Abstract: Contact designs for leadless chip carrier sockets of either the surface compression or the solder type. The contact for a compression type socket employs a dual cantilever configuration mounted on a base member which mechanically isolates one portion of the contact from another. Two cooperative contact designs are used for a solder type socket in which each type is alternately arranged with respect to the other in mounted relationship on a base member. The upper chip carrier contacting portions of the two contacts for a solder type socket are disposed side-by-side along each side wall, while the terminal ends are aligned inwardly perpendicular to the upper alignment.