Abstract: A silicone gel sheet is heat-molded from a silicone gel composition comprising metal oxide magnetic particles and a thermoconductive filler. The sheet has a high electromagnetic wave absorbing property at a frequency ranging from 500 to 800 MHz. The hardness of the composition after hardening treatment is set in the range of 10-95 when measured with an ASKER F-type hardness meter. The metal oxide magnetic particles used here can be either Mn—Zn ferrite or Ni—Zn ferrite whose average particle diameter is 1-50 &mgr;m. For the thermoconductive filler, a metal oxide, aluminum nitride, boron nitride, silicon nitride, or silicon carbide can be used. In the silicone gel molded sheet, an electroconductive mesh is embedded in one surface layer of the silicone gel layers while the other surface is provided with adhesiveness.

Abstract: The present invention provides an infrared ray blocking transparent film which can be produced at low cost despite using indium tin oxide powder (which can inhibit metallic luster) and which can exhibit excellent electromagnetic wave transmissivity. An infrared ray blocking layer is provided on at least a surface of a base film, and the infrared ray blocking layer includes indium tin oxide powder and resin in a weight ratio of 90/10 to 60/40.

Abstract: Pressure-sensitive adhesives comprising an aqueous polymer dispersion wherein the polymer is composed of from 60 to 95% by weight of a mixture comprising at least one C4-alkyl acrylate and at least one C6-C12-alkyl acrylate (monomers a) from 5 to 30% by weight of ethylenically unsaturated com- pounds having a glass transition temperature of above 0° C.

Abstract: A pressure sensitive adhesive film having a film and a pressure sensitive adhesive composition of a polymer prepared by polymerization of acrylic or methacrylic monomer in the presence of a polymerization initiator having no cyano group and/or a polymer prepared by graft polymerization of acrylic or methacrylic monomer with an elastomer in the presence of a polymerization initiator having no cyano group is favorably employable for packaging photographic materials.

Abstract: Disclosed is a heat-sealable adhesive label with a built-in spacer and methods of its manufacture. The adhesive label of the present invention includes a substrate having a first surface and a second surface, and an adhesive coating disposed on the first surface of the substrate. The adhesive coating includes an adhesive and a plurality of spacer particles that impart roughness to the adhesive coating. Methods of making and using a heat-sealable adhesive label also are disclosed.

Abstract: The present invention provides a heat-conductive and pressure-sensitive adhesive sheet comprising an electrical insulating plastic film having formed on one or both of the surfaces thereof (1) at least one thin layer composed of an inorganic material selected from the group consisting of ceramics, metals and metal oxides other than ceramics, and (2) a pressure-sensitive adhesive composition layer formed on the thin layer. The heat-conductive and pressure-sensitive adhesive sheet is excellent in heat-conductivity and pressure-sensitivity, results in no trouble such as complicated procedures in the production process or worsened working environment, exhibits good adhesion between the base material and the pressure-sensitive adhesive composition layer, scarcely undergoes anchoring fracture between the base material even after allowing to stand at high temperatures for a long time, and has good heat resistance.

Abstract: This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.