Abstract: Parallel optical interconnects may be used to transmit signals produced by integrated circuits. A parallel optical interconnect may be in the form of a multicore optical fiber and one or more optical coupling assemblies optically connecting a first optical transceiver array and a second optical transceiver array. The multicore optical fiber may have multiple fiber elements with each having a core surrounded by cladding, and the one or more optical coupling assemblies may have refractive and/or reflective elements. In this way, light produced by one transceiver array may be transmitted through the multicore optical fiber and be received by the other transceiver array.

Abstract: A photonic device and related method for forming a photonic device. In some embodiments, a method of fabricating a photonic device includes forming a layer stack over a substrate. In some cases, the layer stack includes a lower cladding layer, a core layer disposed over the lower cladding layer, and an upper cladding layer disposed over the core layer. In some examples, the method further includes patterning the layer stack to form a waveguide for the photonic device. In some cases, the waveguide includes the core layer, and the core layer includes a lateral surface having a convex profile.

Abstract: Systems, devices, and methods are provided for all-optical reconfigurable activation devices for realizing various activations functions using low input optical power. The device and systems disclosed herein include a directional coupler comprising a first phase-shift mechanism and an interferometer coupled to the directional coupler. The interferometer comprises at least one microring resonator and a second phase-shift mechanism coupled to thereto. The interferometer and the directional coupler comprise waveguides formed of a first material, while the microring resonator comprises a waveguide formed of a second material and a third phase-shift mechanism. The second material is provided as a low-loss material having a high Kerr effect and large bandgaps, to generate various nonlinear activation functions. The first, second, and third phase-shift mechanisms are configured to control biases within the disclosed systems and devices to achieve a desired activation function.

Abstract: The light modulator includes a substrate having a main surface including a first area, a second area, and a third area, a first III-V compound semiconductor layer of a first conductivity-type provided on the first area, a second III-V compound semiconductor layer of a first conductivity-type or a second conductivity-type provided on the second area, a core provided on the third area and including a group III-V compound semiconductor, and an electrode connected to the first III-V compound semiconductor layer. The first III-V compound semiconductor layer includes a first portion having a thickness smaller than a thickness of the core in a second direction orthogonal to the main surface and a second portion having a thickness larger than the thickness of the first portion in the second direction. The second portion is disposed between the first portion and the core.

Abstract: Embodiments include an optical system that may be included in a waveguide display. An example optical system includes a first waveguide having a first transmissive diffractive in-coupler (DG1) and a first diffractive out-coupler (DG6) and a second waveguide having a second transmissive diffractive in-coupler (DG2), a reflective diffractive in-coupler (DG3), a second diffractive out-coupler (DG4), and a third diffractive out-coupler (DG5). The second transmissive diffractive in-coupler (DG2) is arranged between the first transmissive diffractive in-coupler (DG1) and the reflective diffractive in-coupler (DG3) in an input region.

Abstract: Cables that include a conductor and an optical fiber. In some embodiments, the cable can include an optical fiber loosely disposed within an enclosure. A conductor layer can be disposed about the enclosure. An insulation layer can be disposed about the at least one conductor layer. An inner layer of armor strength members can be helically disposed about the insulation layer. An outer layer of armor strength members can be helically disposed about the inner layer of armor strength members. The armor strength members in the outer layer of armor strength members can be at an opposite helix compared to the armor strength members in the inner layer of armor strength members. An outer jacket can be disposed about the outer layer. In other embodiments, the cable can include an optical fiber in a coupled electro-optical package, where the conductor layer can be disposed about the electro-optical package.

Abstract: Techniques and mechanisms for facilitating horizontal communication with a photonic integrated circuit (PIC) chip, and a lens structure which is optically coupled thereto. In an embodiment, a PIC chip comprises integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) which are coupled to the integrated circuitry via the photonic waveguides. The PIC chip forms respective first divergent lens surfaces of the IECs, which are each at a respective terminus of a corresponding one of the photonic waveguides. A lens structure, which is adjacent to the IECs, comprises a second divergent lens surface having an orientation which is substantially orthogonal to the respective orientations of the first divergent lens surfaces. In another embodiment, an edge of the PIC chip forms one or more recess structures, and the lens structure comprises one or more tenon portions which each extends into a respective recess structure of the one or more recess structures.

Abstract: A siliconized heterogeneous optical engine. In some embodiments, the siliconized heterogeneous optical engine includes a photonic integrated circuit; an electro-optical chip, on a top surface of the photonic integrated circuit; an electronic integrated circuit, on the top surface of the photonic integrated circuit; an interposer, on the top surface of the photonic integrated circuit; a redistribution layer, on a top surface of the interposer, the redistribution layer including a plurality of conductive traces; and a plurality of protruding conductors, on the conductive traces of the redistribution layer. The electronic integrated circuit may be electrically connected to the electro-optical chip and to a conductive trace of the plurality of conductive traces of the redistribution layer.

Abstract: The optical device includes a substrate and an optical waveguide formed on the substrate, a protrusion portion is formed on the substrate adjacent to the optical waveguide. Accordingly, an optical device which can achieve further suppression of the light propagation loss and higher reliability is provided.

Abstract: A method for establishing optical coupling between spatially separated first and second planar waveguides includes arranging an optical interconnect on the first planar waveguide. The optical interconnect has first and second end portions and an intermediate portion. Each of the end portions has an inverse taper. The second planar waveguide is arranged on the optical interconnect so that the second planar waveguide overlaps with one of the inverse tapered end portions but not the other inverse tapered end portion to thereby enable an adiabatic transition of an optical signal from the first planar waveguide to the second planar waveguide via the optical interconnect. The first and second planar waveguides have different refractive indices at an operating wavelength and the optical interconnect have a higher refractive index at the operating wavelength than the refractive indices of a core of the first planar waveguide and a core of the second planar waveguide.

Abstract: An optical connecting component is an optical connecting component to be connected to another optical connecting component, which includes an optical waveguide component, an alignment component for fixing the optical waveguide component, and a magnetic structure integrated with the alignment component. A positioning structure is provided on a connecting end face of the alignment component, in which the positioning structure determines a relative position between the connecting end face and a connecting end face of an alignment component provided in the other optical connecting component.

Abstract: An optical modulators is disclosed. The optical modulator includes a substrate, an optical waveguide formed on the substrate, a signal electrode formed on the optical waveguide via a first buffer layer and applying a modulation signal to the optical waveguide, and a bias electrode formed on the optical waveguide via a second buffer layer and applying a DC bias to the optical waveguide, the first buffer layer and the second buffer layer are formed in such a way that either one of the first buffer layer and the second buffer layer covers an end surface of the other one of the first buffer layer and the second buffer layer at a boundary part of the first buffer layer and the second buffer layer. Accordingly, an optical modulator with high reliability can be provided.

Abstract: Embodiments of the disclosure relate to a flame retardant composition. The flame retardant composition includes 70 wt % to 90 wt % of at least one polybutylene terephthalate (PBT) resin, 15 wt % to 25 wt % of a flame retardant additive, an ethylene vinyl alcohol (EVOH), an organoclay synergist, and at least one of a PBT chain extender having epoxide functional groups or a reactive compound including at least two functional groups selected from the group consisting of an epoxide, a maleic anhydride, an isocyanate, an acrylate, and an acetate. The flame retardant composition is particularly suitable for buffer tubes of optical fiber cables.

Abstract: A device includes a spot size converter on a substrate. The substrate includes an optical fiber alignment structure formed thereon. The spot size converter is aligned with the optical fiber alignment structure. The spot size converter includes an oxide layer that has a first refractive index and includes a tapered section such that a first end of the spot size converter is smaller than a second end of the spot size converter. The spot size converter also includes a waveguide core in the oxide layer. The waveguide core is tapered and is smaller at the first end than at the second end of the spot size converter. The spot size converter further includes a cladding layer surrounding the oxide layer, the cladding layer having a second refractive index lower than the first refractive index of the oxide layer.

Abstract: Core configuration transformers and methods of making same. A core configuration transformer includes a transforming optical fiber having plurality of routing cores embedded therein. The transforming optical fiber includes a first end face and a second end face. The plurality of routing cores is configured to define a first end face core pattern at the first end face of the transforming optical fiber, and a second end face core pattern at the second end face of the transforming optical fiber that has one or both of a different arrangement of cores or a different polarity of cores.

Abstract: An integrated optical component, including a transparent pad arranged on the upper face of the basic optical component, the transparent pad including a plane mirror at its upper face, and the basic optical component including a convergent mirror at its upper face, the plane and convergent mirrors being arranged such that the light beam is propagated between the internal light gate and the external light gate by passing through the transparent pad by reflection on the plane mirror and by reflection on the convergent mirror.

Abstract: An optic fiber connector assembly, including at least one adapter and at least one connector, is provided. The adapter is correspondingly connected to the connector. The adapter includes a first housing, at least one sleeve disposed in the first housing, at least one bridging portion extending out of a side of the first housing, and at least one locking arm extending from the side and located next to the bridging portion. The sleeve extends from an inside of the first housing to the corresponding bridging portion. The connector includes a second housing, a ferrule disposed in the second housing in a penetrating manner, and a spring abutted between the second housing and the ferrule. The second housing is sleeved onto the bridging portion, the ferrule is inserted into the sleeve, and the locking arm is buckled onto the second housing.

Abstract: A pulling terminal structure includes: a braided tube that includes a pulling part; a housing tube disposed inside the braided tube and that houses an optical connector; and a reinforcement member disposed inside the braided tube and that reinforces an end part of the housing tube.

Abstract: An optoelectronic device. The optoelectronic device including: a silicon platform, including a silicon waveguide and a cavity, wherein a bed of the cavity is provided at least in part by a buried oxide layer; a III-V semiconductor-based optoelectronic component, bonded to a bed of the cavity of the silicon platform; and a bridge-waveguide, located between the silicon waveguide and the III-V semiconductor-based optoelectronic component.

Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure comprises a substrate and a back-end-of-line edge coupler including a waveguide core and a grating positioned in a vertical direction between the substrate and the waveguide core. The first waveguide core includes a first longitudinal axis, the grating includes a second longitudinal axis and a plurality of segments positioned with a spaced-apart arrangement along the second longitudinal axis, and the second longitudinal axis is aligned substantially parallel to the first longitudinal axis.