Abstract: The invention relates to a deposition device for comprising a processing space with a substrate support disposed therein, as well as several lift pins (50), which can be moved into and out of the plane of the substrate support to assist in introducing a semiconductor substrate into the processing space and removing it therefrom. The device is characterized in that the contact surface (52) of the lift pin (50) that is to be brought into contact with the semiconductor substrate and/or the substrate support is provided with a material layer (54) which has a lower hardness than the semiconductor substrate and/or the substrate support. This eliminates the risk of damage being caused to the substrate and/or to the substrate support as a result of said substrate shifting undesirably upon being lifted from and lowered onto the substrate support (susceptor). Thus there is no risk of scratches being formed and of particles being released, which might adversely affect the semiconductor manufacturing process.

Abstract: A method for making an electrowetting device includes: (a) forming a surrounding wall on an upper surface of a substrate to surround a microchamber, the surrounding wall having an inner surface surrounding the microchamber and a top surface above the inner surface, the upper surface of the substrate being non-hydrophobic; (b) coating the surrounding wall and the upper surface of the substrate with a hydrophobic coating material; (c) removing a portion of the hydrophobic coating material formed on the top surface of the surrounding wall, thereby exposing the top surface of the surrounding wall; and (d) disposing a liquid into the microchamber.

Abstract: The method of laser treating Ti-6Al-4V to form surface compounds is a method of forming barrier layers on surfaces of Ti-6Al-4V workpieces. The Ti-6Al-4V workpiece is first cleaned and then a water-soluble phenolic resin is applied to at least one surface of the Ti-6Al-4V workpiece. The Ti-6Al-4V workpiece and the layer(s) of water soluble phenolic resin are then heated to carbonize the phenolic resin, thus forming a carbon film on the at least one surface. TiC particles are then inserted into the carbon film. Following the insertion of the TiC particles, a laser beam is scanned over the at least one surface of the Ti-6Al-4V workpiece. A stream of nitrogen gas is sprayed on the surface of the Ti-6Al-4V workpiece coaxially and simultaneously with the laser beam at a relatively high pressure, thus forming a barrier layer of TiCxN1-x, TiNx, Ti—C, and Ti2N compounds in the surface region.