Abstract: Methods for fabrication of microfluidic systems on printed circuit boards (PCB) are described. The PCB contains layers of insulating material and a layer or layers of metal buried within layers of insulating material. The metal layers are etched away, leaving fully enclosed microfluidic channels buried within the layers of insulating material.
Type:
Grant
Filed:
October 1, 2009
Date of Patent:
April 9, 2013
Assignee:
California Institute of Technology
Inventors:
Christopher I. Walker, Aditya Rajagopal, Axel Scherer