer faces (11) defining orthogonal axis (X, Y, Z), and defining eight corners; a rectangular prismatic magnetic core (20) supported by said electro-insulating support (10); and three conductor wire windings (DX, DY, DZ) wound around the three axis (X, Y, Z) surrounding the magnetic core (20); wherein the magnetic core (20) is a hollow magnetic core (20) composed by three pairs of sheets (21), each pair of sheets (21) being composed by two parallel sheets (21) facing each other perpendicular to one of said axis (X, Y, Z), and wherein each sheet (21) is made of a magnetic material, said sheet (21) being in contact and attached to the electro-insulating support (10) and being in contact with the surrounding orthogonal sheets (21).
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: December 13, 2022
    Inventors: Sergio Cobos Reyes, Claudio Cañete Cabeza, Antonio Rojas Cuevas, Jorge Rodríguez, Francisco Ezequiel Navarro Pérez
  • Patent number: 11515076
    Abstract: A coil device comprising a pair of coil members annularly assembled at two connecting end portions; each coil member comprising a magnetic core, a resin case substantially entirely surrounding the magnetic core, and a coil wound around the resin case; the resin case having connecting means and guide means in the connecting end portion of each coil member; and the connected coil members being adhered to each other in the connecting end portions.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: November 29, 2022
    Assignee: HITACHI METALS, LTD.
    Inventor: Mutsuhito Sakaguchi
  • Patent number: 11509078
    Abstract: A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: November 22, 2022
    Assignee: VITESCO TECHNOLOGIES USA, LLC.
    Inventors: Patrick Su, Kevin D Moore
  • Patent number: 11495383
    Abstract: A multilayer coil component includes a multilayer body that contain a coil. The coil includes coil conductors. A lamination direction of the multilayer body and an axial direction of the coil are parallel to a first main surface. A distance between the coil conductors adjacent to each other in the lamination direction is from 4 ?m to 8 ?m. Each coil conductor includes a line portion and a land portion that is disposed at an end portion of the line portion. The land portions of the coil conductors adjacent to each other in the lamination direction are connected to each other with a via conductor interposed therebetween. A width of the line portion is from 30 ?m to 50 ?m. An inner diameter of each coil conductor is from 50 ?m to 100 ?m.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: November 8, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Atsuo Hirukawa
  • Patent number: 11495398
    Abstract: A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Han Wool Ryu, Sang Kyun Kwon
  • Patent number: 11488770
    Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: November 1, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Seob Lee, Jong Min Lee
  • Patent number: 11482371
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 25, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato, Kazuhiro Ebina, Hiroyuki Tanoue
  • Patent number: 11482364
    Abstract: A component main body has a multilayer structure having a thickness and in which a first dielectric glass layer in which an internal conductor is embedded and having a thickness is interposed between a pair of magnetic layers containing a ferrite material as a primary component, and each of a pair of second dielectric glass layers is disposed on one of principal surfaces of the pair of magnetic layers. First to fourth outer electrodes are disposed on both end portions of the component main body. The thickness of at least one of the pair of second dielectric glass layers that faces a mounting substrate is about 10 ?m to 64 ?m.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: October 25, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Keiichi Tsuduki, Kenji Tanaka, Masashi Matsubara
  • Patent number: 11476034
    Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Hui Jo, Hye Won Jung, Sa Yong Lee
  • Patent number: 11469028
    Abstract: An inductor device includes a first and a second inductor. First inductor includes plural first wires and a first connection member. Second inductor includes plural second wires and a second connection member. Part of first wires are winded/located at a first area, and part of first wires are winded/located at a second area. First and second areas are located on two opposite sides of inductor device. First connection member connects first wire located at first area and located at second area. Part of second wires are winded/located at first area, and part of second wires are winded/located at second area. One terminal of second connection member connects a terminal of second wire at an inner side of inductor device, and another terminal of second connection member is disposed outside inductor device. First and second inductors are symmetrical with respect to a center line of inductor device.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: October 11, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
  • Patent number: 11469036
    Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jong Ik Park
  • Patent number: 11469038
    Abstract: A coil electronic component includes a magnetic body in which internal coil parts are embedded, and a metal shielding sheet disposed on at least one of an upper portion and a lower portion of the magnetic body in a thickness direction, in which permeability of the metal shielding sheet is 100 times or higher than permeability of magnetic metal powder contained in the magnetic body.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Ryong Choi, Il Jin Park, Jung Wook Seo, Jong Ok Jeon, Won Sik Chong, Woo Jin Lee, Jung Young Cho
  • Patent number: 11469030
    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Dong Jin Jeong
  • Patent number: 11456114
    Abstract: A surface-mount inductor comprises a molded body containing a metal magnetic powder; at least one coil buried in the molded body such that lead-out end parts at both ends of the coil are at least partially exposed on a surface of the molded body; and an external terminal formed over an exposed surface of each of the lead-out end parts. A metal magnetic powder exposed portion is formed at least around the exposed surface. The external terminal at least includes a first plating layer formed over the metal magnetic powder exposed portion and the exposed surface of the lead-out end part, and a conductive paste layer formed on the first plating layer and made of a solidified conductive paste. Consequently, the surface mount inductor comprises an external terminal having high connection reliability.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: September 27, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Keita Muneuchi
  • Patent number: 11443885
    Abstract: Embodiments include inductors and methods of forming inductors. In an embodiment, an inductor may include a substrate core and a conductive through-hole through the substrate core. Embodiments may also include a magnetic sheath around the conductive through hole. In an embodiment, the magnetic sheath is separated from the plated through hole by a barrier layer. In an embodiment, the barrier layer is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 13, 2022
    Assignee: Intel Corporation
    Inventors: Kristof Darmawikarta, Srinivas Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee, Sameer Paital, Rahul Jain, Junnan Zhao
  • Patent number: 11437174
    Abstract: An inductor includes a coil substrate, an encapsulation material containing a magnetic material and selectively covering the coil substrate, and first and second external electrodes formed on the exterior of the encapsulation material. The coil substrate includes a laminate of stacked structures each including a conductive track and first and second connection parts on opposite sides of the conductive track in a single wiring layer. The conductive tracks are connected in series to form a helical coil. The first connection parts are connected by a first via to form a first electrode terminal connected to a first end of the helical coil. The second connection parts are connected by a second via to form a second electrode terminal connected to a second end of the helical coil. The first and second external electrodes are connected to the first and second electrode terminals, respectively.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: September 6, 2022
    Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., TOKYO COIL ENGINEERING CO., LTD.
    Inventors: Yasuyoshi Horikawa, Tsukasa Nakanishi, Kazuyuki Okita, Yukihiro Miyasaka
  • Patent number: 11437173
    Abstract: A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun Kim, Seong Min Cho, Eo Jin Choi, Young Ku Lyu, Yong Hui Li
  • Patent number: 11417456
    Abstract: The present disclosure provides a high-voltage transformer and an electronic power apparatus. The high-voltage transformer includes a magnetic core, a secondary coil unit, and a primary coil unit. The secondary coil unit includes a secondary winding; and the primary coil unit includes a primary winding and an insulating portion. The insulating portion forms at least one through hole. At least one primary winding encircle at least one through hole and is wrapped by the insulating portion and fixed in the insulating portion. The magnetic core passes through at least one through hole. A shielding layer is formed on a surface of the insulating portion, and the shielding layer is used for connecting a safety ground and the electrical conductivity of the shielding layer is not more than 5000 S/m.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: August 16, 2022
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventor: Quanliang Zhang