Abstract: An afocal sensor assembly detects a light beam with an aberrated wavefront. The afocal sensor assembly is configured to provide sorted four-dimensional (4D) light field information regarding the light beam, for example, via one or more plenoptic images. Based on the 4D light field information, a lossy reconstruction of an aberrated wavefront for one or more actuators of an adaptive optics (AO) device is performed. The AO device can be controlled based on the lossy reconstruction to correct the wavefront of the light beam. In some embodiments, the aberrated wavefront is due to passage of the light beam through atmospheric turbulence, and the lossy reconstruction and correction using the AO device is performed in less than 1.0 ms. The lossy reconstruction of the aberrated wavefront can have a phase accuracy in a range of ?/2 to ?/30.

Abstract: Image intensifier systems incorporating a microchannel plate (MCP) and methods for producing the same are disclosed. In some examples, a device is disclosed that includes a first substrate having a radiation-receiving first surface and an opposed second surface through which electromagnetic radiation is transmitted. A second substrate is coupled to the first substrate to define a vacuum cavity therebetween. An electron-emitting photocathode is disposed within the vacuum cavity for generating electrons from electromagnetic radiation transmitted through the second surface. A microchannel plate is disposed within the vacuum cavity and defines microchannels extending from an input end to an output end. Each of the microchannels is configured to generate electrons in response to an electron generated by the photocathode being received through the input end of the respective microchannel.

Abstract: A presence detection system includes a presence detection field of an amusement park attraction, multiple transmitters, multiple receivers, and a controller. The multiple transmitters send multiple light beams of multiple wavelengths and the multiple receivers receive the multiple light beams of the multiple wavelengths. The controller receives input from the multiple transmitters and receivers and determines presence of an object in the presence detection field based on an interruption of the multiple light beams as indicated by the input. The controller also determines reflected light beams of the multiple wavelengths, absorbed light beams of the multiple wavelengths, or both, based on the input. The controller determines the object as a known object or an unknown object based at least in part on the reflected light beams, the absorbed light beams, or both.

Abstract: Techniques for realizing compound semiconductor (CS) optoelectronic devices on silicon (Si) substrates for mobile applications are disclosed. The integration platform is based on heteroepitaxy of CS materials and device structures on Si by direct heteroepitaxy on planar Si substrates or by selective area heteroepitaxy on dielectric patterned Si substrates. Following deposition of the CS device structures, device fabrication steps can be carried out using Si complimentary metal-oxide semiconductor (CMOS) fabrication techniques to enable large-volume manufacturing. The integration platform can enable manufacturing of optoelectronic devices including photodetector arrays for image sensors and vertical cavity surface emitting laser arrays.

Abstract: An integrated circuit (IC) device includes a controller circuitry having an input connected to a photodiode of an optoelectronic circuitry and an output connected to a biasing circuitry, the biasing circuitry having an input connected to the output of the controller circuitry, the controller circuitry configured to transmit a transimpedance control signal code to the biasing circuitry configured to cause the biasing circuitry to offset a DC current component of the output of the photodiode.

Abstract: An image sensor includes: a sensor substrate including a plurality of first pixels configured to sense light of a first wavelength and a plurality of second pixels configured to sense light of a second wavelength; and an anti-reflection element provided on the sensor substrate, wherein the anti-reflection element includes a plurality of low-refractive index patterns and a high-refractive index layer provided between the plurality of low-refractive index patterns and the sensor substrate.

Abstract: An apparatus is disclosed herein. The apparatus comprises a non-linear photonic element for outputting a signal and idler photon pair. The apparatus further comprises a module configured to, based on receiving one or more control signals, controllably store photons and controllably output stored photons. The apparatus further comprises a detector arrangement comprising one or more detectors for detecting light. The module is further configured to receive at least one of the signal and idler photons of the pair. The module is further configured to at least partially store one of the signal or idler photons of the pair. The module is further configured to output the said at least partially stored signal or idler photon along an optical path towards the at least one detectors. The apparatus is configured to direct the other of the signal or idler photon towards the detector arrangement.

Abstract: Provided is an image sensor including a sensor chip including a first substrate and a first interconnection layer, a logic chip including a second substrate and a second interconnection layer, a through-hole penetrating a portion of the second interconnection layer, the first substrate, and the first interconnection layer, and a first connection structure disposed on an inner surface of the through-hole and extending from the first substrate toward the second interconnection layer, wherein the first interconnection layer includes a first interlayer insulating layer and a first interconnection pattern, the second interconnection layer includes a second interlayer insulating layer and a second interconnection pattern, the through-hole includes first and second trenches respectively extending from the through-hole toward the second interconnection layer, bottom surfaces of the first and second trenches contact the second interconnection pattern, and a bottom surface of the through-hole contacts the first interco

Abstract: The present disclosure is directed to irradiance sensing devices and methods. One such device includes a housing and an optical diffuser coupled to the housing. The housing has an opening that extends into the housing from an outer surface, and the opening has a circular shape at the outer surface of the housing. The optical diffuser has a first region that extends at least partially beyond the outer surface of the housing and a second region housed within the housing. The first region of the optical diffuser has a curved surface, and the optical diffuser includes a cavity extending at least partially into the second region.

Abstract: An imaging device that includes a semiconductor substrate; a first photoelectric converter that is located in the semiconductor substrate and that generates a first signal charge by photoelectric conversion; a first node to which the first signal charge is input; a capacitor having a first terminal coupled to the first node; a second photoelectric converter that is located in the semiconductor substrate and that generates a second signal charge by photoelectric conversion; a second node to which the second signal charge is input; a transistor having a gate coupled to the second node; and a switch element coupled between the first node and the second node, where a number of saturation charges of a first imaging cell including the first photoelectric converter and the capacitor is greater than a number of saturation charges of a second imaging cell including the second photoelectric converter.

Abstract: An infrared sensing module includes a reflecting portion, a driving portion, an infrared light emitter and an infrared light receiver. The driving portion is connected to the reflecting portion, and the driving portion drives the reflecting portion to rotate, and an infrared reflecting layer of the reflecting portion faces the infrared light emitter and the infrared light receiver when the reflecting portion rotates to a preset position.

Abstract: Optical sensors and particularly gimbaled optical sensors transmit an active signal at a given wavelength(s) and receive passive signals over a range of wavelengths and the active signal in a common aperture. The sensor includes a Tx/Rx Aperture Sharing Element (ASE) configured with a center region that couples the active signal to the telescope for transmission and an annular region that couples the passive emissions and the returned active signal to the detector. A filter wheel may be positioned behind the ASE to present separate passive and active images to the detector. These optical sensors may, for example, be used with guided munitions or autonomous vehicles.

Abstract: A cleaning device for a lidar sensor set-up. The cleaning device includes a movable cleaning element, and is configured, for a cleaning operation, to move the cleaning element over a window of the lidar sensor set-up, on a side facing away from the lidar sensor device and facing the field of view of the lidar sensor set-up. The movable cleaning element has an optical element. The optical element is configured to send back and, in particular, reflect back primary light from a transmitting path of the lidar sensor set-up, which is incident upon the optical element, into a receiving path of the lidar sensor set-up.

Abstract: A time-of-flight (ToF) image sensor system includes a pixel array, where each pixel of the pixel array is configured to receive a reflected modulated light signal and to demodulate the reflected modulated light signal to generate an electrical signal; a plurality of analog-to-digital converters (ADCs), where each ADC is coupled to at least one assigned pixel of the pixel array and is configured to convert a corresponding electrical signal generated by the at least one assigned pixel into an actual pixel value; and a binning circuit coupled to the plurality of ADCs and configured to generate at least one interpolated pixel, where the binning circuit is configured to generate each of the at least one interpolated pixel based on actual pixel values corresponding to a different pair of adjacent pixels of the pixel array, each of the at least one interpolated pixel having a virtual pixel value.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. To mitigate crosstalk, an isolation structure may be formed in a ring around the SPAD. The isolation structure may be a hybrid isolation structure with both a metal filler that absorbs light and a low-index filler that reflects light. The isolation structure may be formed as a single trench or may include a backside deep trench isolation portion and a front side deep trench isolation portion. The isolation structure may also include a color filtering material.

Abstract: A system and method for maintaining a laser impinging on a laser detector assembly includes determining a location of the laser from a rotating laser transmitter impinging on a laser sensor. A current position of the laser sensor along a mast of the laser detector assembly is determined and a new position for the laser sensor along the mast is determined based on the location of the laser impinging on the laser sensor and a current position of the laser sensor. The laser sensor is then moved to the new position. The system and method provide an effectively long working range of the laser detector assembly by moving the laser sensor along the mast of the laser detector assembly. An inertial measurement unit is used to calculate position information in the period between laser strikes.

Abstract: An electronic device includes a photodiode, a switching circuit, a readout circuit, and an energy storage device. The photodiode includes a first terminal and a second terminal and is configured to generate a signal according to a light. The switching circuit is electrically connected to the first terminal and the second terminal. When the electronic device operates in a sensing mode, the switching circuit electrically isolates the photodiode from the energy storage device so that the signal is provided to the readout circuit. When the electronic device operates in a charging mode, the switching circuit electrically connects the photodiode to the energy storage device so that the signal is provided to the energy storage device.

Abstract: Provided is an image sensor including a sensor substrate including a first photo-sensing cell and a second photo-sensing cell configured to sense light, a spacer layer that is transparent and disposed on the sensor substrate, and a color separating lens array disposed on the spacer layer and including a first region disposed opposite to the first photo-sensing cell in a vertical direction and having a first pattern, and a second region disposed opposite to the second photo-sensing cell in the vertical direction and having a second pattern that is different from the first pattern, and wherein the first pattern is configured to separate, from incident light, a first wavelength light and condense the first wavelength light to the first photo-sensing cell, and the second pattern is configured to separate, from the incident light, a second wavelength light and condense the second wavelength light to the second photo-sensing cell.

Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.

Abstract: For example, analog pixel circuitry may include a first input to input an analog pixel signal of the pixel; Sample and Hold (SH) circuitry to provide an analog sample of the pixel based on the analog pixel signal; one or more second inputs to input analog samples of one or more binning pixels, respectively; a plurality of capacitors having capacitor outputs connected to a common output terminal, wherein a capacitor input of a first capacitor is connected to an input terminal to input the analog sample of the pixel from the SH circuitry, wherein capacitor inputs of one or more second capacitors are connected to the one or more second inputs, respectively; and an amplifier configured to provide an amplified analog signal by amplifying an analog signal from the common output terminal.