Patents Examined by Fang-Xiang Jiang
  • Integrated circuit package having bottom-side stiffener
    Patent number: 8952511
    Abstract: Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: February 10, 2015
    Assignee: Intel Corporation
    Inventors: Ajit V. Sathe, Mat J. Manusharow, Tong Wa Chao