Patents Examined by Eric W. Thomas
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Patent number: 11967463Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of a plurality of internal electrode layers having pores are alternately stacked. A continuity modulus of at least one of the plurality of internal electrode layers is 80% or less. An average pore diameter of the pores of the at least one of the plurality of internal electrode layers is equal to or less than each thickness of the plurality of dielectric layers.Type: GrantFiled: May 27, 2022Date of Patent: April 23, 2024Assignee: TAIYO YUDEN CO., LTD.Inventor: Teruo Atsumi
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Patent number: 11961683Abstract: A biaxially stretched polypropylene film which has a thickness of from 1.0 ?m to 3.5 ?m, a tensile fracture stress at 135° C. of 70 MPa or more in a first direction, and a difference between the tensile fracture stress at 125° C. in the first direction and the tensile fracture stress at 135° C. in the first direction of from 0 MPa to 15 MPa (inclusive).Type: GrantFiled: August 28, 2019Date of Patent: April 16, 2024Assignee: Oji Holdings CorporationInventors: Yoshimune Okuyama, Takeshi Tominaga, Yoshikazu Fujishiro, Tadakazu Ishiwata
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Patent number: 11961685Abstract: An electrode element (1) for an energy storage unit (200), such as a capacitor, has an electrode body (100) made of an active electrode material (E), wherein the electrode body (100) includes one or more of: at least one cavity (110) on its surface or in its interior; at least one partial volume (120) of lower density; and/or a surface coating (D) covering at least a portion of the surface of the electrode body (100), such that the surface area covered by the surface coating (D) remains unwetted when in contact with an electrolyte. Energy storage units (200) incorporating the electrode element (1) are particularly suitable for use in implantable electrotherapeutic devices.Type: GrantFiled: July 13, 2022Date of Patent: April 16, 2024Assignee: BIOTRONIK SE & CO. KGInventors: Thomas Dörr, Ingo Weiss
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Patent number: 11961670Abstract: A system may include a capacitor for an electronic device of an electric vehicle; a main bus bar; and a capacitor bus bar configured to connect the capacitor to the main bus bar, wherein the capacitor bus bar includes a first portion that is perpendicular to the main bus bar, and wherein the capacitor bus bar includes a second portion that extends from the first portion, that is perpendicular to the first portion, and that is planar with the main bus bar.Type: GrantFiled: October 6, 2022Date of Patent: April 16, 2024Assignee: Delphi Technologies IP LimitedInventors: Rajesh Mittu Ram Yadav, Teng Zhi Jau, Wayne Anthony Sozansky
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Patent number: 11955279Abstract: A nanocomposite electrode and a supercapacitor device including said nanocomposite electrode. The nanocomposite electrode includes a mixture of at least one binding compound, at least one conductive additive, and at least one molybdenum doped carbon material coated onto a substrate. The supercapacitor device includes two nanocomposite electrodes disposed facing one another, wherein the substrate of each nanocomposite electrode is coated with the mixture on an inside facing surface and the outer surfaces of the nanocomposite electrodes are not coated with the mixture, and the inside facing surfaces are separated by at least one electrolyte.Type: GrantFiled: August 3, 2023Date of Patent: April 9, 2024Assignee: Imam Abdulrahman Bin Faisal UniversityInventors: Sarah Mousa Maadi Asiri, Emre Cevik, Ayhan Bozkurt
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Patent number: 11948746Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately stacked on one another, and two external electrodes respectively on two end surfaces of the multilayer body. Each of the dielectric layers includes, at a location coincident with an end portion of a respective one of the internal electrodes, a thick-walled portion thicker in a stacking direction than a portion corresponding in position to a middle portion of a main surface of the multilayer body. When viewed in the stacking direction, positions of some of the thick-walled portions of the dielectric layers are out of alignment with positions of a remainder of the thick-walled portions of the dielectric layers.Type: GrantFiled: June 7, 2022Date of Patent: April 2, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yasuyuki Shimada
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Patent number: 11948743Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.Type: GrantFiled: May 25, 2022Date of Patent: April 2, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Mitsuru Ikeda, Yasuhiro Nishisaka
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Patent number: 11948750Abstract: An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.Type: GrantFiled: September 28, 2021Date of Patent: April 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Ki Young Kim, Woo Chul Shin, Sang Soo Park
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Patent number: 11942273Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. One of the board main surfaces is in a vicinity of the electronic element and joined with a multilayer body main surface in a vicinity of the interposer board. The interposer board is an alumina board. At least one notch is in end regions including a board end surface, a board side surface in a vicinity thereof, a board main surface in a vicinity thereof, ridge portions between the board end surface and the board side surface, between the board end surface and the board main surface, and between the board side surface and the board main surface, and a corner portion between the board end surface, the board side surface, and the board main surface.Type: GrantFiled: May 25, 2022Date of Patent: March 26, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Yokomizo, Shinobu Chikuma, Yohei Mukobata
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Patent number: 11942274Abstract: The invention relates to a film capacitor for power electronics, which comprises a first electrically conductive layer, which is arranged on a first end side face of the film capacitor, wherein the surface normal of the first electrically conductive layer is perpendicular to the surface normals of dielectric films of the film capacitor. A second electrically conductive layer is arranged on a second end side face opposite from the first end side face, wherein the surface normal of the second electrically conductive layer is perpendicular to the surface normals of the dielectric films of the film capacitor. The film capacitor has at least one inner passage, which extends from the first electrically conductive layer to the second electrically conductive layer, wherein the passage is formed by removal of capacitor material. The invention also relates to a capacitor assembly.Type: GrantFiled: August 19, 2020Date of Patent: March 26, 2024Assignee: Wolfgang WestermannInventor: Wolfgang Westermann
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Patent number: 11942279Abstract: A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO3, Al2O3, SiO2 and ZrO2, and a coating film disposed on a surface of the core.Type: GrantFiled: November 16, 2022Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Ho Hong, Young Seuck Yoo, Hee Sung Choi, Young June Lee
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Patent number: 11942275Abstract: The insulating plate has a swelling protruding in a first direction that is a direction a first plate portion toward a second plate portion. The swelling is formed integral with the insulating plate. The first plate portion has a first fitting part protruding in the first direction and formed integral with this plate portion. The first fitting part is fitted, in the first direction, onto one surface side of the swelling of the insulating plate. The second plate portion has a second fitting part protruding in the first direction and formed integral with this plate portion. The second fitting part is fitted, in a second direction opposite to the first direction, onto the other surface side of the swelling.Type: GrantFiled: March 4, 2021Date of Patent: March 26, 2024Assignee: Nichicon CorporationInventors: Takashi Mori, Yasuyuki Murakami
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Patent number: 11935696Abstract: A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.Type: GrantFiled: June 29, 2021Date of Patent: March 19, 2024Assignee: NUINTEK CO LTDInventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park, Hyeon-Jin Kim, Taek-Hyeon Lee
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Patent number: 11935699Abstract: Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.Type: GrantFiled: March 31, 2022Date of Patent: March 19, 2024Assignee: KEMET Electronics CorporationInventors: Evangelista Boni, Federico Fantini, Gabriele Piccinini, Walter Bruno
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Patent number: 11929209Abstract: The present disclosure relates to a metal case capacitor that includes: a capacitor module (10) including a capacitor device, a first busbar (1) electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal (1a) on an exposed side, a second busbar (2) electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal (2a) on an exposed side, and an insulating sheet disposed between the first busbar (1) and the second busbar (2); a metallic external case (20) having a space; a plastic insulating member positioned between the capacitor module (10) and the metallic external case (20) and insulating the capacitor module (10) and the metallic external case (20) from each other; and a filler permeating in a gel or liquid state into a space between the capacitor module (10) and the metallic external case (20).Type: GrantFiled: June 29, 2021Date of Patent: March 12, 2024Assignee: NUINTEK CO LTDInventors: Dae-Jin Park, Ying-Won Jeon, Jin-A Park
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Patent number: 11923140Abstract: A method of making a carbon-metal oxide composite electrode for a supercapacitor includes continuously injecting a carbon material solution into a coagulation solution, where the carbon material solution comprises a carbon source and a liquid, and the coagulation solution comprises a metal nitrate or chloride and an organic solvent. An extruded structure comprising the metal nitrate or chloride interspersed with carbon is formed from the continuous injection. The extruded structure is annealed under conditions sufficient to convert the metal nitrate or chloride to metal oxide. Thus, a composite structure comprising the metal oxide and the carbon is formed, where the metal oxide is uniformly dispersed within the composite structure.Type: GrantFiled: April 7, 2021Date of Patent: March 5, 2024Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOISInventors: Gang Wang, Yaofeng Chen, Joseph W. Lyding
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Patent number: 11915886Abstract: A solid electrolytic capacitor includes: a porous sintered body made of a valve metal; an anode wire that has a portion extending inside the porous sintered body, and that protrudes from the porous sintered body; a dielectric layer formed on the porous sintered body; a solid electrolyte layer formed on the dielectric layer; a cathode layer formed on the solid electrolyte layer; and a protective film having at least a portion formed on the cathode layer. The protective film has a glass transition point of 180° C. or lower.Type: GrantFiled: April 22, 2020Date of Patent: February 27, 2024Assignee: KYOCERA AVX Components CorporationInventor: Toshiyuki Nagai
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Patent number: 11915884Abstract: An electrolytic capacitor includes a capacitor element. The capacitor element includes an anode body, a dielectric layer that covers at least a part of the anode body, a solid electrolyte layer that covers at least a part of the dielectric layer, and a cathode lead-out layer that covers a part of the solid electrolyte layer. The cathode lead-out layer contains a carbon material and a first polymer including an acid group. The acid group includes at least one selected from the group consisting of a sulfone group, a carboxyl group, and a derivative of the sulfone group or the carboxyl group.Type: GrantFiled: July 31, 2020Date of Patent: February 27, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kei Hirota, Keita Uenaka, Yukihiro Shimasaki, Hiroki Imamura
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Patent number: 11908634Abstract: The electrolytic capacitor includes a capacitor body, the capacitor body including: a first end surface; a second end surface opposite to the first end surface; a bottom surface adjacent to the first end surface and the second end surface; a capacitor element including an anode line passing therethrough, a dielectric layer, and a cathode layer on the dielectric layer; and a sealing material covering the capacitor element, wherein the anode line has a first end exposed on the first end surface of the capacitor body, the electrolytic capacitor includes an anode external electrode on the first end surface of the capacitor body, the anode external electrode is connected to the first end of the anode line, the cathode layer is electrically led out to the bottom surface of the capacitor body, the electrolytic capacitor includes a cathode external electrode on the bottom surface of the capacitor body, and the cathode external electrode is electrically connected to the cathode layer.Type: GrantFiled: January 17, 2020Date of Patent: February 20, 2024Assignee: JAPAN CAPACITOR INDUSTRIAL CO., LTD.Inventors: Tomoki Nobuta, Kazumasa Fujimoto
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Patent number: 11908633Abstract: An electrolytic capacitor includes a capacitor element, a first current collector, and a case. The capacitor element includes a wound body in which a first electrode foil and a second electrode foil are wound. The first electrode foil and the second electrode foil face each other. The first current collector is connected to the first electrode foil. The case houses the capacitor element and the first current collector. The first electrode foil includes a first facing portion that faces the second electrode foil and a first non-facing portion that does not face the second electrode foil. The first non-facing portion is located at a first end portion in a winding axis of the wound body. The first current collector is disposed in a vicinity of the first end portion of the wound body to be connected to the first non-facing portion of the first electrode foil.Type: GrantFiled: December 2, 2021Date of Patent: February 20, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shumpei Matsushita, Tomoyuki Tashiro, Kenta Chashiro