Abstract: Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.
Type:
Grant
Filed:
September 17, 2015
Date of Patent:
October 1, 2019
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Inventors:
Harumichi Arthur Kariya, Jeffrey P. Koplow, Wayne Lawrence Staats, Jr.