Patents Examined by Eric Gorman
  • Patent number: 8777320
    Abstract: The present invention is drawn to a ventilation system for a “climate object”, in particular all components with which the user of a vehicle may come in contact in a passenger compartment such as, for example, a steering mechanism for a vehicle, a dashboard, an armrest, a door paneling, a seat cover, a heating blanket, a padding, a cover or a seat, all which include at least one air flow device to guide air through the climate object.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: July 15, 2014
    Assignee: W.E.T. Automotive Systems AG
    Inventors: Andreas Stoll, Johnathan Zhang, Thomas Fries, Yu Tong, Denise Philipp
  • Patent number: 8770154
    Abstract: A multi-chamber conveyor type dishwasher uses a heat recovery unit (HRU) to heat water for a final rinse chamber during a preheat and/or dishwashing phase. The HRU heats water supplied by a low temperature water source using the dishwasher's hot vapor exhaust. An input supply of water for a downstream booster heater is varied based on a sensed temperature of the HRU's output water. If the temperature is acceptable, the HRU supplies input water to the booster heater for the rinse chamber. When the temperature drops below a threshold, the controller temporarily bypasses the HRU and supplies water to the booster heater from a high temperature water source. The HRU may be primed during a preheat phase using water from the high temperature water source. An amount of fan force used to pull the hot exhaust vapors through the HRU may vary based on the status of the dishwasher.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: July 8, 2014
    Assignee: Champion Industries, Inc.
    Inventor: Robert C. Vroom
  • Patent number: 8662968
    Abstract: A thermal conditioning system for the energy storage system of a hybrid vehicle. At least one auxiliary air source, other than a permanently open air source, has a selectively operable actuator door which either connects or disconnects the auxiliary air source to the energy storage system blower, the air flow being selected to optimally temperature condition the energy storage system. The auxiliary air source preferably includes the HVAC ducting.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: March 4, 2014
    Assignee: GM Global Technology Operations LLC
    Inventors: Michael G. Leffert, Tyler J Pilgeram, Ian L Hanna, Eric L. Mayberry, Jonathan R. Schwarz
  • Patent number: 8622620
    Abstract: An air bearing shaft has a first cylindrical portion with a relatively small outer diameter, and a ramped surface extending at an angle that is non-perpendicular and non-parallel to a central axis of a shaft body. The ramped surface leads into a second cylindrical portion of the shaft has a large outer diameter that is greater than the diameter of the first cylindrical portion. There are twelve air holes formed to extend into an interior of the second cylindrical portion. A bore diameter is defined to an inner periphery of the second cylindrical portion at the location of the air holes. A ratio of the bore diameter to a diameter of the air holes is between 6.30 and 6.54. In addition, a bearing assembly, a compressor, and a method of incorporating an air bearing shaft into a compressor are all disclosed and claimed.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: January 7, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Craig M. Beers, Brent J. Merritt
  • Patent number: 8573969
    Abstract: A silicon wafer preferable to a semiconductor device is produced by determining a heat treatment condition hardly causing slip dislocations and heat-treating the silicon wafer under the condition. The resistance is calculated by using a calculation formula used for predicting the slip resistance of the wafer from the density, size, and residual solid-solution oxygen concentration of the oxygen precipitation in the silicon wafer, the state of oxygen precipitation such that heat treatment not causing any slip dislocation can be carried out is designed, and thus a silicon wafer heat treatment method under the heat treatment condition not causing any slip dislocation is determined. A silicon wafer heat-treated under such a condition can be provided.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: November 5, 2013
    Assignee: Sumco TechXIV Corporation
    Inventors: Shinya Sadohara, Kozo Nakamura, Shiro Yoshino