Patents Examined by Fazu Erden
  • Semiconductor integrated circuit
    Patent number: 6727596
    Abstract: Bump areas for signals are spread on upper and lower positions with respect to Vdd and Vss lines in an I/O buffer. Thus, the direction of routing the lines from bumps for signals to the I/O buffers is spread in two directions. A greater number of I/O buffers can be accommodated without increasing the size of a semiconductor integrated circuit.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: April 27, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tsutomu Takabayashi, Shizuo Morizane