Patents Examined by Eric S Ruppert
  • Patent number: 12710232
    Abstract: The invention relates to a condenser comprising a housing having an inlet opening for inputting fluid into the condenser and an outlet opening for outputting the fluid out of the condenser and a channel system for fluidically connecting the inlet opening and the outlet opening, wherein the channel system is arranged within the housing and comprises a splitting portion in which the inputted fluid is split to a plurality of channels and a grouping portion in which the plurality of channels is united to an outlet channel, wherein a first end of the outlet channel ends in the outlet opening and a second end of the outlet channel ends in the grouping portion. The condenser is characterized in that a distance between the second end of the outlet channel and a housing bottom in a vertical direction is between 0% to 80% of a distance between the housing bottom and an upper housing side in a vertical direction.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: August 18, 2026
    Inventors: Sébastien Kubasik, Benjamin Chassagnard
  • Patent number: 12703316
    Abstract: Systems and methods for cooling and delivering oil for an electric vehicle are described. In one example, viscosity of oil and resistance to oil flow of an oil circuit reduce oil flow through a cooling circuit so as to reduce powertrain losses that may be related to oil viscosity. At higher temperatures, the viscosity of oil allows the oil to flow through the cooling circuit and lower a temperature of an electric machine.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: August 11, 2026
    Assignee: Ford Global Technologies, LLC
    Inventor: William Rey Patterson
  • Patent number: 12707594
    Abstract: A liquid cooling heat exchange casing including a chassis having a first side is provided. The first side includes a first inlet flow passageway system having a first inlet liquid coolant opening, a first outlet flow passageway system having a first outlet liquid coolant opening, a plurality of adapters, and at least one radiator. The at least one radiator is mounted to the first inlet flow passageway system via a radiator inlet and one of the plurality of adapters and to the first outlet flow passageway system via a radiator outlet and another of the plurality of adapters. A cooling fluid flows from the first inlet liquid coolant opening, through the first inlet flow passageway system, through the at least one radiator, and through the first outlet flow passageway system, to the first outlet liquid coolant opening, before being circulated to repeat the flow process again.
    Type: Grant
    Filed: April 2, 2023
    Date of Patent: August 11, 2026
    Assignee: Cooler Master Co., Ltd.
    Inventors: Tsung-Wei Lin, Shui-Fa Tsai
  • Patent number: 12704305
    Abstract: A countertop ice maker appliance includes a compressor, a condenser, a condenser fan, and a motor assembly. A method of operating the countertop ice maker includes initiating a standard ice making cycle, the standard ice making cycle including a first set of parameters for each of the motor assembly, the compressor, and the condenser fan; receiving, via the user interface, a signal to initiate an adjusted ice making cycle; adjusting the first set of parameters to form a second set of parameters for each of the motor assembly, the compressor, and the condenser fan; and initiating the adjusted ice making cycle according to the second set of parameters.
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: August 11, 2026
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Srikanth Raavi Venkata, Eric Muzzillo, Samuel Vincent DuPlessis
  • Patent number: 12701675
    Abstract: Cooling plates are generally directed to accommodating static and dynamic variations in heat dissipation requirements across a plurality of heat-dissipating components while maintaining efficient transfer of heat away from the heat-dissipating components. For example, a cooling plate may include a housing, a diaphragm, a plurality of ribs, and at least one fin. The housing and the diaphragm may collectively define a chamber enclosed relative to a contact surface of the diaphragm. The plurality of ribs and the at least one fin collectively defining a plurality of channels in the chamber. The at least one fin may be coupled to the diaphragm in the chamber, and the at least one fin may be movable toward the housing (e.g., to define at least a portion of a subset of the plurality of channels) in response to external pressure on the contact surface from one or more heat-dissipating devices of a circuit pack.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: August 4, 2026
    Assignee: THERMOTECH HOLDINGS LLC
    Inventors: Georgios Karamanis, Marc Hodes
  • Patent number: 12698942
    Abstract: The invention provides a method of cooling a flowing fluid in a hydrocarbon flow system using a heat exchange cooler apparatus having at least one cooler conduit; and a sensor system. The method comprises flowing the fluid through the cooler conduit from a cooler inlet to a cooler outlet to cool the fluid and operating a cleaning system to deliver energy (e.g. heat) to the cooler conduit to cause solid materials deposited on the interior of the cooler to be released into the flowing fluid. A cooler sensor data set obtained from the sensor system is compared with a reference data set to verify the performance of the cleaning system.
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: August 4, 2026
    Assignee: EMPIG AS
    Inventors: Lars S Strommegjerde, Fredrik Lund, Thomas Sperle
  • Patent number: 12691726
    Abstract: A vehicle thermal management system includes a fluid transfer device including an electric power consumption unit, and a control unit for controlling indoor heating through the fluid transfer device on the basis of an optimal control value for the indoor heating.
    Type: Grant
    Filed: August 29, 2024
    Date of Patent: July 28, 2026
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae Woong Kim, Dae Ki Hong, Seok Jin Hong, Ki Hoon Kim, Jae Kwon Lee, Se Kyu Oh
  • Patent number: 12693057
    Abstract: Thermal management systems include a vapor cycle and a liquid cycle sharing a common working fluid. The vapor cycle includes, along a vapor cycle flow path, a compressor and a condenser. The liquid cycle includes, along a liquid cycle flow path, a fluid driver, a load, a regulator valve, and a phase change material heat exchanger. A cold sink is thermally coupled to a heat load. A separator is configured to separate liquid and vapor portions of the working fluid and direct the liquid into the liquid cycle and the vapor into the vapor cycle. The separator is part of both the vapor cycle and the liquid cycle. The regulator valve controls a temperature of the working fluid within the liquid cycle at a location upstream of the phase change material heat exchanger to control a mode of operation of the phase change material heat exchanger.
    Type: Grant
    Filed: December 7, 2023
    Date of Patent: July 28, 2026
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Raphael Mandel, Ram Ranjan, Joseph E. Turney
  • Patent number: 12693047
    Abstract: Aircraft air cycle machines include a housing defining a motor cavity, a shaft arranged within the housing, a turbine operably coupled to the shaft and arranged within the housing, a compressor operably coupled to the shaft and arranged within the housing, and a motor arranged within the motor cavity, wherein the motor comprises a motor stator assembly fixedly connected to the housing and a motor rotor assembly rotationally coupled to the shaft.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: July 28, 2026
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Viktor Kilchyk, Brent J. Merritt
  • Patent number: 12690158
    Abstract: A heat dissipating structure and a heat dissipating method are disclosed. The heat dissipating structure includes a duct, which has a channel formed in the duct, and an airflow generating device. The heat dissipating structure is disposed on, by or over a semiconductor device and configured to dissipate heat generated from the semiconductor device. The airflow generating device is configured to generate an airflow flowing through the channel within the duct to dissipate the heat generated from the semiconductor device.
    Type: Grant
    Filed: September 1, 2025
    Date of Patent: July 21, 2026
    Assignee: xMEMS Labs, Inc.
    Inventors: Thomas Tarter, Jemm Yue Liang
  • Patent number: 12687351
    Abstract: A plate for a heat exchanger is made by first providing a first rigid support layer of a flat generally planar shape and consisting of a broken-through and plastically deformable material. Then a flat generally planar membrane layer capable of transferring enthalpy between two fluid streams is laminated to the first layer by a surface-connection layer. These three laminated-together layers are then deformed into a three-dimensional shape.
    Type: Grant
    Filed: February 6, 2024
    Date of Patent: July 21, 2026
    Assignee: KLINGENBURG GMBH
    Inventor: Kai Klingenburg
  • Patent number: 12687330
    Abstract: A vapor compression system includes a heat exchanger configured to facilitate heat transfer between a refrigerant and a conditioning fluid. The vapor compression system also includes an expansion valve disposed along a conduit coupled to the heat exchanger. The conduit is configured to direct a flow of the refrigerant into the heat exchanger. Additionally, the vapor compression system includes a sensor configured to provide feedback indicative of a temperature of the conditioning fluid exiting the heat exchanger and a controller including a memory and processing circuitry. The processing circuitry is configured to receive a signal indicative of the temperature of the conditioning fluid exiting the heat exchanger from the sensor and adjust operation of the expansion valve based on the signal.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: July 21, 2026
    Assignees: Tyco Fire & Security GmbH, Johnson Controls Industries SAS
    Inventors: Damien Jean Daniel Arnou, Francois Charles Andre Clunet, Paul Eric Le Sausse, Laurent Claude Eric Thibaud
  • Patent number: 12687347
    Abstract: A heat dissipating element for a radiator for better thermal performance by dissipating more heat from high viscous oil filled transformer and a method of manufacturing therefor are disclosed. The heat dissipating element comprises a plurality of flutes defined in a body thereof, with a transverse section of each flute representing two trapezium mirrored to each other along a base. The heat dissipating element comprises an inlet port in a top portion of the body to receive the fluid and supply the fluid to each of the plurality of flutes, and an outlet port in a bottom portion of the body to collect the fluid from each of the plurality of flutes. The plurality of flutes are extending longitudinally downwards and diverging laterally outwards from the inlet port, extending longitudinally downwards in a middle portion of the body, and extending longitudinally downwards and converging laterally inwards towards the outlet port.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: July 21, 2026
    Assignee: TTP TECHNOLOGIES PRIVATE LIMITED
    Inventor: Mohandas D Shetty
  • Patent number: 12683466
    Abstract: A cooler includes a base material, and a plurality of ribs protruding from a main surface of the base material, a distance between a base end of a first rib and a base end of a second rib in a second direction is larger than a distance between a protruding end of the first rib and a protruding end of the second rib in the second direction, and a distance between the base end of the second rib and a base end of a third rib in the second direction is smaller than a distance between the protruding end of the second rib and a protruding end of the third rib in the second direction.
    Type: Grant
    Filed: July 25, 2024
    Date of Patent: July 14, 2026
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yuji Ono, Keiji Tada, Hiroshi Nagami, Masaki Sato, Yoshiyuki Hoshi
  • Patent number: 12685165
    Abstract: A chip cooling platform based on a micro-nano structure includes, a platform body, a cooling pipeline, and an outer heat dissipation device. The cooling pipeline is of a closed-loop structure, and part of cooling pipeline is arranged in the platform body. The cooling pipeline is filled with a cooling medium, and a turbulence structure is arranged on an inner wall of the cooling pipeline in the platform body. A first one-way hydraulic pump is mounted on the cooling pipeline outside the platform body. The outer heat dissipation device is configured to dissipate heat from the cooling medium in the cooling pipeline.
    Type: Grant
    Filed: September 13, 2024
    Date of Patent: July 14, 2026
    Assignee: GUANGDONG OCEAN UNIVERSITY
    Inventors: Haowei Li, Weijun Feng, Zehao Lu, Zeming Chen, Runji Xie, Wenguan Li
  • Patent number: 12674632
    Abstract: A heat exchanger including a tube stack having a plurality of microtubes; a first header coupled with a heat exchanger refrigerant fluid inlet and configured to introduce refrigerant fluid traveling in a first direction into the tube stack; and a second header coupled to a heat exchanger refrigerant fluid outlet and having a second header passage configured to receive refrigerant fluid traveling in the first direction through some of the microtubes and discharge the received refrigerant fluid in a second direction to some of the microtubes. The first header has a first header passage configured to receive refrigerant fluid traveling in the second direction and discharge the received refrigerant fluid in the first direction to some of the microtubes. The second header further configured to receive refrigerant fluid traveling in the first direction and discharge the received refrigerant to the heat exchanger refrigerant fluid outlet.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: July 7, 2026
    Assignee: Intergalactic Spaceworx, LLC
    Inventors: Cole Sorensen, Andrew Kerlin
  • Patent number: 12674622
    Abstract: A modular double V stacked dry or adiabatic heat exchanger having a bottom module with two heat exchangers arranged in a V-shape, a top module configured to rest atop and be supported by the bottom module and having two heat exchangers configured to continue and extend the V-shape formed by the two bottom heat exchangers, and a fan module configured to rest atop and be supported by the top module. The modules are factory assembled and configured to for easy shipping and connection to one-another on-site. Adiabatic pads or spray nozzles may be provided to pre-cool the air entering the system.
    Type: Grant
    Filed: May 22, 2024
    Date of Patent: July 7, 2026
    Assignee: Evapco, Inc.
    Inventor: Tom Byrne
  • Patent number: 12669297
    Abstract: This cup-plate type heat exchanger has a lower end plate 2 that is thicker than each of second plates 5. In a state in which plates 2, 3, and 5 are stacked, each of inner fins 4 is provided between the lower end plate 2 and the first plate 3 fitted inside the lower end plate and between the second plate 5 and the first plate 3 fitted inside the second plate, and an angle ? of a first inclined portion 6 of the lower end plate 2 is formed smaller than an angle ? of a first inclined portion 8 of each of the second plates 5.
    Type: Grant
    Filed: November 25, 2022
    Date of Patent: June 30, 2026
    Assignee: T.RAD CO., LTD.
    Inventor: Shuhei Matsusaka
  • Patent number: 12672500
    Abstract: A semiconductor fabrication apparatus may include a plurality of refrigerant suppliers, a plurality of mixers, a plurality of chambers and a common reservoir. The mixers may commonly receive a refrigerant from the refrigerant suppliers. The chambers may be connected to one of the mixers. The common reservoir may supply the refrigerant to the refrigerant suppliers. The common reservoir may collect the refrigerant from the chambers.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: June 30, 2026
    Assignee: SK hynix Inc.
    Inventor: Doo Hyun Jeong
  • Patent number: 12663219
    Abstract: A heat exchanger for a vehicle includes a plurality of plates is disclosed. The plates are stacked one on top of the other in a stacking direction to form a bundle of plates. At least one first plate and at least one second plate define a first circulation path that is configured for circulation of a first fluid. At least the second plate and at least one third plate define a second circulation path that is configured for circulation of a second fluid. The bundle of plates includes a first distribution chamber that is configured to supply the first circulation path with first fluid. The first plate has a through-hole surrounded by a plateau. The through-hole is surrounded by an internal raised edge. The internal raised edge is of a substantially annular shape. The plateau includes, on its top, an orifice belonging to a return passage.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: June 23, 2026
    Assignee: Valeo Systemes Thermiques
    Inventors: Christophe Denoual, Roberto Fernandez, Jingyu Ni