Abstract: Apparatus for mounting TO-220 solid state device packages on a heat sink. Each package includes an electrically conductive, heat dissipating, heat sinking tab which is common with one of the electrical terminals, and a resin case. The heat sinking tab includes an opening therethrough intended to be used in mounting the package to a heat sink. The apparatus comprises a printed circuit board mounted to the heat sink. An opening is provided in the board. The devices are adapted to be oriented during mounting so that they overlie the opening with their heat sinking tab sides facing toward the opening and their resin case sides facing away from the opening. A first bar of thermally conductive material is adapted to be positioned between the heat sink and the heat sinking tab sides of the packages and extending through the opening. A layer of electrically insulative and thermally conductive material is interposed between the bar and the heat sinking tab sides of the packages.

Abstract: A method for mounting an integrated circuit or chip (10) on a printed circuit board (11), the chip package (36) produced thereby, and a tape carrying chips for using the method are proposed. The chip is mounted by fixing its leads (12) on the zones (13) of the board (11) by securing the chip between a support board (15) and a heat dissipating element (14) that are connected with one another by conductive columns (16) to form the package (36). The invention is applicable in particular to manufacture of very large scale integration (VSLI) chips.

Abstract: A component mounting for use in mounting device a component to a panel member therethrough, which comprises a centrally opened frame having at least one carrier arm extending from the frame in a direction substantially perpendicular to the plane of the central opening in the frame. The carrier arm carries a clamp member for movement therealong, and the clamp member has an internally threaded screw receiving hole defined therein for engagement with a set screw that has been freely passed through a hole in the component. After the mounting device has been inserted in a mounting hole in the panel member and the set screw has been threaded into the screw receiving hole, the clamp member is drawn along the carrier arm close towards the panel member thereby clamping the panel member between it and the frame.