Patents Examined by Erimas Woldegeorgis
  • System and method for integrated circuit arrangement having a plurality of conductive structure levels
    Patent number: 8258628
    Abstract: An integrated circuit arrangement includes a substrate with a multiplicity of integrated semiconductor components arranged therein, the substrate having a wiring interconnect near to the substrate, a middle wiring interconnect and a wiring interconnect remote from the substrate, which are arranged in this order at increasing distance from the substrate.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: September 4, 2012
    Assignee: Infineon Technologies AG
    Inventors: Martina Hommel, Heinrich Koerner, Markus Schwerd, Martin Seck