Abstract: An inline splicing module for use in combination with one or more fiber subgroup cables each having a plurality of individual fibers includes a backplane component having top and bottom sides; at least one projection on the backplane component defining a cable slack storage component for securing the fiber subgroup cable in a storage position; at least one splice capturing component on the backplane component having a plurality of splice protector sleeves that are each sized and configured for securing therethrough a corresponding one of the plurality of individual fibers from one of the one or more fiber subgroup cables; and a plurality of fiber optic couplers each being structured and disposed for receipt of a corresponding one of the plurality of individual fibers.

Abstract: A lighting system is disclosed. The lighting system comprises at least one light source comprising a light emitting diode (LED) and one or more phosphors optically coupled to the LED to convert at least a portion of original light emitted by the LED to provide a modified LED light having a first predetermined spectral output, and an optical material that is optically coupled to at least a portion of a surface of a light guide plate and optically coupled to receive at least a portion of the modified LED light and to convert at least a portion of the modified LED light to at least one predetermined wavelength to provide modified light having a second predetermined spectral output, wherein the optical material comprises one or more types of quantum confined semiconductor nanoparticle. A device including a lighting system is also disclosed.

Abstract: An apparatus includes a waveguide extending along a light-propagation direction between a light source and a media-facing surface. An assistant layer is configured to receive light from a light source, the assistant layer has a terminating end with a first taper that narrows toward the media-facing surface. A core layer has a coupling end configured to receive light from the assistant layer, the coupling end having a second taper that widens toward the media-facing surface. A middle cladding layer is disposed between the core layer and the assistant layer. A near field transducer is disposed proximate the media-facing surface and configured to receive the light from the core layer.

Abstract: A packaging arrangement for telecommunications cabling is disclosed herein. The packaging arrangement includes a modular spool assembly defined by a first flange, an opposing second flange, and a spool hub separating the first flange from the second flange, wherein a telecommunications cable may be wound between the first and second flanges. Each flange defines a first cable contact side, a second cable-end storage side, and an opening allowing the telecommunications cable to pass from the first side to the second side, the second side defining a storage compartment for storing an end of the telecommunications cable passing through the opening in the flange.

Abstract: An example control line connector includes an expandable housing having a helical body that defines one or more windings and a helical shroud disposed about the one or more windings, wherein a helical conduit chamber is defined between the helical body and the helical shroud, a matable connector at least partially disposed within the expandable housing and providing a mating face that faces tangentially with respect to the expandable housing so as to angularly mate with an opposing matable connector, and a splitter block coupled to the expandable housing and conveying one or more communication media into the helical conduit chamber to communicate with the matable connector.

Abstract: Aspects of the invention are directed to a method for forming an optical waveguide structure. Initially, a base film stack is received with an optical waveguide feature covered by a lower dielectric layer. An etch stop feature is then formed on the lower dielectric layer, and an upper dielectric layer is formed over the etch stop feature. Subsequently, a trench is patterned in the upper dielectric layer and the etch stop feature at least in part by utilizing the etch stop feature as an etch stop. Lastly, a waveguide coupler feature is formed in the trench, at least a portion of the waveguide coupler feature having a refractive index higher than the lower dielectric layer and the upper dielectric layer. The waveguide coupler feature is positioned over at least a portion of the optical waveguide feature but is separated from the optical waveguide feature by a portion of the lower dielectric layer.

Abstract: A splice tray is removeably received in a chassis received in an access side of a frame. In some examples, the splice tray can have a capacity to receive at least about 288 fiber terminations. The frame having a first fiber management bay arranged at a middle of a back of the access side of the frame, a fiber passageway is arranged between a back of the chassis and the back of the access side of the frame, and a second fiber management bay is be arranged adjacent to the left side or right side of the frame proximate to the splice tray. A displaceable conduit communicatively coupled to a left side or a right side of the splice tray proximate to the front of the splice tray is protectively housed in the first fiber management bay, the fiber passageway, and the second fiber management bay such that the fiber terminations received by the displaceable conduit have at least a minimum bend radius.

Abstract: A fiber optic cable is presented having a pressure fitting at an end of the cable. The pressure fitting can create a pressure and/or chemical seal to prevent migration of environmental elements into or out of the cable. The fiber optic cable can advantageously be configured for use in varied environments including, for example, one or more of caustic, high-pressure, or low-pressure environments.

Abstract: An optomechanical device with mechanical elements and optical filters for actuating and/or detecting movement of the elements, including a support, and on the support: an array of mechanical elements anchored to the support and configured to move with respect thereto, and an actuating and/or detection device actuating the elements and/or detecting movement of the elements or frequency variations of the movement. The actuating and/or detection device includes an array of optical filters. Each filter resonates at a particular wavelength and is coupled to one of the elements. The actuating and/or detecting device is positioned in vicinity of all or some of the elements, between the elements and the support. The optical filters are fixed with respect to the support and the mechanical elements and the optical filters are superimposed.

Abstract: A Mach-Zehnder modulator includes: a support having a principal surface, the principal surface having a first area, a second area, and a third area; a first structure including first and second semiconductor mesas disposed on the first and second areas, respectively; a second structure including a first strip-shaped semiconductor region on the second area, a second strip-shaped semiconductor region on the third area, and a first strip-shaped void and a second strip-shaped void defining the first and second strip-shaped semiconductor regions; a first electrode disposed on the first semiconductor mesa in the first area, the first strip-shaped semiconductor region of the second structure being disposed between the support and the second semiconductor mesa of the first structure in the second area, and the first and second semiconductor mesas, and the first and second strip-shaped semiconductor regions being arranged to constitute a first arm waveguide of the Mach-Zehnder modulator.

Abstract: This document discloses novel conduits for telecommunications lines, such as optical fibers. In an aspect, a conduit might have a body defining one or more channels into which optical fibers can be inserted. In another aspect, the body might have a first face that is substantially planar and a second face opposing the first face. The second face might a low-rise arc profile and/or might be configured to be installed into a depression in a material. Also disclosed are methods and tools for installing, using, and/or removing such conduit.

Abstract: Interconnect systems for coupling a first system operating in a first type of environment (e.g., a cryogenic environment) to a second system operating in a second type of environment (e.g., a non-cryogenic environment) are provided. An interconnect system includes a first connector coupled to optical fibers that are coupled to the first system operating in the first type of environment. The interconnect system further includes a second connector coupled to optical fibers that are coupled to the second system operating in the second type of environment. The interconnect system may include an optical window configured to couple optical signals between the optical fibers, and the optical window is configured to maintain a vacuum seal between the first type of environment and the second type of environment such that the first type of environment is substantially thermally isolated from the second type of environment.

Abstract: A sealing enclosure for a connector on a terminated end of a cable includes an inner housing and an outer housing. In a first embodiment, the inner housing is permanently affixed and sealed to a section of the cable adjacent to the connector. The outer housing slides over the inner housing and has attachment features at a forward end of the outer housing for attaching to an enclosure surrounding a port for the connector. In a second embodiment, the outer housing has a sealing member attached to an inner circumference thereof, wherein when the outer housing is slid forward along the inner housing, the sealing member engages an outer surface of the inner housing to seal the outer housing to the inner housing.

Abstract: A system for selectively adiabatically coupling electromagnetic waves from one waveguide to another waveguide is described. It comprises a first waveguide portion and a second waveguide portion having substantially different surface normal cross-sections. Portions thereof are positioned with respect to each other in a coupling region so that under first predetermined environmental conditions coupling of electromagnetic waves between the first waveguide portion and the second waveguide portion can occur and under second predetermined environmental conditions substantially no coupling of electromagnetic waves between the first waveguide portion and the second waveguide portion can occur.

Abstract: An optical transmission module includes an optical element including a light-emitting section configured to output light of an optical signal, a hollow cylindrical body joined perpendicularly to a light output surface of the optical element, a wiring board, on a first principal surface of which the optical element is mounted and through a hole of which the hollow cylindrical body is inserted, and an optical fiber configured to transmit the optical signal, a distal end portion of which is inserted into the hollow cylindrical body.

Abstract: A semiconductor light source includes a substrate, an optical waveguide having a reflection structure provided on the substrate with an oxide film in between and a semiconductor light emitting element provided on the optical waveguide. The optical waveguide includes a constant width core layer portion located in a center portion, tapered core layer portions that are provided on either side of the constant width core layer and of which the core width gradually increases and a constant width core layer portion for an optical wire waveguide. The semiconductor light emitting element is placed so as to cover at least a portion of the tapered core layer portions on both sides.

Abstract: Apparatuses, systems, and methods of assembly are described that provide mechanisms for integrating an optical module (e.g., an MBOM) into a main switch system to allow the optical module to be replaced without having to replace other components of the main switch system. The field replaceable modular optical interconnect unit includes a housing, a printed circuit board assembly supported within the housing, an optical module supported on the printed circuit board assembly that converts between optical signals and electrical signals for transmitting or receiving optical signals through a fiber optic cable, a board-to-board connector on a rear panel of the housing that enables electrical signals to be transmitted between the printed circuit board assembly and a main switch system box, and an external connector on a front panel of the housing that can engage an external optical fiber for transmitting optical signals between the optical module and an external component.

Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Abstract: A compact, low-loss and wavelength insensitive Y-junction for submicron silicon waveguides. The design was performed using FDTD and particle swarm optimization (PSO). The device was fabricated in a 248 nm CMOS line. Measured average insertion loss is 0.28±0.02 dB across an 8-inch wafer. The device footprint is less than 1.2 ?m×2 ?m, orders of magnitude smaller than MMI and directional couplers.

Abstract: A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.