Patents Examined by Erin Berner
  • Patent number: 8414785
    Abstract: Methods for fabrication of microfluidic systems on printed circuit boards (PCB) are described. The PCB contains layers of insulating material and a layer or layers of metal buried within layers of insulating material. The metal layers are etched away, leaving fully enclosed microfluidic channels buried within the layers of insulating material.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: April 9, 2013
    Assignee: California Institute of Technology
    Inventors: Christopher I. Walker, Aditya Rajagopal, Axel Scherer