Abstract: A heat dissipating structure and a heat dissipating method are disclosed. The heat dissipating structure includes a duct, which has a channel formed in the duct, and an airflow generating device. The heat dissipating structure is disposed on, by or over a semiconductor device and configured to dissipate heat generated from the semiconductor device. The airflow generating device is configured to generate an airflow flowing through the channel within the duct to dissipate the heat generated from the semiconductor device.

Abstract: A plate for a heat exchanger is made by first providing a first rigid support layer of a flat generally planar shape and consisting of a broken-through and plastically deformable material. Then a flat generally planar membrane layer capable of transferring enthalpy between two fluid streams is laminated to the first layer by a surface-connection layer. These three laminated-together layers are then deformed into a three-dimensional shape.

Abstract: A vapor compression system includes a heat exchanger configured to facilitate heat transfer between a refrigerant and a conditioning fluid. The vapor compression system also includes an expansion valve disposed along a conduit coupled to the heat exchanger. The conduit is configured to direct a flow of the refrigerant into the heat exchanger. Additionally, the vapor compression system includes a sensor configured to provide feedback indicative of a temperature of the conditioning fluid exiting the heat exchanger and a controller including a memory and processing circuitry. The processing circuitry is configured to receive a signal indicative of the temperature of the conditioning fluid exiting the heat exchanger from the sensor and adjust operation of the expansion valve based on the signal.

Abstract: A heat dissipating element for a radiator for better thermal performance by dissipating more heat from high viscous oil filled transformer and a method of manufacturing therefor are disclosed. The heat dissipating element comprises a plurality of flutes defined in a body thereof, with a transverse section of each flute representing two trapezium mirrored to each other along a base. The heat dissipating element comprises an inlet port in a top portion of the body to receive the fluid and supply the fluid to each of the plurality of flutes, and an outlet port in a bottom portion of the body to collect the fluid from each of the plurality of flutes. The plurality of flutes are extending longitudinally downwards and diverging laterally outwards from the inlet port, extending longitudinally downwards in a middle portion of the body, and extending longitudinally downwards and converging laterally inwards towards the outlet port.

Abstract: A cooler includes a base material, and a plurality of ribs protruding from a main surface of the base material, a distance between a base end of a first rib and a base end of a second rib in a second direction is larger than a distance between a protruding end of the first rib and a protruding end of the second rib in the second direction, and a distance between the base end of the second rib and a base end of a third rib in the second direction is smaller than a distance between the protruding end of the second rib and a protruding end of the third rib in the second direction.

Abstract: A chip cooling platform based on a micro-nano structure includes, a platform body, a cooling pipeline, and an outer heat dissipation device. The cooling pipeline is of a closed-loop structure, and part of cooling pipeline is arranged in the platform body. The cooling pipeline is filled with a cooling medium, and a turbulence structure is arranged on an inner wall of the cooling pipeline in the platform body. A first one-way hydraulic pump is mounted on the cooling pipeline outside the platform body. The outer heat dissipation device is configured to dissipate heat from the cooling medium in the cooling pipeline.

Abstract: A heat exchanger including a tube stack having a plurality of microtubes; a first header coupled with a heat exchanger refrigerant fluid inlet and configured to introduce refrigerant fluid traveling in a first direction into the tube stack; and a second header coupled to a heat exchanger refrigerant fluid outlet and having a second header passage configured to receive refrigerant fluid traveling in the first direction through some of the microtubes and discharge the received refrigerant fluid in a second direction to some of the microtubes. The first header has a first header passage configured to receive refrigerant fluid traveling in the second direction and discharge the received refrigerant fluid in the first direction to some of the microtubes. The second header further configured to receive refrigerant fluid traveling in the first direction and discharge the received refrigerant to the heat exchanger refrigerant fluid outlet.

Abstract: A modular double V stacked dry or adiabatic heat exchanger having a bottom module with two heat exchangers arranged in a V-shape, a top module configured to rest atop and be supported by the bottom module and having two heat exchangers configured to continue and extend the V-shape formed by the two bottom heat exchangers, and a fan module configured to rest atop and be supported by the top module. The modules are factory assembled and configured to for easy shipping and connection to one-another on-site. Adiabatic pads or spray nozzles may be provided to pre-cool the air entering the system.

Abstract: This cup-plate type heat exchanger has a lower end plate 2 that is thicker than each of second plates 5. In a state in which plates 2, 3, and 5 are stacked, each of inner fins 4 is provided between the lower end plate 2 and the first plate 3 fitted inside the lower end plate and between the second plate 5 and the first plate 3 fitted inside the second plate, and an angle ? of a first inclined portion 6 of the lower end plate 2 is formed smaller than an angle ? of a first inclined portion 8 of each of the second plates 5.

Abstract: A semiconductor fabrication apparatus may include a plurality of refrigerant suppliers, a plurality of mixers, a plurality of chambers and a common reservoir. The mixers may commonly receive a refrigerant from the refrigerant suppliers. The chambers may be connected to one of the mixers. The common reservoir may supply the refrigerant to the refrigerant suppliers. The common reservoir may collect the refrigerant from the chambers.

Abstract: A heat exchanger for a vehicle includes a plurality of plates is disclosed. The plates are stacked one on top of the other in a stacking direction to form a bundle of plates. At least one first plate and at least one second plate define a first circulation path that is configured for circulation of a first fluid. At least the second plate and at least one third plate define a second circulation path that is configured for circulation of a second fluid. The bundle of plates includes a first distribution chamber that is configured to supply the first circulation path with first fluid. The first plate has a through-hole surrounded by a plateau. The through-hole is surrounded by an internal raised edge. The internal raised edge is of a substantially annular shape. The plateau includes, on its top, an orifice belonging to a return passage.

Abstract: Disclosed herein is a heat exchanger including a plurality of tubes configured to enable refrigerant to flow therein, the plurality of tubes arranged along one direction and divided into a first row and a second row, a header coupled to ends of the plurality of tubes and including a first chamber to supply refrigerant to the first row of tubes and a second chamber to be supplied with refrigerant from the second row of tubes, wherein the first chamber includes a first region defined in the one direction between two tubes disposed at opposite ends of the first row of tubes, and the second chamber includes a second region defined in the one direction between two tubes disposed at opposite ends of the second row of tubes, an inlet pipe communicating with the first chamber within the first region to supply refrigerant to the first chamber, and an outlet pipe communicating with the second chamber within the second region to discharge refrigerant of the second chamber.

Abstract: An antenna module for a vehicle, the antenna module including a printed circuit board (PCB) including electronic components; a metal heat sink disposed below the PCB to absorb heat generated from at least one of the electronic components; a blower fan structure disposed above the PCB and having a blower fan to dissipate heat generated from the at least one of the electronic components; a dielectric carrier coupled to the blower fan structure and having a hole formed to correspond to an area occupied by the blower fan; and an antenna element formed as a metal pattern on a top of the dielectric carrier to radiate a radio signal.

Abstract: An integrated two-phase immersion cooling system for electronic devices includes a tank containing a dielectric working fluid in which one or more electronic modules are immersed. Each electronic module is thermally coupled to a heat-spreading assembly supporting a boiling-enhancement surface configured to promote controlled nucleate boiling of the dielectric working fluid. Vapor generated at the boiling-enhancement surface rises into a vapor region and is guided toward a condensation assembly, where the vapor is condensed and returned to the working-fluid region through one or more condensate-return pathways. A coolant-delivery subsystem provides directed liquid-phase dielectric working fluid toward the boiling-enhancement surface to reinforce surface wetting, regulate local heat flux, and reduce reliance on bulk fluid circulation.

Abstract: The present invention relates to the field of fluid heat transfer, and discloses a heat transfer enhancement pipe as well as a cracking furnace and an atmospheric and vacuum heating furnace including the same. The heat transfer enhancement pipe (1) includes a pipe body (10) of tubular shape having an inlet (100) for entering of a fluid and an outlet (101) for said fluid to flow out; the internal wall of the pipe body (10) is provided with a fin (11) protruding towards the interior of the pipe body (10), the fin (11) spirally extends in an axial direction of the pipe body (10), wherein at least one of a heat insulator (14) and a heat insulating layer (17) is provided at the outside of the pipe body (10). The heat transfer enhancement pipe can reduce thermal stress of itself, thereby increasing service life of the heat transfer enhancement pipe.

Abstract: Embodiments described herein relate to a self-adaptive thermal management system. The thermal management system includes a first body, a second body, and a third body. The second body has a first layer and a second layer formed from a Weyl semimetal and a third layer sandwiched between the first layer and the second layer. The third layer is formed from a vanadium dioxide film. The second body is spaced apart from the first body. The third body is spaced apart from the second body. The second body is a modulator configured to transition between a metallic phase and an insulating phase dependent on a temperature to regulate a heat from the first body to the third body through the second body in a self-adaptive manner dependent on the temperature.

Abstract: The present disclosure relates to the technical field of a heat pump device, and discloses an upturned electric control box mounting structure, which comprises a connecting frame and an electric control box assembly, wherein the electric control box assembly is connected to the connecting frame in an upturned manner, a fixing mechanism and a supporting mechanism are provided on the connecting frame. The present disclosure further discloses a heat pump device applying the structure, which comprises a tank body, a water tank assembly and a hydraulic module, wherein the above-mentioned upturned electric control box mounting structure is mounted on the tank body, and the water tank assembly and the hydraulic module are electrically connected with the electric control box assembly.

Abstract: A heat exchanger that exchanges heat between a refrigerant and air, includes: flat tubes disposed in a first direction intersecting with a longitudinal direction of cross sections of the flat tubes and through which the refrigerant flows; first heat transfer fins that contact the flat tubes and are disposed on a windward side of the flat tubes; and second heat transfer fins that contact the flat tubes and are disposed on a leeward side of the flat tubes. The first heat transfer fins are inserted toward the flat tubes from a side of first ends in the longitudinal direction. The second heat transfer fins are inserted toward the flat tubes from a side of second ends in the longitudinal direction.

Abstract: A thermal energy storage system configured to maintain thermal stratification and enhance energy storage efficiency over repeated charge and discharge cycles. The system includes a containment structure, such as a repurposed hydrocarbon wellbore, configured to retain a thermal energy storage fluid. A plurality of phase change material (PCM) elements are encapsulated within microcapsules or macro-encapsulated tubes and positioned within top and/or bottom regions of the containment structure. The PCM elements absorb and release latent heat at predetermined phase transition temperatures to stabilize and narrow the thermocline formed within the thermal fluid column. A reversible high-temperature heat pump (RHTHP) may be integrated to facilitate thermal energy input during charging and energy conversion during discharging.

Abstract: The present invention relates to a novel heat exchanger water trap particularly suited for utilizing the heat present in hot bathing water. The heat exchanger water trap comprises a shell (5) with a liquid inlet (7) for receiving a liquid to be heated and a liquid outlet (3) for said liquid to exit once heated. The heat exchanger further comprises a heat exchange chamber (6) defined by the shell (5), an upper plate (19), a lower plate (10) and an inner wall (12). A plurality of drainpipes (13) having an inner surface and an outside surface through whish a discard liquid can pass and wherein said plurality of drainpipes (13) passing though the heat ex-change chamber (6), whereby the liquid to be heated is in contact with at least part of the outside surface of said plurality of drainpipes (13).